Abstract: A power converter includes first and second components on which male and female fitting members of each of a plurality of pairs of fitting members are arranged, with a pair of first alignment keys formed in the first and second components as reference positions. The first and second components are coupled to each other by the female fitting member clamping an insertion portion of the male fitting member inserted between first and second clamping portions of the female fitting member arranged so as to face each other in a state where the pair of first alignment keys are positionally aligned. The first and second clamping portions are each bent so as to form one of protrusions toward one of surfaces thereof facing each other. A gap is formed in a distal end portion of each of the first and second clamping portions.

Abstract: An electric power converter includes a first board, a second board, and a first board-to-board connector that electrically and mechanically connects the first board and the second board. The first board-to-board connector includes a male fitting member and a female fitting member. Each of a first clamp portion and a second clamp portion of the female fitting member includes a first contact forming portion and a second contact forming portion that are curved in a protruding shape, and a first spring portion and a second spring portion that are connected to the first contact forming portion and the second contact portion, respectively, and that are curved in corrugated shapes. An insert clamped between the first contact forming portion and the second contact forming portion forms an electrical contact, and the first spring portion and the second spring portion are independently deformable.

Abstract: A power conversion device includes: circuit boards; at least one engagement member configured to engage a male engagement member with a female engagement member to allow the circuit boards to be electrically connected, the male engagement member being connected to one of the circuit boards and having a substantially flat plate-shaped insertion portion, the female engagement member being connected to another of the circuit boards and having first and second clamping portions disposed to face each other, and the engagement of the engagement members being made by clamping the insertion portion by the clamping portions; a differential amplifier configured to measure a voltage across the engagement member; an arithmetic unit configured to estimate a resistance value of the engagement member based on the measured voltage; and a power conversion circuit controller configured to perform notification on condition that the estimated resistance value exceeds a resistance threshold.

Abstract: A mounting pedestal on which a heat generating component is disposed is provided. The mounting pedestal includes a substrate which includes a plurality of bending portions at which the substrate is bent in a staircase shape. An insulating layer is disposed on a surface of the substrate. An interconnecting line is disposed on the insulating layer. In the mounting pedestal, the interconnecting line extends across the plurality of bending portions. In each of the plurality of bending portions, a corner radius (R) of a mountain portion is greater than a corner R of a valley portion.

Abstract: A mounting pedestal on which a heat generating component is disposed is provided. The mounting pedestal includes a substrate which includes a plurality of bending portions at which the substrate is bent in a staircase shape. An insulating layer is disposed on a surface of the substrate. An interconnecting line is disposed on the insulating layer. In the mounting pedestal, the interconnecting line extends across the plurality of bending portions. In each of the plurality of bending portions, a corner radius (R) of a mountain portion is greater than a corner R of a valley portion.

Abstract: To provide an ink composition for a water-based ballpoint pen, having properties such as excellent writing stability in which writing failure such as starving does not occur. Disclosed is an ink composition for a water-based ballpoint pen, including an aqueous phase, and an oil phase contained in the aqueous phase in a state of an oil-in-water type emulsion, wherein the oil phase, or the oil phase and the aqueous phase contains a colorant, and the oil phase contains, in components composing the oil phase, a fatty acid having 6 to 22 carbon atoms.

Abstract: Provided is a novel ink composition for a ballpoint pen such that the ink composition combines the strength of water-based ink for ballpoint pens and oil-based ink for ballpoint pens. Specifically provided is a water-based ink composition for ballpoint pens, wherein an oily phase containing an oily solution obtained by dissolving a dye in an organic solvent is contained, as an oil-in-water emulsion, in an aqueous phase comprising a pigment dispersant.

Abstract: In a method of manufacturing a circuit forming board, a first sheet having a first direction is transferred in a second direction, so that the first direction of the first sheet is parallel to the second direction. Films are stuck onto both surfaces of the first sheet while transferring the first sheet in a third direction orthogonal to the first direction of the first sheet. This method allows a connecting member, such as conductive paste, to electrically couple between layers of the circuit forming board.

Abstract: A method of manufacturing a multi-layer circuit board including preparing a laminated member formed of (i) a core circuit board having a circuit pattern thereon and (ii) a prepreg sheet having a through-hole filled with conductive paste, forming a laminated structure such that the laminated member is sandwiched by lamination plates, and applying heat and pressure to the laminated structure. According to this method, selecting a lamination plate that has a thermal expansion coefficient that is equivalent to that of a core circuit board will protect the conductive paste from distortion, thereby offering a high-quality multi-layer circuit board having a reliable connection resistance.

Abstract: An intermediate material which is adapted to manufacture a circuit board includes a prepreg sheet having a through-hole provided therein, a first film provided on a surface of the prepreg sheet and having a first hole communicating with the through-hole, a second film provided on another surface of the prepreg sheet and having a second hole communicating with the through-hole, and a conductive paste filling the though-hole, the first hole, and the second hole. The thickness t1 of the prepreg sheet, the minimum diameter rmin of the through-hole, the thickness tf1 of the first film, the diameter rf1 of the first hole, the thickness tf2 of the second film, the diameter rf2 of the second hole satisfy a relation: rf1/tf1?3, rf2/tf2?3, and rmin/(t1+tf1+tf2)?1.5. This intermediate material provides a circuit board having a fine via-conductor connected to a metal foil securely and stably.

Abstract: After disposing metallic foils on either surface of a prepreg sheet of low compressibility having conducting holes filled with conductive paste, the prepreg sheet is compressed in a state of being kept at a relatively low temperature, and after that, the temperature is raised under pressure to melt and harden the resin in the prepreg sheet, and thereby, the connecting resistance is stabilized, and a high-quality circuit board can be obtained.

Abstract: An intermediate material which is adapted to manufacture a circuit board includes a prepreg sheet having a through-hole provided therein, a first film provided on a surface of the prepreg sheet and having a first hole communicating with the through-hole, a second film provided on another surface of the prepreg sheet and having a second hole communicating with the through-hole, and a conductive paste filling the though-hole, the first hole, and the second hole. The thickness t1 of the prepreg sheet, the minimum diameter rmin of the through-hole, the thickness tf1 of the first film, the diameter rf1 of the first hole, the thickness tf2 of the second film, the diameter rf2 of the second hole satisfy a relation: rf1/tf1?3, rf2/tf2?3, and rmin/(t1+tf1+tf2)?1.5. This intermediate material provides a circuit board having a fine via-conductor connected to a metal foil securely and stably.

Abstract: A method of manufacturing a multi-layer circuit board having the following steps: preparing a laminated member formed of a core circuit board having a circuit pattern thereon and a prepreg sheet having a through-hole filled with conductive paste; forming a laminated structure in a manner that the laminated member is sandwiched by lamination plates; and applying heat and pressure to the laminated structure. According to the method, selecting a lamination plate so as to have thermal expansion coefficient equivalent to that of a core circuit board can protect conductive paste from distortion, thereby offering a high-quality multi-layer circuit board with reliable connection resistance.

Abstract: A circuit board with reliable electrical connections is provided. An insulated board material, having connections for connecting a layer to another layer, includes a reinforcing member. A thickness of the entire insulated board material is at least equal to and not more than 1.5 times of a thickness of the reinforcing member.

Abstract: A pre-preg sheet includes a substrate and a resin impregnated in the substrate. A first metal foil is placed on the pre-preg sheet to provide a laminated body. The laminated body is put in a heating device having a temperature maintained at a temperature close to a softening temperature of the resin. The laminated body is compressed at the temperature at a predetermined pressure. The first metal foil is bonded to the pre-preg sheet of the laminated body and hardening the resin, thus providing a circuit board. This method provides a stable resistance of a conductive paste filing a through-hole in the pre-preg sheet to be compressed at a small rate.

Abstract: After disposing metallic foils on either surface of a prepreg sheet of low compressibility having conducting holes filled with conductive paste, the prepreg sheet is compressed in a state of being kept at a relatively low temperature, and after that, the temperature is raised under pressure to melt and harden the resin in the prepreg sheet, and thereby, the connecting resistance is stabilized, and a high-quality circuit board can be obtained.

Abstract: After disposing metallic foils on either surface of a prepreg sheet of low compressibility having conducting holes filled with conductive paste, the prepreg sheet is compressed in a state of being kept at a relatively low temperature, and after that, the temperature is raised under pressure to melt and harden the resin in the prepreg sheet, and thereby, the connecting resistance is stabilized, and a high-quality circuit board can be obtained.

Abstract: A circuit board including a desired number of electrically insulating layers and wiring layers laminated alternately, and an inner via hole for securing an electrical connection between the wiring layers by compressing and hardening a conductive paste including a conductive particle and a resin. In the electrically insulating layer, a porous sheet is provided a resin sheet at least one surface, and the porous sheet is not impregnated with a resin at least at a central portion. A through hole penetrating the electrically insulating layer in the direction of the thickness of the electrically insulating layer is filled with a conductive paste including a conductive particle and a resin, and pores that are present inside the porous sheet are filled with laminated resin. The average hole diameter of the pores inside the porous sheet may be smaller than the average particle size of the conductive particle.

Abstract: A compression function layer 60 is provided on at least one board surface. The compression function layer 60 adds a function of being compressed by receiving pressure in the direction of the board thickness to the resin board 10 which includes this layer. Thereby a sufficient pressure is applied to conductors 14.

Abstract: A compression function layer 60 is provided on at least one board surface. The compression function layer 60 adds a function of being compressed by receiving pressure in the direction of the board thickness to the resin board 10 which includes this layer. Thereby a sufficient pressure is applied to conductors 14.