Abstract: An imaging lens unit configured for processing by a solder reflow process, and includes a lens group of one or more lenses; and a lens tube supporting the lens group. The imaging lens unit comprises one or more cationically-cured epoxy resin lenses formed from an cationically-curable epoxy resin material, the lens tube is formed from a thermoplastic resin material having a deflection temperature under load of at least 200° C. The imaging lens unit has a clearance between the lens tube and at least one of the cationically-cured epoxy resin lenses and has lens supporting portions provided at least three locations inside the lens tube that support the at least one cationically-cured epoxy resin lens. The lens unit can be miniaturized. The imaging lens unit also provides excellent optical characteristics without deteriorating the optical characteristics in alignment of the centers of the lens and the diaphragm.

Abstract: The present invention provides an imaging lens unit configured to be processed by the solder reflow process, can be miniaturized, and has sufficient thermal resistance for the reflow temperatures. The imaging lens unit also provides excellent optical characteristics such as transmissivity, a refractive index, and the like without deteriorating the optical characteristics in alignment of the centers of the lens and the diaphragm even after the reflow process, so as to contribute to reduction in the size and an increase in the capabilities. The imaging lens unit is configured to be processed by a solder reflow process, and includes a lens group consisting of one or more lenses; and a lens tube that supports the lens group, wherein the imaging lens unit comprises one or more cationically-cured epoxy resin lenses formed from an cationically-curable epoxy resin material, the lens tube is formed from a thermoplastic resin material having a deflection temperature under load of not lower than 200° C.

Abstract: A high-frequency module has a structure wherein transmitting filters, receiving filters and high-frequency power amplifiers are mounted on a multilayered substrate and wherein matching circuits are inserted between input terminals of the receiving filters and output terminals of the transmitting filters. Transmission lines as components of the matching circuits, and the like are formed internally of the multilayered substrate. Thus, the whole body of the high-frequency module can be downsized.

Abstract: A high-frequency module has a structure wherein transmitting filters, receiving filters and high-frequency power amplifiers are mounted on a multilayered substrate and wherein matching circuits are inserted between input terminals of the receiving filters and output terminals of the transmitting filters. Transmission lines as components of the matching circuits, and the like are formed internally of the multilayered substrate. Thus, the whole body of the high-frequency module can be downsized.