Patents by Inventor Yoshihiro Nakai

Yoshihiro Nakai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210129509
    Abstract: There is provided a composition for a laminated material used for a medical lubricating member, the composition including a polymer b including a polysiloxane structure, a catalyst for crosslinking reaction, and a crosslinking agent having a particular structure. The polymer b includes at least one of an acrylic acid component, an acrylic acid ester component, an acrylamide component, or a styrene component and has a hydroxy group, a carboxy group, an amino group, an isocyanate group, an oxazolinyl group, an epoxy group, a vinyl group, an ethynyl group, a sulfanyl group, an azide group, a trialkoxysilyl group, or an acid anhydride structure. There are also provided a laminated material and a medical lubricating member produced from the composition, a medical device including the laminated material and the medical lubricating member, and a method for producing the laminated material and the medical lubricating member.
    Type: Application
    Filed: January 13, 2021
    Publication date: May 6, 2021
    Applicant: FUJIFILM Corporation
    Inventors: Yoshihiro NAKAI, Sotaro INOMATA
  • Publication number: 20210134475
    Abstract: An aluminum alloy contains equal to or more than 0.005 mass % and equal to or less than 2.2 mass % of Fe, and a remainder of Al and an inevitable impurity. In a transverse section of the aluminum alloy wire, a surface-layer void measurement region in a shape of a rectangle having a short side length of 30 ?m and a long side length of 50 ?m is defined within a surface layer region extending from a surface of the aluminum alloy wire by 30 ?m in a depth direction, and a total cross-sectional area of voids in the surface-layer void measurement region is equal to or less than 2 ?m2.
    Type: Application
    Filed: December 21, 2020
    Publication date: May 6, 2021
    Applicants: Sumitomo Electric Industries, Ltd, AutoNetworks Technologies, Ltd, Sumitomo Wiring Systems, Ltd
    Inventors: Misato KUSAKARI, Tetsuya KUWABARA, Yoshihiro NAKAI, Taichiro NISHIKAWA, Yasuyuki OTSUKA, Hayato OOI
  • Publication number: 20210106210
    Abstract: Provided are an adhesive for an endoscope, a cured product of the adhesive for an endoscope, an endoscope produced using the adhesive for an endoscope, and a method for producing an endoscope. The adhesive for an endoscope includes at least one epoxy resin (A) selected from the group consisting of bisphenol A epoxy resins, bisphenol F epoxy resins, and phenol novolac epoxy resins, a polyamine compound (B), and a specific compound (C) having an epoxy group.
    Type: Application
    Filed: December 3, 2020
    Publication date: April 15, 2021
    Applicant: FUJIFILM Corporation
    Inventors: Yoshihiro NAKAI, Kazushi FURUKAWA
  • Publication number: 20210110947
    Abstract: An aluminum alloy contains at least 0.03 mass % and at most 1.5 mass % of Mg, at least 0.02 mass % and at most 2.0 mass % of Si, and a remainder composed of Al and an inevitable impurity, a mass ratio Mg/Si being not lower than 0.5 and not higher than 3.5. In a transverse section of the aluminum alloy wire, a rectangular surface-layer void measurement region having a short side of 30 ?m long and a long side of 50 ?m long is taken from a surface-layer region extending by up to 30 ?m in a direction of depth from a surface of the aluminum alloy wire. A total cross-sectional area of voids present in the surface-layer void measurement region is not greater than 2 ?m2.
    Type: Application
    Filed: December 23, 2020
    Publication date: April 15, 2021
    Applicants: Sumitomo Electric Industries, Ltd., AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd.
    Inventors: Misato KUSAKARI, Tetsuya KUWABARA, Yoshihiro NAKAI, Taichiro NISHIKAWA, Yasuyuki OTSUKA, Hayato OOI
  • Patent number: 10973392
    Abstract: Provided are an adhesive for an endoscope, a cured product, an endoscope, and a method for producing an endoscope. The adhesive for an endoscope is a two-component adhesive for an endoscope. The two-component adhesive has a base and a curing agent. The base includes at least one epoxy resin (A) selected from the group consisting of bisphenol A epoxy resins, bisphenol F epoxy resins, and phenol novolac epoxy resins. The curing agent includes a tertiary amine compound (B). The tertiary amine compound (B) accounts for 60 mass % or more of a curing component included in the curing agent.
    Type: Grant
    Filed: February 26, 2020
    Date of Patent: April 13, 2021
    Assignee: FUJIFILM Corporation
    Inventors: Kazushi Furukawa, Toshihide Yoshitani, Yoshihiro Nakai
  • Publication number: 20210044083
    Abstract: A buried semiconductor optical device comprises a semiconductor substrate; a mesa-stripe portion including a multi-quantum well layer on the semiconductor substrate; a buried layer consisting of a first portion and a second portion, the first portion covering one side of the mesa-stripe portion, the second portion covering the other side of the mesa-stripe portion, and the first portion and the second portion covering a surface of the semiconductor substrate; and an electrode configured to cause an electric current to flow through the mesa-stripe portion, the buried layer comprising, from the surface of the semiconductor substrate, a first sublayer, a second sublayer, and a third sublayer, the first sublayer, the second sublayer, and the third sublayer each consisting of semi-insulating InP, the first sublayer and the second sublayer forming a pair structure, the second sublayer being located above the multi-quantum well layer from the surface of the semiconductor substrate, and the second sublayer consisting
    Type: Application
    Filed: April 10, 2020
    Publication date: February 11, 2021
    Inventors: Shigenori HAYAKAWA, Hironori SAKAMOTO, Shunya YAMAUCHI, Yoshihiro NAKAI
  • Patent number: 10910125
    Abstract: An aluminum alloy contains at least 0.03 mass % and at most 1.5 mass % of Mg, at least 0.02 mass % and at most 2.0 mass % of Si, and a remainder composed of Al and an inevitable impurity, a mass ratio Mg/Si being not lower than 0.5 and not higher than 3.5. In a transverse section of the aluminum alloy wire, a rectangular surface-layer void measurement region having a short side of 30 ?m long and a long side of 50 ?m long is taken from a surface-layer region extending by up to 30 ?m in a direction of depth from a surface of the aluminum alloy wire. A total cross-sectional area of voids present in the surface-layer void measurement region is not greater than 2 ?m2.
    Type: Grant
    Filed: April 4, 2017
    Date of Patent: February 2, 2021
    Assignees: Sumitomo Electric Industries, Ltd., AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd.
    Inventors: Misato Kusakari, Tetsuya Kuwabara, Yoshihiro Nakai, Taichiro Nishikawa, Yasuyuki Otsuka, Hayato Ooi
  • Patent number: 10910126
    Abstract: An aluminum alloy contains equal to or more than 0.005 mass % and equal to or less than 2.2 mass % of Fe, and a remainder of Al and an inevitable impurity. In a transverse section of the aluminum alloy wire, a surface-layer void measurement region in a shape of a rectangle having a short side length of 30 ?m and a long side length of 50 ?m is defined within a surface layer region extending from a surface of the aluminum alloy wire by 30 ?m in a depth direction, and a total cross-sectional area of voids in the surface-layer void measurement region is equal to or less than 2 ?m2.
    Type: Grant
    Filed: April 4, 2017
    Date of Patent: February 2, 2021
    Assignees: Sumitomo Electric Industries, Ltd., AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd.
    Inventors: Misato Kusakari, Tetsuya Kuwabara, Yoshihiro Nakai, Taichiro Nishikawa, Yasuyuki Otsuka, Hayato Ooi
  • Publication number: 20210007579
    Abstract: Provided are a two-component adhesive for an endoscope and a cured product thereof, the adhesive having a base resin and a curing agent. The base resin contains an epoxy resin (A), and the epoxy resin (A) includes an epoxy resin (a) having an average degree of polymerization of 2 or more. Also provided are an endoscope produced by using the adhesive for an endoscope and a method for producing the endoscope.
    Type: Application
    Filed: July 23, 2020
    Publication date: January 14, 2021
    Applicant: FUJIFILM Corporation
    Inventors: Kazushi FURUKAWA, Yoshihiro NAKAI, Shigeki UEHIRA
  • Publication number: 20200405918
    Abstract: A flexible tube for an endoscope has a flexible tube substrate that is flexible and tubular and a resin layer (A) covering the flexible tube substrate. The resin layer (A) includes a thermoplastic resin (a) including at least one of a polyatnide resin, a polyurethane resin, a polyester resin, a polystyrene resin, or an acrylic resin and having a tensile strength at 10% elongation of 10 Pa or more and a hindered amine compound (b) having a molecular weight of 500 or more. Also provided are an endoscopic medical device including the flexible tube for an endoscope and a resin composition suitable for forming the resin layer of the flexible tube for an endoscope.
    Type: Application
    Filed: September 16, 2020
    Publication date: December 31, 2020
    Applicant: FUJIFILM Corporation
    Inventors: Yoshihiro NAKAI, Kazushi Furukawa
  • Publication number: 20200395143
    Abstract: An aluminum alloy wire composed of an aluminum alloy, wherein the aluminum alloy contains more than or equal to 0.03 mass % and less than or equal to 1.5 mass % of Mg, more than or equal to 0.02 mass % and less than or equal to 2.0 mass % of Si, and a remainder of Al and an inevitable impurity, Mg/Si being more than or equal to 0.5 and less than or equal to 3.5 in mass ratio, and the aluminum alloy wire has a dynamic friction coefficient of less than or equal to 0.8.
    Type: Application
    Filed: August 26, 2020
    Publication date: December 17, 2020
    Applicants: Sumitomo Electric Industries, Ltd., AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd.
    Inventors: Misato KUSAKARI, Tetsuya KUWABARA, Yoshihiro NAKAI, Taichiro NISHIKAWA, Yasuyuki OTSUKA, Hayato OOI
  • Publication number: 20200352449
    Abstract: Provided are a resin material that provides a resin shaped article (such as a resin sheet) having an acoustic impedance close to that of a living body, a reduced acoustic wave attenuation even at high frequencies (such as 10 MHz), and high hardness and high tear strength, and that is suitable as a lens material for acoustic wave probes; an acoustic lens, an acoustic wave probe, an acoustic wave determination device, an ultrasound diagnostic apparatus, a photo-acoustic wave determination device, and an ultrasonic endoscope that employ the above-described resin material as a constituent material; and a method for producing the above-described acoustic lens.
    Type: Application
    Filed: July 29, 2020
    Publication date: November 12, 2020
    Applicant: FUJIFILM Corporation
    Inventors: Yuzo NAGATA, Yoshihiro NAKAI, Shigeki UEHIRA
  • Publication number: 20200345327
    Abstract: Provided is an ultrasound probe that includes a shaft having an ultrasonic oscillator on a front end thereof and a sheath covering the shaft. The sheath includes a resin particle having a particle diameter of 0.1 to 100 ?m and a thermoplastic resin. Also provided is a resin composition suitable as a sheath material for the ultrasound probe.
    Type: Application
    Filed: July 15, 2020
    Publication date: November 5, 2020
    Applicant: FUJIFILM Corporation
    Inventor: Yoshihiro NAKAI
  • Patent number: 10822676
    Abstract: An aluminum alloy wire composed of an aluminum alloy, wherein the aluminum alloy contains more than or equal to 0.005 mass % and less than or equal to 2.2 mass % of Fe and a remainder of Al and an inevitable impurity, and the aluminum alloy wire has a dynamic friction coefficient of less than or equal to 0.8.
    Type: Grant
    Filed: August 28, 2017
    Date of Patent: November 3, 2020
    Assignees: Sumitomo Electric Industries, Ltd., AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd.
    Inventors: Misato Kusakari, Tetsuya Kuwabara, Yoshihiro Nakai, Taichiro Nishikawa, Yasuyuki Otsuka, Hayato Ooi
  • Publication number: 20200334981
    Abstract: A surrounding information obtaining unit determines whether a first vehicle has traveled on a different road than a road on which a host vehicle travels, on the basis of information indicating roads and a facility present around the host vehicle and a travel state of the first vehicle. A difference checking unit checks whether a target road determined to have been traveled by the first vehicle is included in host vehicle map information. A wireless communication unit inquires whether an unknown target road confirmed not to be included in the host vehicle map information is included in master map information in a server device. When the unknown target road is included in the master map information, the wireless communication unit receives updating map information including the unknown target road from the server device. A map updating unit updates the host vehicle map information using the updating map information.
    Type: Application
    Filed: December 12, 2017
    Publication date: October 22, 2020
    Applicant: Mitsubishi Electric Corporation
    Inventors: Nozomi YAMADA, Yoshihiro NAKAI
  • Publication number: 20200328575
    Abstract: An optical semiconductor device includes a semiconductor substrate; a plurality of mesa stripes, which are arranged side by side on the semiconductor substrate, and each of which includes an active layer and a diffraction grating, the diffraction grating extending up to a back end surface of each of the plurality of mesa stripes; a plurality of electrodes, each of which is electrically connected to an upper surface of a corresponding one of the plurality of mesa stripes, having a pad portion for wire bonding; a plurality of waveguides, each of which is optically connected to the active layer of a corresponding one of the plurality of mesa stripes; and a reflective film provided at back end surfaces of the plurality of mesa stripes and having a reflectivity of 30% or more, wherein a center-to-center distance at back end surfaces of two mesa stripes at both ends of the plurality of mesa stripes is 150 ?m or less, and wherein at least two mesa stripes, of the plurality of mesa stripes, are configured to be drive
    Type: Application
    Filed: March 30, 2020
    Publication date: October 15, 2020
    Inventors: Atsushi NAKAMURA, Akira NAKANISHI, Shunya YAMAUCHI, Hayato TAKITA, Yoshihiro NAKAI, Hideaki ASAKURA
  • Patent number: 10796811
    Abstract: An aluminum alloy wire composed of an aluminum alloy, wherein the aluminum alloy contains more than or equal to 0.03 mass % and less than or equal to 1.5 mass % of Mg, more than or equal to 0.02 mass % and less than or equal to 2.0 mass % of Si, and a remainder of Al and an inevitable impurity, Mg/Si being more than or equal to 0.5 and less than or equal to 3.5 in mass ratio, and the aluminum alloy wire has a dynamic friction coefficient of less than or equal to 0.8.
    Type: Grant
    Filed: April 7, 2020
    Date of Patent: October 6, 2020
    Assignees: Sumitomo Electric Industries, Ltd., AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd.
    Inventors: Misato Kusakari, Tetsuya Kuwabara, Yoshihiro Nakai, Taichiro Nishikawa, Yasuyuki Otsuka, Hayato Ooi
  • Patent number: 10771161
    Abstract: Provided is an optical transmission module which can generate PAM4 optical modulation signals without converting a plurality of binary electric signals to a multi-level electric signal. An optical transmission module (200) comprising: a light source (60) for emitting continuous waveform (CW) light; optical modulators (51,52,53) arranged in series with a path of the CW light configured to modulate the CW light by switching relatively large absorption and relatively small absorption of the optical modulators in response to a modulation signal applied to the respective optical modulators; and an arithmetic logic circuit (100) configured to receive a plurality of binary electrical signals, and then to perform logic operation on the plurality of binary electrical signals for generating a new plurality of binary electrical signals, wherein each of the new plurality of binary electrical signals is applied to the respective optical modulators as the modulation signal.
    Type: Grant
    Filed: December 7, 2017
    Date of Patent: September 8, 2020
    Assignee: Lumentum Japan, Inc.
    Inventors: Atsushi Nakamura, Shunya Yamauchi, Yoriyoshi Yamaguchi, Nozomu Yasuhara, Yoshihiro Nakai, Hideaki Asakura, Noriko Sasada, Takayoshi Fukui, Hiroki Irie
  • Publication number: 20200270448
    Abstract: Provided is a resin composition for an acoustic matching layer, the resin composition including an epoxy resin (A), a specific polyamine compound (B), and metal particles (C). The epoxy resin (A) includes at least one epoxy resin selected from the group consisting of bisphenol A epoxy resins, bisphenol F epoxy resins, and phenol novolac epoxy resins. Also provided are a cured product formed of the composition, an acoustic matching sheet, an acoustic probe, an acoustic measuring apparatus, a method for producing an acoustic probe, and an acoustic matching layer material set.
    Type: Application
    Filed: April 30, 2020
    Publication date: August 27, 2020
    Applicant: FUJIFILM Corporation
    Inventors: Kazuhiro Hamada, Kazushi Furukawa, Yoshihiro Nakai
  • Publication number: 20200255652
    Abstract: A resin composition for an acoustic matching layer; an acoustic matching sheet formed from the composition; an acoustic wave probe; an acoustic wave measuring apparatus; a method for manufacturing an acoustic wave probe; and a material set, for an acoustic matching layer, that is suitable for preparation of the composition, in which the resin composition for an acoustic matching layer includes a binder including a resin; and metal particles having a monodispersity of 40% to 80%, wherein the monodispersity is calculated by equation (1): monodispersity (%)=(standard deviation of particle sizes of metal particles/average particle size of metal particles)×100.
    Type: Application
    Filed: April 30, 2020
    Publication date: August 13, 2020
    Applicant: FUJIFILM Corporation
    Inventors: Kazuhiro Hamada, Yoshihiro Nakai