Abstract: A method for manufacturing a ferrite-core fixing structure that includes preparing a ferrite core, preparing a bobbin that is a cylindrical member having a first end portion and a second end portion, the first end portion having an opening sized to receive the ferrite core, and the second end portion being at least partially closed, the bobbin being longer than the ferrite core in an axial direction of the bobbin, inserting the ferrite core into the bobbin through the opening, and fixing the ferrite core into the bobbin by heating and softening the first end portion of the bobbin and by pressing, using a pressing die, the first end portion of the bobbin in the axial direction such that the first end portion of the bobbin is melt-bonded.

Abstract: An object is to provide a semiconductor device having a plate electrode adapted to a plurality of chips, capable of being produced at low cost, and having high heat cycle property. A semiconductor device according to the present invention includes a plurality of semiconductor chips formed on a substrate, and a plate electrode connecting electrodes of the plurality of semiconductor chips. The plate electrode has half-cut portions formed by half-pressing and the raised sides of the half-cut portions are bonded with the electrodes of the semiconductor chips.

Abstract: A laser irradiation apparatus includes a laser generation device, a levitation unit to levitate an object to which the laser light is applied, and a conveyance unit to convey the levitated object. The conveyance unit includes a holding mechanism for holding the object by absorption, and a moving mechanism for moving the holding mechanism in a conveyance direction. The holding mechanism includes a base including a plurality of through holes, a plurality of pipes respectively connected to the through holes, a vacuum generation device configured to evacuate air from the f pipes, and a plurality of absorption assistance valves each disposed in the middle of a respective one of the pipes, each of the plurality of absorption assistance valves being configured to be closed when a flow rate of a gas flowing into the pipe through the through hole becomes equal to or higher than a threshold.

Abstract: An aluminum alloy material is prepared that has surface configuration of threefold irregularities such that rough surface having surface roughness of 10 to 100 ?m period is observed with an electron microscope in a magnification of 1000 times, surface having fine irregularities of 1 to 5 ?m period based on crystal grain boundary is observed with an electron microscope in a magnification of 10000 times and surface having ultrafine irregularities of 30 to 100 nm period is confirmed with an electron microscope in a magnification of 100000 times. Aluminum alloy material is integrally joined with a resin composition consisting of a total resin part containing polyphenylene sulfide resin by 70 mass % or more of the resin part, modified polyolefin resin by 30 mass % or less of the resin part and a resin of third component having ability for promoting compatibility of polyphenylene sulfide resin and modified polyolefin resin.

Abstract: A flexible substrate that is curved in a first direction, an insulator disposed on the substrate, a first electrode disposed on a first main surface side of the insulator in a first formation region, and a second electrode also disposed on the first main surface side of the insulator in a second formation region. A non-formation region is defined between the first electrode and the second electrode on the first main surface, and the non-formation region has at least a portion thereof extending along a direction different from a second direction orthogonal to the first direction.

Abstract: An antibacterial fiber that includes a charge generation member shaped in a fibrous form and that generates charges sufficient to suppress the proliferation of a bacillus by input of external energy, and a water-resistant member that covers the charge generation member.

Abstract: It is an object to provide a pressure-contact power semiconductor device and a power semiconductor core module which are capable of properly reducing their sizes. Each power semiconductor core module includes the following: a plurality of power semiconductor chips including a plurality of self-turn-off semiconductor elements and a plurality of diodes adjacent to each other in plan view; and a plurality of first springs disposed between an upper metal plate and a conductive cover plate. The plurality of self-turn-off semiconductor elements of each power semiconductor core module are arranged along any one of an L-shaped line, a cross-shaped line, and a T-shaped line in plan view.

Abstract: A three-dimensional laser cutter can be disposed in a machining room. The machining room includes a ceiling and a plate member. The ceiling is provided with a suction port connected to a suction device. The plate member is disposed below the ceiling with a gap therebetween. The plate member forms a space with the ceiling.

Abstract: A pointer includes: a pointer tip having a tip configured to point a position; a transmitter configured to emit a signal from the pointer tip; and a main body connected to the pointer tip. The main body includes: an exterior housing forming an exterior; a detector configured to detect displacement of the exterior housing and output a detection signal; and a controller configured to change an operation state of the pointer in accordance with the detection signal. The detector includes: a detection device provided on an inner surface of the exterior housing and configured to detect the displacement; and a signal outputter configured to output the detection signal in the case where the detection device detects the displacement.

Abstract: A power module includes a recessed base plate having a hollow portion, at least one insulating substrate disposed in the hollow portion of the base plate, at least one semiconductor chip mounted on the at least one insulating substrate, and sealing resin for sealing a surface of the hollow portion side of the base plate, the at least one insulating substrate, and the at least one semiconductor chip.

Abstract: A device for detecting a holding state of an object. The device includes a housing for the object that has a shape that can be held by an operator and a piezoelectric sensor attached to the housing. Moreover, a detecting unit can detects a holding state of the housing by using a fluctuation amount of an output voltage of the piezoelectric sensor. The housing has a shape having a hollow space and the piezoelectric sensor has a flat film shape and is disposed in contact with an inner wall surface of the housing. The piezoelectric film produces charges when stretched and contracted in response to a displacement of the housing that are outputted as a voltage to the detecting unit. When detecting that the output voltage significantly fluctuates, the detecting unit identifies that the object is being held.

Abstract: A piezoelectric device includes a first region for receiving a pressing operation and a second region located outside of the first region. A piezoelectric element outputs a stronger potential when a pressing operation is applied to the first region than when the pressing operation is applied to the second region.

Abstract: A semiconductor device including: an insulating substrate having a conductor layer on the upper face and the lower face and a semiconductor element mounted on the upper conductor layer; a base plate bonded to the lower conductor layer; a case member surrounding the insulating substrate and bonded to the surface of the base plate to which the conductor layer bonded to the lower face; a first filler being a silicone composition filled in a region surrounded by the base plate and the case member; and a second filler being injected into a region below the first filler and surrounding a peripheral edge portion of the insulating substrate, whose height from the base plate is higher than the upper face and is lower than a bonding face between the semiconductor element and the upper conductor layer.

Abstract: An image processing system may include an imaging device for capturing an image and an image processing apparatus for processing the image. The imaging device may include an imaging unit for capturing the image, a first recording unit for recording information relating to the image, the information being associated with the image, and a first transmission control unit for controlling transmission of the image to the image processing apparatus. The image processing apparatus may include a reception control unit for controlling reception of the image transmitted from the imaging device, a feature extracting unit for extracting a feature of the received image, a second recording unit for recording the feature, extracted from the image, the feature being associated with the image, and a second transmission control unit for controlling transmission of the feature to the imaging device.

Abstract: A laser irradiation apparatus (1) according to one embodiment includes a laser generating device (14) that generates a laser beam, a flotation unit (10) that causes a workpiece (16) that is to be irradiated with the laser beam to float, and a conveying unit (11) that conveys the floating workpiece (16). The conveying unit (11) conveys the workpiece (16) with the conveying unit (11) holding the workpiece (16) at a position where the conveying unit (11) does not overlap an irradiation position (15) of the laser beam. The laser irradiation apparatus (1) according to one embodiment makes it possible to suppress uneven irradiation with a laser beam.

Abstract: A laser irradiation apparatus (1) according to one embodiment irradiates a workpiece (16) with a laser beam (15) while conveying the workpiece (16) caused to float with the use of a flotation unit (10). The flotation unit (10) includes precision float regions (11a, 11b) and rough float regions (13a to 13j). The precision float regions (11a, 11b) are configured to cause the workpiece (16) to float by utilizing ejection and suction of a gas, and the rough float regions are configured to cause the workpiece (16) to float by utilizing ejection of a gas without suction of a gas.

Abstract: A center pipe is used in a plasma torch including a base portion and an electrode to supply cooling water into the electrode. The center pipe includes a pipe body and a contact piece. The pipe body has a tube-like shape with a cooling water channel therein. The pipe body is electrically conductive and configured to be electrically connected to an external power source via the base portion. The contact piece is arranged radially outside the pipe body at an intermediate position between a base end surface and a tip end surface of the pipe body. The contact piece is electrically conductive and energizes the electrode through contact with an internal circumferential surface of the electrode. The base end surface is disposed outside the electrode when the center pipe is inserted into the electrode. The pipe body is configured to be electrically connected to the electrode via the contact piece.

Abstract: An image processing system may include an imaging device for capturing an image and an image processing apparatus for processing the image. The imaging device may include an imaging unit for capturing the image, a first recording unit for recording information relating to the image, the information being associated with the image, and a first transmission control unit for controlling transmission of the image to the image processing apparatus. The image processing apparatus may include a reception control unit for controlling reception of the image transmitted from the imaging device, a feature extracting unit for extracting a feature of the received image, a second recording unit for recording the feature, extracted from the image, the feature being associated with the image, and a second transmission control unit for controlling transmission of the feature to the imaging device.

Abstract: A center pipe is used in a plasma torch for plasma cutting including a base portion and an electrode. The center pipe is inserted into the electrode and supplies cooling water into the electrode. The center pipe includes a pipe body and a contact piece. The pipe body is electrically connected to an electrical power source outside of the plasma torch via the base portion. The pipe body includes a cooling water channel therein. The pipe body is formed with an electrically conductive body. The contact piece is provided on the external circumferential surface of the pipe body and energizes the electrode through contact with the internal circumferential surface of the electrode. The contact piece has elasticity to produce a counterforce when pressed in the radial direction of the pipe body. The contact piece is formed with an electrically conductive body.

Abstract: A piezoelectric sensor that includes a piezoelectric film, first and second adhesive layers, first and second plate electrodes and a glass plate. The piezoelectric film includes first and second principal surfaces. The first adhesive layer attaches the first plate electrode to the first principal surface. The second adhesive layer attaches the second plate electrode to the second principal surface. The second plate electrode is attached to the glass plate such that the second adhesive layer and the second plate electrode are interposed between the piezoelectric film and the glass plate. The glass plate is distorted by being pushed. The second adhesive layer is thicker than the first adhesive layer.