Patents by Inventor Yoshihisa Sone
Yoshihisa Sone has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9070628Abstract: According to the invention, a method of manufacturing an esterified substance including a process in which a copolymer is obtained by copolymerizing a 1-alkene having 5 to 80 carbon atoms and maleic anhydride, and a process in which an esterification reaction of the copolymer and an alcohol having 5 to 25 carbon atoms is caused in a presence of trifluoromethanesulfonic acid in order to obtain a reaction mixture containing an esterified substance including at least one repetition unit selected from formulae (c) to (f) is provided, and, in the formulae (c) to (f), R represents an aliphatic hydrocarbon group having 3 to 78 carbon atoms, R2 represents a hydrocarbon group having 5 to 25 carbon atoms, m represents the copolymerization molar ratio X/Y of the 1-alkene (X) to the maleic anhydride (Y) and is 1/2 to 10/1, and n is an integer of more than or equal to 1.Type: GrantFiled: May 25, 2011Date of Patent: June 30, 2015Assignees: SUMITOMO BAKELITE CO., LTD., AIR WATER INC.Inventors: Jun-ichi Tabei, Yoshihisa Sone, Kiyotaka Murata, Kou Takahashi
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Publication number: 20130260155Abstract: A resin composition having high Tg (high heat resistance), low thermal expansion, and excellent flame retardancy, and being advantageous for promoting halogen-free, and having excellent adhesiveness with Cu, a prepreg obtained by impregnating it into substrate, and a composite and a laminate obtained from them. Specifically provided are a modified polyimide resin composition containing (A) a polymaleimide compound of formula [1], (B) epoxy resin having at least two glycidyl groups in the molecule of formula [2], and (c) phenolic compound having at least two OH groups in the molecule, and a prepreg obtained by impregnating the composition into the substrate, and a composite and a laminate obtained from the prepreg.Type: ApplicationFiled: October 19, 2011Publication date: October 3, 2013Applicant: AIR WATER INCInventors: Tetsuro Niiyama, Yoshihisa Sone
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Publication number: 20130059983Abstract: According to the invention, a method of manufacturing an esterified substance including a process in which a copolymer is obtained by copolymerizing a 1-alkene having 5 to 80 carbon atoms and maleic anhydride, and a process in which an esterification reaction of the copolymer and an alcohol having 5 to 25 carbon atoms is caused in a presence of trifluoromethanesulfonic acid in order to obtain a reaction mixture containing an esterified substance including at least one repetition unit selected from formulae (c) to (f) is provided, and, in the formulae (c) to (f), R represents an aliphatic hydrocarbon group having 3 to 78 carbon atoms, R2 represents a hydrocarbon group having 5 to 25 carbon atoms, m represents the copolymerization molar ratio X/Y of the 1-alkene (X) to the maleic anhydride (Y) and is 1/2 to 10/1, and n is an integer of more than or equal to 1.Type: ApplicationFiled: May 25, 2011Publication date: March 7, 2013Applicants: AIR WATER INC., SUMITOMO BAKELITE CO., LTD.Inventors: Jun-ichi Tabei, Yoshihisa Sone, Kiyotaka Murata, Kou Takahashi
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Patent number: 8349989Abstract: A method of sealing a semiconductor element which involves applying an epoxy resin composition including an epoxy resin and a phenolic resin obtained by reacting phenol, a biphenyl compound represented by the general formula (3) and benzaldehyde to a semiconductor element and curing the composition to seal the semiconductor element: wherein X in the formula (3) is a halogen, an OH group or an OCH3 group. The molar ratio of the total of the biphenyl compound and benzaldehyde relative to the phenol is from 0.27 to 0.40, and the molar ratio of benzaldehyde/biphenyl compound is from 5/95 to 40/60.Type: GrantFiled: June 2, 2011Date of Patent: January 8, 2013Assignee: Air Water Inc.Inventors: Kiyotaka Murata, Yoshihisa Sone
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Publication number: 20110281404Abstract: A method of sealing a semiconductor element which involves applying an epoxy resin composition including an epoxy resin and a phenolic resin obtained by reacting phenol, a biphenyl compound represented by the general formula (3) and benzaldehyde to a semiconductor element and curing the composition to seal the semiconductor element: wherein X in the formula (3) is a halogen, an OH group or an OCH3 group. The molar ratio of the total of the biphenyl compound and benzaldehyde relative to the phenol is from 0.27 to 0.40, and the molar ratio of benzaldehyde/biphenyl compound is from 5/95 to 40/60.Type: ApplicationFiled: June 2, 2011Publication date: November 17, 2011Applicant: AIR WATER INC.Inventors: Kiyotaka MURATA, Yoshihisa Sone
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Patent number: 7994271Abstract: Disclosed is a phenolic resin having flame retardance, fast curing property and low melt viscosity, which is useful for a curing agent for epoxy resin-based semiconductor sealing materials. Also disclosed are a method for producing such a phenolic resin and use of such a phenolic resin. Specifically disclosed is a phenolic resin obtained by reacting a phenol, a bismethylbiphenyl compound and an aromatic aldehyde at such a ratio that the molar ratio of the total of the bismethylbiphenyl compound and the aromatic aldehyde relative to the phenol is 0.10-0.60, and the aromatic aldehyde/the bismethylbiphenyl compound (molar ratio) is from 5/95 to 50/50. Also specifically disclosed is an epoxy resin composition composed of such a phenolic resin and an epoxy resin.Type: GrantFiled: October 16, 2006Date of Patent: August 9, 2011Assignee: Air Water Inc.Inventors: Kiyotaka Murata, Yoshihisa Sone
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Publication number: 20090137725Abstract: Disclosed is a phenolic resin having flame retardance, fast curing property and low melt viscosity, which is useful for a curing agent for epoxy resin-based semiconductor sealing materials. Also disclosed are a method for producing such a phenolic resin and use of such a phenolic resin. Specifically disclosed is a phenolic resin obtained by reacting a phenol, a bismethylbiphenyl compound and an aromatic aldehyde at such a ratio that the molar ratio of the total of the bismethylbiphenyl compound and the aromatic aldehyde relative to the phenol is 0.10-0.60, and the aromatic aldehyde/the bismethylbiphenyl compound (molar ratio) is from 5/95 to 50/50. Also specifically disclosed is an epoxy resin composition composed of such a phenolic resin and an epoxy resin.Type: ApplicationFiled: October 16, 2006Publication date: May 28, 2009Applicant: AIR WATER, INC.Inventors: Kiyotaka Murata, Yoshihisa Sone
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Patent number: 5721332Abstract: A phenolic resin obtained by reacting a phenol with an aromatic aldehyde and a xylylene compound represented by the formulaROH.sub.2 C(C.sub.6 H.sub.4)CH.sub.2 ORwhere R is hydrogen, an alkyl group having a carbon atom number of 1-4, or an acyl group having a carbon atom number of 2-4 in the presence of acid catalyst, with the sum of aromatic aldehydes and xylylene compounds to phenols molar ratio being 0.1-0.95, and the xylylene compounds to aromatic aldehydes molar ratio being 0.1-1.4.The phenolic resin thus obtained is useful as an industrial material by virtue of its excellent moisture resisting property, alkali resistance and fair thermosetting property. Having low moisture absorption ratio and high glass transition temperature, this phenolic resin is also suitable used as hardener for semiconductor encapsulating epoxy resin which has excellent package crack resistance after solder dipping and high reliability.Type: GrantFiled: January 16, 1996Date of Patent: February 24, 1998Assignee: Sumikin Chemical Co., Ltd.Inventors: Haruyuki Kano, Yoshihisa Sone, Kouichi Yoshimura, Hiroichi Kouyama
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Patent number: 5514475Abstract: A heat-resistant, electrical insulating layer which is suitable for use as an insulating substrate in printed circuit boards and as an insulating film for semiconductor devices and which surpasses a polyimide-based insulating layer with respect to heat resisting properties, dielectric properties, and water absorption. The insulating layer comprises a polycondensed fused polycyclic, polynuclear aromatic resin prepared by a polycondensation reaction of a starting material with a crosslinking agent in the presence of an acid catalyst. The starting material is selected from the group consisting of fused polycyclic aromatic hydrocarbons which may have a hydroxyl group as a ring substituent and mixtures of a fused polycyclic aromatic hydrocarbon and a monocyclic aromatic hydrocarbon both of which may have a hydroxyl group as a ring substituent. The crosslinking agent is an aromatic compound having at least two hydroxymethyl or halomethyl groups as ring substituents.Type: GrantFiled: January 21, 1994Date of Patent: May 7, 1996Assignee: Sumitomo Metal Industries, Ltd.Inventors: Kazunari Nawa, Haruyuki Kano, Yoshihisa Sone
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Patent number: 5017683Abstract: A condensed polycyclic, polynuclear aromatic thermosetting resin with improved moldability which is prevented from forming a cloud on a mold during molding is disclosed. The resin is a prepolymer derived by condensation polymerization of a condensed polycyclic aromatic compound or a mixture thereof with a monocyclic aromatic compounds and an aromatic compound having at least two hydroxymethyl groups as a crosslinking agent in the presence of an acid catalyst. The resin has a flow temperature of not higher than 150.degree. C. The acid catalyst is water-insoluble or when it is water-soluble the resin has an insolubilized acid ratio of at least 50%. The resin is useful in the manufacture of thermoset molded articles having good heat resistance and good mechanical and electrical properties. It can be blended with a filler and/or reinforcing agent to form a molding compound.Type: GrantFiled: August 25, 1989Date of Patent: May 21, 1991Assignee: Sumikin Chemical Co., Ltd.Inventors: Sugio Otani, Michio Tsuyuguchi, Haruyuki Kano, Yoshihisa Sone, Kenji Kageyama, Toshiaki Mabuchi
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Patent number: D305934Type: GrantFiled: May 21, 1987Date of Patent: February 6, 1990Assignee: Terumo Kabushiki KaishaInventor: Yoshihisa Sone
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Patent number: D314050Type: GrantFiled: May 27, 1988Date of Patent: January 22, 1991Assignee: Terumo Kabushiki KaishaInventor: Yoshihisa Sone
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Patent number: D317201Type: GrantFiled: February 5, 1988Date of Patent: May 28, 1991Assignee: Terumo Kabushiki KaishaInventor: Yoshihisa Sone
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Patent number: D319504Type: GrantFiled: May 12, 1988Date of Patent: August 27, 1991Assignee: Terumo Kabushiki KaishaInventors: Yoshihisa Sone, Keiji Naoi
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Patent number: D320661Type: GrantFiled: March 30, 1989Date of Patent: October 8, 1991Assignee: Terumo Kabushiki KaishaInventor: Yoshihisa Sone
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Patent number: D327337Type: GrantFiled: February 5, 1988Date of Patent: June 23, 1992Assignee: Terumo Kabushiki KaishaInventor: Yoshihisa Sone