Abstract: A method for forming resist patterns, and an overlying layer material and a semiconductor device used in the method for forming resist patterns, which can improve the dimensional uniformity of resist patterns by inhibiting the multiple interference of light beams within a resist film; improve the environmental resistance in a clean room or the like; and obtain resist patterns having rectangular sectional shapes by preventing the acid in the overlying layer material from diffusing into the resist. By using an overlying layer material containing a water-soluble low-molecular-weight acidic substance and a water-soluble photo base generator preventing the diffusion of the acidic substance into the resist, the base formed after exposure neutralizes the acids contained in the overlying layer material in nature, and the diffusion of the acid into the resist can be inhibited.

Abstract: A resist material and a method for forming a resist pattern can be obtained which can improve throughput of pattern formation using both EB lithography and optical beam lithography and which does not suffer from degradation of an alignment mark. This resist material includes a first acid generating agent having a sensitivity only to an EB and a second acid generating agent having a sensitivity to an optical beam. A desired resist pattern is formed by the steps of exposing the resist material to the EB and exposing the resist material to the optical beam.