Abstract: A reaction byproduct which is generated when a ferro-dielectric material film is etched is removed without giving adverse effect on the semiconductor element. After the etching of the ferro-dielectric material film, a wetting process may performed using an aqueous solution of phosphoric acid. After the ferro-dielectric material film is etched using the resist as the mask, the wetting process is also performed using the aqueous solution of phosphoric acid before and after the ashing of resist.

Abstract: An information retrieval apparatus includes an input unit from which information-retrieval information is input, database interfaces which can access databases, a display unit for displaying, in the form of a bar, information which is obtained by the access, a central processing unit (CPU) which can move a cursor for designating a position in the lengthwise direction of the information bar and which uses a database interface to retrieve, from the databases, information corresponding to the lengthwise position designated by the cursor. The information retrieved by the CPU is displayed on the display unit. In this structure, data can be retrieved without performing user-used inputting by using a keyboard or the like.

Abstract: A reaction byproduct which is generated when a ferro-dielectric material film is etched is removed without giving adverse effect on the semiconductor element. After the etching of the ferro-dielectric material film, a wetting process may performed using an aqueous solution of phosphoric acid. After the ferro-dielectric material film is etched using the resist as the mask, the wetting process is also performed using the aqueous solution of phosphoric acid before and after the ashing of resist.

Abstract: A laser measuring method is provided, which suppress the shift or change of laser beams traveling toward an optical detector even if a displacement error (i.e., yawing and/or pitching) of an object to be measured occurs.

Abstract: A printed wiring device includes an insulation layer, a base layer, i.e. grounding layer or power supply layer, disposed on the insulation layer, and a signal line disposed on the insulation layer at the opposite side of the base layer. A plurality of holes is formed in the base layer opposite to the signal line, so that an average capacitance value between the signal line and the base layer is decreased. Thus, even if the insulation layer is thinned without narrowing the width of the signal line, characteristic impedance of the signal line can be controlled at a desired value.

Abstract: A laminate type optical information recording medium which is identifiable on the basis of its color, is formed without change to conventional manufacturing steps by laminating two optical information recording media, each of which includes at least a substrate on which information is recorded, a semi-transparent layer for reflecting a reproduction laser beam, a transparent resin layer formed to cover the semi-transparent layer, a reflection layer for reflecting the reproduction laser beam and an adhesive layer formed to cover the reflection layer. The two substrates of the laminate type optical information recording medium have different transmission spectra in a visible region.

Abstract: A vibration damping support apparatus for a power unit of an automobile is disclosed which includes: an oscillating device disposed between a vehicle body and the power unit, for oscillating the power unit with respect to the vehicle body; a first sensor attached to the power unit, for detecting vibration of the power unit; a second sensor attached to a member of a vehicle suspension system, for detecting vibration of the suspension member which is displaced relative to the vehicle body in response to movements of vehicle wheels; a third sensor attached to a monitoring point on the vehicle body, for detecting vibration of the vehicle body at the monitoring point; and a control device for controlling the oscillating device, based on a first reference signal and a second reference signal received from the first and second sensors, respectively, and an error signal received from the third sensor, the control device performing an adaptive control so that the error signal is minimized.

Abstract: An automobile power plant apparatus includes an engine, a transmission connected to the engine, a propeller shaft connected to the transmission, a front mount elastically supporting the engine, and a body provided with the engine, the transmission, the propeller shaft and the front mount. The transmission includes a mount engagement portion which is positioned substantially adjacent to a virtual center of the transmission in a vehicle lengthwise direction and which is positioned on a side of the transmission in a vehicle widthwise direction. The body includes a mount installation portion which is positioned substantially adjacent to the virtual center of the transmission in the vehicle lengthwise direction and which is positioned opposite to a side of the transmission in the vehicle widthwise direction, and the body further includes a rear mount which is installed to the mount installation portion and which engages with the mount engagement portion of the transmission.

Abstract: After a semiconductor wafer is processed, a photoresist on the semiconductor wafer is removed by an irradiation of oxygen plasma while the wafer is cooled by a cooling device. The cooling device can be a susceptor or a stage on which the wafer is placed, and coolant flows through a pipe or duct installed thereto. Cooling of the wafer prevents the photoresist from being softened by the heat from the plasma. Thus, the inner side of the photoresist remains hard enough to support the affected surface portion of the photoresist, which is also difficult to remove, preventing the affected surface portion from sticking onto the surface of the wafer. Therefore, the affected portion can be more effectively irradiated by the plasma, and can be decomposed without leaving residue on the wafer. Reduced residue on the wafer surface contributes to improve production yield and quality of the products made from this wafer.

Abstract: A method for removing a resist on a layer formed on a semiconductor substrate includes the steps of removing a portion of the resist by plasma processing and removing the remaining resist by a chemical process.This method prevents the entry of heavy metal particles contained in the resist into the semiconductor substrate, so that a functional region formed in the semiconductor substrate is not contaminated by the heavy metal particles. As a result, destruction of the functional elements formed in the functional region is prevented, and thus the minority carrier generation lifetime in the device is not reduced.

Abstract: A method of producing a semiconductor device comprises the steps of forming on a substrate a layer of a material selected from a group consisting of aluminum, aluminum alloy, titanium, polysilicon and a metal silicide, and carrying out a dry etching of the layer in a reactive gas consisting essentially of bromine gas.