Patents by Inventor Yoshikazu Miwa
Yoshikazu Miwa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7682146Abstract: A molding manufacturing method includes: preparing a molding body including a molding main body made of thermoplastic material and a decorative layer higher than the molding main body in hardness and melt temperature; setting the molding body in a fixed die; heating and softening an end portion of the molding body while maintaining the decorative layer softer than the molding main body, by irradiating an infrared ray onto a back surface of the molding main body corresponding to the end portion; and press forming the end portion of the molding body by applying a movable punch onto the fixed die while the end portion of the molding body is in a softened state to bend the end portion of the molding body to obtain an end cover portion having a predetermined shape.Type: GrantFiled: July 15, 2008Date of Patent: March 23, 2010Assignee: Tokai Kogyo Co., Ltd.Inventors: Yoshikazu Miwa, Akira Jinno, Masahito Yamada, Junichi Miyake, Tatsuya Tamura
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Publication number: 20080286395Abstract: A molding manufacturing method includes: preparing a molding body including a molding main body made of thermoplastic material and a decorative layer higher than the molding main body in hardness and melt temperature; setting the molding body in a fixed die; heating and softening an end portion of the molding body while maintaining the decorative layer softer than the molding main body, by irradiating an infrared ray onto a back surface of the molding main body corresponding to the end portion; and press forming the end portion of the molding body by applying a movable punch onto the fixed die while the end portion of the molding body is in a softened state to bend the end portion of the molding body to obtain an end cover portion having a predetermined shape.Type: ApplicationFiled: July 15, 2008Publication date: November 20, 2008Applicant: TOKAI KOGYO CO., LTD.Inventors: Yoshikazu Miwa, Akira Jinno, Masahito Yamada, Junichi Miyake, Tatsuya Tamura
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Patent number: 7416693Abstract: A molding manufacturing method includes: preparing a molding body including a molding main body made of thermoplastic material and a decorative layer higher than the molding main body in hardness and melt temperature; setting the molding body in a fixed die; heating and softening an end portion of the molding body while maintaining the decorative layer softer than the molding main body, by irradiating an infrared ray onto a back surface of the molding main body corresponding to the end portion; and press forming the end portion of the molding body by applying a movable punch onto the fixed die while the end portion of the molding body is in a softened state to bend the end portion of the molding body to obtain an end cover portion having a predetermined shape.Type: GrantFiled: November 25, 2003Date of Patent: August 26, 2008Assignee: Tokai Kogyo Co., Ltd.Inventors: Yoshikazu Miwa, Akira Jinno, Masahito Yamada, Junichi Miyake, Tatsuya Tamura
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Publication number: 20040156941Abstract: A molding manufacturing method includes: preparing a molding body including a molding main body made of thermoplastic material and a decorative layer higher than the molding main body in hardness and melt temperature; setting the molding body in a fixed die; heating and softening an end portion of the molding body while maintaining the decorative layer softer than the molding main body, by irradiating an infrared ray onto a back surface of the molding main body corresponding to the end portion; and press forming the end portion of the molding body by applying a movable punch onto the fixed die while the end portion of the molding body is in a softened state to bend the end portion of the molding body to obtain an end cover portion having a predetermined shape.Type: ApplicationFiled: November 25, 2003Publication date: August 12, 2004Applicant: TOKAI KOGYO CO., LTD.Inventors: Yoshikazu Miwa, Akira Jinno, Masahito Yamada, Junichi Miyake, Tatsuya Tamura
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Patent number: 5342843Abstract: The present invention relates to a thienoimidazopyridone derivative represented by Formula (I): ##STR1## wherein A and B independently represent --S-- or --CH.dbd., X-Y-Z represents --N(R.sup.2)--CH.dbd.N-- or --N.dbd.CH--N (R.sup.2)-- wherein R.sup.2 is hydrogen, lower alkyl or --CH(R.sup.3)--(CH.sub.2).sub.n --R.sup.4 wherein R.sup.4 is phenyl, n is 0 or 1, and R.sup.3 is hydrogen or lower alkyl, and R.sup.1 represents lower alkyl, or a pharmaceutically acceptable salt thereof.Type: GrantFiled: August 6, 1993Date of Patent: August 30, 1994Assignee: Kyowa Hakko Kogyo Co., Ltd.Inventors: Fumio Suzuki, Yoshikazu Miwa, Takeshi Kuroda, Shigeto Kitamura, Haruhiko Manabe
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Patent number: 5319085Abstract: Quinoline derivatives represented by formula (I): ##STR1## wherein A-B-D represents --C(COO--Y).dbd.CH--C(OR).dbd. (wherein Y represents 8-methyl-8-azabicyclo[3.2.1]oct-3-yl group and R represents alkyl) or --C(OH).dbd.C(COX--Y)--CH.dbd. (wherein X represents --O-- or --NH--; and Y has the same meaning as described above), or a pharmaceutically acceptable salt thereof, possess potent 5HT.sub.3 antagonizing activity and are useful as antiemetic agents.Type: GrantFiled: April 16, 1993Date of Patent: June 7, 1994Assignee: Kyowa Hakko Kogyo Co., Ltd.Inventors: Fumio Suzuki, Hiroaki Hayashi, Yoshikazu Miwa, Takeshi Kuroda, Akio Ishii, Shunji Ichikawa, Ichiro Miki, Katsuichi Shuto
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Patent number: 5248684Abstract: There is disclosed a heterocyclic compound represented by general formula: ##STR1## wherein R.sup.1 represents hydrogen, lower alkyl or aryl; R.sup.2 represents hydrogen, hydroxyl or lower alkyl; A represents CH or N; X represents --O-- or --NH--; R.sup.3 represents hydrogen, hydroxyl or lower alkyl; R.sup.4 represents lower alkyl; represents 0 or 1, or a pharmaceutically acceptable salt thereof.Type: GrantFiled: May 21, 1991Date of Patent: September 28, 1993Assignee: Kyowa Hakko Kogyo Co., Ltd.Inventors: Fumio Suzuki, Hiroaki Hayashi, Yoshikazu Miwa, Akio Ishii, Shunji Ichikawa, Ichiro Miki
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Patent number: 5219864Abstract: Disclosed is a thienopyridine derivative represented by formula (I): ##STR1## wherein one of A and B represents --S-- and the other represents --CH.dbd.; R represents hydrogen or lower alkyl, and Z represents pyridyl; or a pharmaceutically acceptable salt thereof.The thienopyridine derivative is useful as an immunoregulator and for the prevention and treatment of osteoporosis.Type: GrantFiled: March 4, 1992Date of Patent: June 15, 1993Assignee: Kyowa Hakko Kogyo Co., Ltd.Inventors: Fumio Suzuki, Yoshikazu Miwa, Hiroaki Hayashi, Takeshi Kuroda, Kenji Ohmori, Hiroshi Nakajima
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Patent number: 5155115Abstract: Disclosed is a thienopyridine derivative represented by formula (I): ##STR1## wherein one of A and B represents --S-- and the other represents --CH.dbd.; X represents --O-- or --NH--; R.sup.1 represents hydrogen or lower alkyl; R.sup.2 represents lower alkyl; and n represents 0 or 1; or a pharmaceutically acceptable salt thereof.The thienopyridine derivative is useful as anti-emetics and suppressant of migraine.Type: GrantFiled: March 4, 1992Date of Patent: October 13, 1992Assignee: Kyowa Hakko Kogyo Co., Ltd.Inventors: Fumio Suzuki, Yoshikazu Miwa, Hiroaki Hayashi, Akio Ishii, Shunji Ichikawa, Ichiro Miki