Patents by Inventor Yoshikazu Miwa

Yoshikazu Miwa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7682146
    Abstract: A molding manufacturing method includes: preparing a molding body including a molding main body made of thermoplastic material and a decorative layer higher than the molding main body in hardness and melt temperature; setting the molding body in a fixed die; heating and softening an end portion of the molding body while maintaining the decorative layer softer than the molding main body, by irradiating an infrared ray onto a back surface of the molding main body corresponding to the end portion; and press forming the end portion of the molding body by applying a movable punch onto the fixed die while the end portion of the molding body is in a softened state to bend the end portion of the molding body to obtain an end cover portion having a predetermined shape.
    Type: Grant
    Filed: July 15, 2008
    Date of Patent: March 23, 2010
    Assignee: Tokai Kogyo Co., Ltd.
    Inventors: Yoshikazu Miwa, Akira Jinno, Masahito Yamada, Junichi Miyake, Tatsuya Tamura
  • Publication number: 20080286395
    Abstract: A molding manufacturing method includes: preparing a molding body including a molding main body made of thermoplastic material and a decorative layer higher than the molding main body in hardness and melt temperature; setting the molding body in a fixed die; heating and softening an end portion of the molding body while maintaining the decorative layer softer than the molding main body, by irradiating an infrared ray onto a back surface of the molding main body corresponding to the end portion; and press forming the end portion of the molding body by applying a movable punch onto the fixed die while the end portion of the molding body is in a softened state to bend the end portion of the molding body to obtain an end cover portion having a predetermined shape.
    Type: Application
    Filed: July 15, 2008
    Publication date: November 20, 2008
    Applicant: TOKAI KOGYO CO., LTD.
    Inventors: Yoshikazu Miwa, Akira Jinno, Masahito Yamada, Junichi Miyake, Tatsuya Tamura
  • Patent number: 7416693
    Abstract: A molding manufacturing method includes: preparing a molding body including a molding main body made of thermoplastic material and a decorative layer higher than the molding main body in hardness and melt temperature; setting the molding body in a fixed die; heating and softening an end portion of the molding body while maintaining the decorative layer softer than the molding main body, by irradiating an infrared ray onto a back surface of the molding main body corresponding to the end portion; and press forming the end portion of the molding body by applying a movable punch onto the fixed die while the end portion of the molding body is in a softened state to bend the end portion of the molding body to obtain an end cover portion having a predetermined shape.
    Type: Grant
    Filed: November 25, 2003
    Date of Patent: August 26, 2008
    Assignee: Tokai Kogyo Co., Ltd.
    Inventors: Yoshikazu Miwa, Akira Jinno, Masahito Yamada, Junichi Miyake, Tatsuya Tamura
  • Publication number: 20040156941
    Abstract: A molding manufacturing method includes: preparing a molding body including a molding main body made of thermoplastic material and a decorative layer higher than the molding main body in hardness and melt temperature; setting the molding body in a fixed die; heating and softening an end portion of the molding body while maintaining the decorative layer softer than the molding main body, by irradiating an infrared ray onto a back surface of the molding main body corresponding to the end portion; and press forming the end portion of the molding body by applying a movable punch onto the fixed die while the end portion of the molding body is in a softened state to bend the end portion of the molding body to obtain an end cover portion having a predetermined shape.
    Type: Application
    Filed: November 25, 2003
    Publication date: August 12, 2004
    Applicant: TOKAI KOGYO CO., LTD.
    Inventors: Yoshikazu Miwa, Akira Jinno, Masahito Yamada, Junichi Miyake, Tatsuya Tamura
  • Patent number: 5342843
    Abstract: The present invention relates to a thienoimidazopyridone derivative represented by Formula (I): ##STR1## wherein A and B independently represent --S-- or --CH.dbd., X-Y-Z represents --N(R.sup.2)--CH.dbd.N-- or --N.dbd.CH--N (R.sup.2)-- wherein R.sup.2 is hydrogen, lower alkyl or --CH(R.sup.3)--(CH.sub.2).sub.n --R.sup.4 wherein R.sup.4 is phenyl, n is 0 or 1, and R.sup.3 is hydrogen or lower alkyl, and R.sup.1 represents lower alkyl, or a pharmaceutically acceptable salt thereof.
    Type: Grant
    Filed: August 6, 1993
    Date of Patent: August 30, 1994
    Assignee: Kyowa Hakko Kogyo Co., Ltd.
    Inventors: Fumio Suzuki, Yoshikazu Miwa, Takeshi Kuroda, Shigeto Kitamura, Haruhiko Manabe
  • Patent number: 5319085
    Abstract: Quinoline derivatives represented by formula (I): ##STR1## wherein A-B-D represents --C(COO--Y).dbd.CH--C(OR).dbd. (wherein Y represents 8-methyl-8-azabicyclo[3.2.1]oct-3-yl group and R represents alkyl) or --C(OH).dbd.C(COX--Y)--CH.dbd. (wherein X represents --O-- or --NH--; and Y has the same meaning as described above), or a pharmaceutically acceptable salt thereof, possess potent 5HT.sub.3 antagonizing activity and are useful as antiemetic agents.
    Type: Grant
    Filed: April 16, 1993
    Date of Patent: June 7, 1994
    Assignee: Kyowa Hakko Kogyo Co., Ltd.
    Inventors: Fumio Suzuki, Hiroaki Hayashi, Yoshikazu Miwa, Takeshi Kuroda, Akio Ishii, Shunji Ichikawa, Ichiro Miki, Katsuichi Shuto
  • Patent number: 5248684
    Abstract: There is disclosed a heterocyclic compound represented by general formula: ##STR1## wherein R.sup.1 represents hydrogen, lower alkyl or aryl; R.sup.2 represents hydrogen, hydroxyl or lower alkyl; A represents CH or N; X represents --O-- or --NH--; R.sup.3 represents hydrogen, hydroxyl or lower alkyl; R.sup.4 represents lower alkyl; represents 0 or 1, or a pharmaceutically acceptable salt thereof.
    Type: Grant
    Filed: May 21, 1991
    Date of Patent: September 28, 1993
    Assignee: Kyowa Hakko Kogyo Co., Ltd.
    Inventors: Fumio Suzuki, Hiroaki Hayashi, Yoshikazu Miwa, Akio Ishii, Shunji Ichikawa, Ichiro Miki
  • Patent number: 5219864
    Abstract: Disclosed is a thienopyridine derivative represented by formula (I): ##STR1## wherein one of A and B represents --S-- and the other represents --CH.dbd.; R represents hydrogen or lower alkyl, and Z represents pyridyl; or a pharmaceutically acceptable salt thereof.The thienopyridine derivative is useful as an immunoregulator and for the prevention and treatment of osteoporosis.
    Type: Grant
    Filed: March 4, 1992
    Date of Patent: June 15, 1993
    Assignee: Kyowa Hakko Kogyo Co., Ltd.
    Inventors: Fumio Suzuki, Yoshikazu Miwa, Hiroaki Hayashi, Takeshi Kuroda, Kenji Ohmori, Hiroshi Nakajima
  • Patent number: 5155115
    Abstract: Disclosed is a thienopyridine derivative represented by formula (I): ##STR1## wherein one of A and B represents --S-- and the other represents --CH.dbd.; X represents --O-- or --NH--; R.sup.1 represents hydrogen or lower alkyl; R.sup.2 represents lower alkyl; and n represents 0 or 1; or a pharmaceutically acceptable salt thereof.The thienopyridine derivative is useful as anti-emetics and suppressant of migraine.
    Type: Grant
    Filed: March 4, 1992
    Date of Patent: October 13, 1992
    Assignee: Kyowa Hakko Kogyo Co., Ltd.
    Inventors: Fumio Suzuki, Yoshikazu Miwa, Hiroaki Hayashi, Akio Ishii, Shunji Ichikawa, Ichiro Miki