Patents by Inventor Yoshikazu Nishimura

Yoshikazu Nishimura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6175150
    Abstract: A plastic-encapsulated semiconductor device is provided, which is capable of efficient heat dissipation without upsizing while preventing the moisture from reaching an IC chip. This device is comprised of an electrically-conductive island having a chip-mounting area, an IC chip fixed on the chip-mounting area of the island, leads electrically connected to bonding pads of the chip through bonding wires, a plastic package for encapsulating the island, the chip, the bonding wires, and inner parts of the leads. The package has an approximately flat bottom face. Outer parts of the leads are protruded from the package and are located in approximately a same plane as the bottom face of the package. The island has an exposition part exposed from the package at a location excluding the chip-mounting area. A lower face of the exposition part of the island is located in approximately a same plane as the bottom face of the package. The chip and the chip-mounting area of the island are entirely buried in the package.
    Type: Grant
    Filed: April 17, 1998
    Date of Patent: January 16, 2001
    Assignee: NEC Corporation
    Inventors: Seiji Ichikawa, Takeshi Umemoto, Toshiaki Nishibe, Kazunari Sato, Kunihiko Tubota, Masato Suga, Yoshikazu Nishimura, Keita Okahira, Tatsuya Miya, Tooru Kitakoga, Kazuhiro Tahara
  • Patent number: 6165818
    Abstract: A semiconductor device is disclosed wherein a pair of radiating terminals and a plurality of lead terminals are formed from a single lead frame. A hole or holes in each radiating terminal are formed with an equal width and in an equal pitch to those of gaps between the lead terminals, and the opposite sides of each hole of the radiating terminal are connected to each other by a support element. The support elements of the radiating terminals and support elements which interconnect the lead terminals are formed with an equal length and in an equal pitch to allow the support elements to be cut away by a plurality of punches which are arranged in an equal pitch and have an equal width.
    Type: Grant
    Filed: May 7, 1998
    Date of Patent: December 26, 2000
    Assignee: NEC Corporation
    Inventors: Seiji Ichikawa, Takeshi Umemoto, Toshiaki Nishibe, Kazunari Sato, Kunihiko Tsubota, Masato Suga, Yoshikazu Nishimura, Keita Okahira, Tatsuya Miya, Toru Kitakoga, Kazuhiro Tahara
  • Patent number: 6150715
    Abstract: A semiconductor device of the present invention comprises a semiconductor pellet, a radiation plate mounted with the semiconductor pellet, a plurality of lead terminals electrically connected with the semiconductor pellet, and a resin member for encapsulating the above items. The resin member has a first surface and a second surface, and the radiation plate has a first portion exposed to the outside from the first surface of the resin member and a second portion exposed to the outside from the second surface of the resin member.
    Type: Grant
    Filed: July 28, 1998
    Date of Patent: November 21, 2000
    Assignee: NEC Corporation
    Inventors: Seiji Ichikawa, Takeshi Umemoto, Kazunari Sato, Kunihiko Tsubota, Yoshikazu Nishimura, Toshiaki Nishibe, Kazuhiro Tahara, Masato Suga, Toru Kitakoga, Tatsuya Miya, Keita Okahira
  • Patent number: 6104086
    Abstract: A semiconductor device having lead terminals bent in a J-shape is disclosed. A radiating plate having a recess formed on an outer peripheral portion thereof is exposed to a lower face of a resin member and free ends of outer portions of the lead terminals are positioned in the recess of the radiating plate. The free ends of the outer portions of the lead terminals and the recess of the radiating plate are isolated from each other by projections of the resin member. Since the radiating plate is exposed to the lower face of the resin member, the heat radiating property is high whereas the radiating plate and the lead terminals are not short-circuited to each other at all.
    Type: Grant
    Filed: April 13, 1998
    Date of Patent: August 15, 2000
    Assignee: NEC Corporation
    Inventors: Seiji Ichikawa, Takeshi Umemoto, Toshiaki Nishibe, Kazunari Sato, Kunihiko Tsubota, Masato Suga, Yoshikazu Nishimura, Keita Okahira, Tatsuya Miya, Toru Kitakoga, Kazuhiro Tahara
  • Patent number: 5303050
    Abstract: Disclosed is a video camera apparatus including a video camera for generating a video signal and a camera control unit for generating a control signal for controlling the video camera. The camera control unit includes a video signal receiver, a video/reference signal phase comparator, a phase difference signal transmitter, a video signal memory, and write and read clock signal generators. The video camera comprises a phase difference signal receiver, a synchronizing signal generator, a synchronizing signal phase controller, an image pickup device and a video signal transmitter. In this setup, the output video signal is generated under stable genlock control for radio communication between video camera and camera control unit.
    Type: Grant
    Filed: May 26, 1992
    Date of Patent: April 12, 1994
    Assignee: Sony Corporation
    Inventors: Yoshikazu Nishimura, Takashi Nakamura
  • Patent number: 5280363
    Abstract: Image signals of moving subjects which are imaged by a slit camera, and time information generated by a time information generator after it has been reset by a start trigger signal, are successively stored in and erased from a large-storage-capacity memory on a first-in, first-out basis. After elapse of a predetermined time period after a record trigger signal has been supplied from a record trigger generator, a storage time control circuit controls the memory to stop storing and erasing the image signals and the time information, and keeps the image signals and the time information stored which have been stored before the memory stops storing and erasing the image signals and the time information. The image information of the subjects and the time information associated with the image information can be stored in the memory within a storage time that depends on the storage capacity of the memory.
    Type: Grant
    Filed: April 14, 1992
    Date of Patent: January 18, 1994
    Assignee: Sony Corporation
    Inventors: Takashi Nakamura, Shinji Kusuura, Masahiro Kawakami, Yoshikazu Nishimura
  • Patent number: 5148281
    Abstract: An iris control for a video camera which includes a manual adjuster and an automatic control. A video signal from an image pickup element is detected when it reaches a reference level. A unit to be activated for changing this iris is selectively changed-over between the manual and automatic control units, and the state of the iris is prevented from being changed when the unit to be activated is changed-over.
    Type: Grant
    Filed: February 19, 1991
    Date of Patent: September 15, 1992
    Assignee: Sony Corporation
    Inventors: Takashi Nakamura, Yoshikazu Nishimura
  • Patent number: 4633187
    Abstract: A demodulating circuit for an amplitude-modulated signal comprises an input terminal to be supplied with an input signal comprising at least a modulated carrier signal amplitude-modulated by an information signal, the modulated carrier signal having a predetermined phase; an oscillator for generating a first demodulating carrier the phase of which is displaced from that of the modulated carrier signal by 90.degree.
    Type: Grant
    Filed: April 26, 1985
    Date of Patent: December 30, 1986
    Assignee: Sony Corporation
    Inventors: Yoshikazu Nishimura, Yoshimi Yasukouchi, Hisao Asakura