Abstract: Disclosed is a seat including: sensors which includes a first cushion sensor provided at a seat cushion in a position corresponding to buttocks of an occupant, a second cushion sensor provided at the seat cushion and located farther frontward than the first cushion sensor, a first back sensor provided at a seat back and located in a lower position thereof, and a second back sensor provided at the seat back and located above the first back sensor; and a controller connected to the sensors and thereby allowed to acquire pressure values from the respective sensors. The controller is configured to identify the motion of the occupant based on outputs of at least two sensors of the first cushion sensor, the second cushion sensor, the first back sensor, and the second back sensor.

Abstract: A method for manufacturing a forged article, capable of improving the durability of a die for forging is provided. The method, includes forging a steel material, by using a die, by spraying or applying a water-soluble polymer lubricant containing 0.01 to 0.98 mass % of a water-soluble sulfate onto a working surface of the die, the die being made of a raw material having a constituent composition of by mass %, of 0.4 to 0.7% of C, 1.0% or less of Si, 1.0% or less of Mn, 4.0 to 6.0% of Cr, 2.0 to 4.0% of (Mo+½W), 0.5 to 2.5% of (V+Nb), 0 to 1.0% of Ni, 0 to 5.0% of Co, 0.02% or less of N, and a remnant composed of Fe and impurities, and having hardness of 55 to 60 HRC, and the die including a nitrided layer or a nitrosulfidized layer on the working surface thereof.

Abstract: A seat includes a seat body and a sensor configured to acquired information on an occupant seated on the seat body. The seat includes a coating as a location marker that marks a location of the sensor to render the location visually recognizable from outside the seat body.

Abstract: Disclosed is a seat including: sensors which includes a first cushion sensor provided at a seat cushion in a position corresponding to buttocks of an occupant, a second cushion sensor provided at the seat cushion and located farther frontward than the first cushion sensor, a first back sensor provided at a seat back and located in a lower position thereof, and a second back sensor provided at the seat back and located above the first back sensor; and a controller connected to the sensors and thereby allowed to acquire pressure values from the respective sensors. The controller is configured to identify the motion of the occupant based on outputs of at least two sensors of the first cushion sensor, the second cushion sensor, the first back sensor, and the second back sensor.

Abstract: A resin filler tube includes: a tubular body; a flange having a diameter greater than an outer diameter of the tubular body, a thickness greater than a thickness of the tubular body, and a predetermined width in an axial direction, and having a first axial end face forming a weld surface to be welded to an outer circumferential edge of an opening hole of a fuel tank; and a base-end-side reverse tapered portion which connects between an end of the tubular body on the fuel tank side and an end of an outer circumferential surface of the flange on a side opposite to the fuel tank side, and which is reversely tapered so as to increase a diameter toward the flange. The base-end-side reverse tapered portion has an inner diameter that is not less than an inner diameter of the tubular body over an entire range in the axial direction.

Abstract: There is provided a pit initiation evaluation system or the like capable of predicting pit initiation effectively and at low cost. In a pit initiation evaluation system of an embodiment, a pit initiation evaluation unit creates and retains, based on a dry-wet alternate time data, a deposit impurity concentration data, and a pit initiation data on pitting corrosion initiated in each of a plurality of turbine stages when an operation is actually performed in the steam turbine, a pit initiation evaluation table presenting a relationship between a dry-wet alternate time, a deposit impurity concentration, and pit initiation. Further, the pit initiation evaluation unit is configured to evaluate, by using the pit initiation evaluation table, pitting corrosion to be initiated in each of the plurality of turbine stages in an operation planned for the steam turbine.

Abstract: A semiconductor memory device comprises a first memory cell and a second memory cell. The semiconductor memory device is configured to be able to perform: a first operation which is a read operation or the like to the first memory cell; and a second operation which is a read operation or the like to the second memory cell. The semiconductor memory device transitions to a standby mode after performing the first operation in response to an input of a first command set and a second command set. The semiconductor memory device performs a charge share operation after the standby mode is released in response to an input of a third command set and a fourth command set during the standby mode. The semiconductor memory device performs the second operation using at least a part of an electric charge generated when the first operation is performed.

Abstract: A workpiece grinding method includes a rotary-shaft direction grinding step of grinding a back surface of a workpiece by relatively moving a grinding wheel and a chuck table holding a front surface of the workpiece toward each other along an axis of a rotary shaft of the chuck table, the grinding wheel including a plurality of grinding stones that have outer peripheral surfaces defining a circle of a diameter not greater than a radius of the workpiece, and a radially directed grinding step of grinding the back surface of the workpiece by relatively moving the grinding wheel and the chuck table in a radial direction of the chuck table. The radially directed grinding step includes one of or both an inwardly directed grinding step of relatively moving the grinding wheel and the chuck table, and an outwardly directed grinding step of relatively moving the grinding wheel and the chuck table.

Abstract: A workpiece has a device area and a peripheral area surrounding the device area on a front surface side thereof. A workpiece grinding method includes a groove forming step of performing grinding feed of a grinding unit while a spindle is rotated, and grinding a predetermined area on a back surface side of the workpiece, the predetermined area corresponding to the device area, in a state in which a chuck table holding the workpiece is not rotated, thereby forming a groove on the back surface side, a groove removing step of starting rotation of the chuck table while the spindle is kept rotating, thereby grinding side walls of the groove and removing the groove, and a recess forming step of performing grinding feed of the grinding unit while the spindle and the chuck table are rotated, thereby grinding the predetermined area and forming a recess and a ring-shaped reinforcement part.

Abstract: There is provided a grinding method that is applied when a workpiece having a first surface and a second surface is to be ground from the second surface. The grinding method includes a first grinding step of causing first grindstones to come into contact with the workpiece to grind the workpiece and thereby form on the workpiece a circular plate-shaped first thin plate portion and an annular first thick plate portion surrounding the first thin plate portion, and a second grinding step of causing second grindstones to come into contact with the first thick plate portion and the first thin plate portion to grind the workpiece and thereby form on the workpiece a thin circular plate-shaped second thin plate portion that has a larger diameter than the first thin plate portion and an annular second thick plate portion surrounding the second thin plate portion.

Abstract: A continuous hot-dip galvanizing apparatus has a vertical annealing furnace, one or more hearth rolls, a hot-dip galvanizing apparatus, an alloying line, and humidified gas supply ports. When the steel sheet having a Si content of 0.2 mass % or more is conveyed inside the annealing furnace, the humidified gas supply ports positioned in a latter part of the soaking zone supply the humidified gas to the soaking zone and the at least one dry gas supply port supplies the dry gas to the soaking zone. When the steel sheet having a Si content of less than 0.2 mass % is conveyed inside the annealing furnace, the plurality of the humidified gas supply ports do not supply the humidified gas to the soaking zone and the at least one dry gas supply port supplies the dry gas to the soaking zone.

Abstract: A workpiece grinding method includes a groove formation step, a groove removal step, and a full surface grinding step. In the groove formation step, the workpiece is ground by performing grinding feed of a grinding unit while rotating a spindle without rotation of a chuck table, so that an arcuate groove is formed with a depth not reaching a finish thickness on a side of a back surface of the workpiece. In the groove removal step, rotation of the chuck table is started with the spindle kept rotating, so that the groove is ground at side walls thereof and is removed from the workpiece. In the full surface grinding step, grinding feed of the grinding unit is performed while the spindle and chuck table are rotated, so that the workpiece is ground in an entirety thereof on the side of the back surface until the workpiece has the finish thickness.

Abstract: A dressing ring includes a ring-shaped dressing member for dressing a processing stone. Preferably, the dressing member has an opening in which a workpiece is arranged when the workpiece is ground. Also preferably, the dressing ring further includes a ring-shaped support plate having an upper surface on which the dressing member is fixed. In addition, a grinding method of the workpiece includes the steps of holding the ring-shaped dressing member on a holding surface of a chuck table, holding the workpiece in the opening of the dressing member such that a back surface of the workpiece is located higher than the upper surface of the dressing member, grinding the workpiece by grinding stones of a grinding wheel, and dressing the grinding stones with the dressing member on the holding surface.

Abstract: Provided is a method for manufacturing a high-strength galvanized steel sheet. Heating in a first half of oxidizing treatment is performed at a temperature of 400° C. to 750° C. in an atmosphere having a particular O2 concentration and a particular H2O concentration, and heating in a second half of the oxidizing treatment is performed at a temperature of 600° C. to 850° C. in an atmosphere having a particular O2 concentration and a particular H2O concentration. Subsequently, heating in a heating zone for reduction annealing is performed to a temperature of 650° C. to 900° C. at a particular heating rate in an atmosphere having a particular H2 concentration and a particular H2O concentration with the balance being N2 and inevitable impurities, and soaking in a soaking zone for the reduction annealing is performed in an atmosphere having a particular H2 concentration and a particular H2O concentration with the balance being N2 and inevitable impurities.

Abstract: A continuous hot-dip galvanizing apparatus has a vertical annealing furnace, one or more hearth rolls, a hot-dip galvanizing apparatus, an alloying line, and humidified gas supply ports. When the steel sheet having a Si content of 0.2 mass % or more is conveyed inside the annealing furnace, the humidified gas supply ports positioned in a latter part of the soaking zone supply the humidified gas to the soaking zone and the at least one dry gas supply port supplies the dry gas to the soaking zone. When the steel sheet having a Si content of less than 0.2 mass % is conveyed inside the annealing furnace, the plurality of the humidified gas supply ports do not supply the humidified gas to the soaking zone and the at least one dry gas supply port supplies the dry gas to the soaking zone.

Abstract: A workpiece has a device area and a peripheral area surrounding the device area on a front surface side thereof. A workpiece grinding method includes a groove forming step of performing grinding feed of a grinding unit while a spindle is rotated, and grinding a predetermined area on a back surface side of the workpiece, the predetermined area corresponding to the device area, in a state in which a chuck table holding the workpiece is not rotated, thereby forming a groove on the back surface side, a groove removing step of starting rotation of the chuck table while the spindle is kept rotating, thereby grinding side walls of the groove and removing the groove, and a recess forming step of performing grinding feed of the grinding unit while the spindle and the chuck table are rotated, thereby grinding the predetermined area and forming a recess and a ring-shaped reinforcement part.

Abstract: A workpiece surface is polished by a polishing pad surface by keeping a point on an outer circumferential edge of the workpiece surface at predetermined coordinates, i.e., first coordinates, in a plane parallel to the workpiece surface but out of contact with the polishing pad surface, and keeping a point on the outer circumferential edge of the polishing pad surface at other coordinates, i.e., third coordinates, in the coordinate plane in contact with an outer circumferential edge of the workpiece surface. In this manner, the workpiece surface is polished in its entirety, and a region of the polishing pad surface in the vicinity of the outer circumferential edge thereof can be worn to the same degree as a region that is located inwardly of the above region. The polishing pad surface is thus prevented from developing a stepped profile due to the polishing of the workpiece surface.

Abstract: A grinding method of grinding a first surface side of a wafer having an oxide film on the first surface includes a first grinding step of putting a grinding unit into grinding feeding while rotating a grinding wheel, rotating a chuck table holding under suction a second surface side at a first rotating speed, thereby causing lower surfaces of grindstones to break through the oxide film, then scraping off the oxide film by side surfaces of the grindstones, and forming a step in a circumferential direction of the wafer, a grinding unit raising step of spacing the grindstones from the wafer, and a second grinding step of putting the grinding unit into grinding feeding while rotating the grinding wheel to grind the wafer, in a state in which the chuck table holding under suction a second surface is rotated at a second rotating speed higher than the first rotating speed.

Abstract: There is provided a processing method of grinding a workpiece. The processing method includes a holding step of holding the workpiece on a side of its front surface on a chuck table, a coarse grinding step of grinding the workpiece on a side of its back surface with first grinding stones until the workpiece has a predetermined thickness, an auxiliary grinding step of grinding the workpiece on the side of its back surface with the first grinding stones such that an unground region remains at an outer peripheral portion of the workpiece, an unground region grinding step of grinding the unground region with second grinding stones having an average abrasive grain size smaller than that of the first grinding stones, and a finish grinding step of grinding the workpiece on the side of its back surface with the second grinding stones until the workpiece has a predetermined finish thickness.

Abstract: A method of grinding a workpiece includes a first grinding step of adjusting the relative tilt of a chuck table and a grinding wheel to a first state and bringing grindstones into abrasive contact with the workpiece to grind the workpiece, and a second grinding step of adjusting the relative tilt of the chuck table and the grinding wheel to a second state that is different from the first state and bringing the grindstones into abrasive contact with the workpiece to grind the workpiece. In the second grinding step, the workpiece is ground under a condition for causing the workpiece to have a smaller surface roughness than that in the first grinding step.