Patents by Inventor Yoshiki Oka

Yoshiki Oka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10328511
    Abstract: A laser assembly is disclosed. The laser assembly includes a carrier for mounting a semiconductor laser diode (LD) and a capacitor thereon. The carrier provides, in a top surface thereof, a metal pattern having a die area for mounting the LD through a brazing material, a mounting area, and an auxiliary area for absorbing a surplus brazing material. The capacitor is mounted on the mounting area closer to the LD through another brazing material.
    Type: Grant
    Filed: December 29, 2015
    Date of Patent: June 25, 2019
    Assignee: SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
    Inventor: Yoshiki Oka
  • Publication number: 20170225250
    Abstract: A laser assembly is disclosed. The laser assembly includes a carrier for mounting a semiconductor laser diode (LD) and a capacitor thereon. The carrier provides, in a top surface thereof, a metal pattern having a die area for mounting the LD through a brazing material, a mounting area, and an auxiliary area for absorbing a surplus brazing material. The capacitor is mounted on the mounting area closer to the LD through another brazing material.
    Type: Application
    Filed: December 29, 2015
    Publication date: August 10, 2017
    Applicant: SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
    Inventor: Yoshiki Oka
  • Publication number: 20160129513
    Abstract: A laser assembly is disclosed. The laser assembly includes a carrier for mounting a semiconductor laser diode (LD) and a capacitor thereon. The carrier provides, in a top surface thereof, a metal pattern having a die area for mounting the LD through a brazing material, a mounting area, and an auxiliary area for absorbing a surplus brazing material. The capacitor is mounted on the mounting area closer to the LD through another brazing material.
    Type: Application
    Filed: December 29, 2015
    Publication date: May 12, 2016
    Applicant: SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
    Inventor: Yoshiki Oka
  • Patent number: 9206708
    Abstract: A steam turbine direct contact condenser prevents cooling water sprayed from spray nozzles from reaching turbine blades of an axial-flow turbine, while introducing turbine exhaust gases exhausted by a steam turbine in the horizontal direction to cool such gases. The condenser includes an exhaust gas inlet part that introduces the turbine exhaust gases containing steam of the steam turbine and non-condensable gases in the horizontal direction, a steam cooling chamber that sprays cooling water to the introduced turbine exhaust gases to cool them, and a water storage disposed at the bottom of the steam cooling chamber that stores condensed water cooled from the steam and the cooling water. The steam cooling chamber includes a first cooling water spraying mechanism and a second cooling water spraying mechanism.
    Type: Grant
    Filed: July 13, 2012
    Date of Patent: December 8, 2015
    Assignee: Fuji Electric Co., Ltd.
    Inventors: Takashi Moriyama, Ryoji Muramoto, Yoshiki Oka
  • Publication number: 20130152589
    Abstract: A steam turbine direct contact condenser prevents cooling water sprayed from spray nozzles from reaching turbine blades of an axial-flow turbine, while introducing turbine exhaust gases exhausted by a steam turbine in the horizontal direction to cool such gases. The condenser includes an exhaust gas inlet part that introduces the turbine exhaust gases containing steam of the steam turbine and non-condensable gases in the horizontal direction, a steam cooling chamber that sprays cooling water to the introduced turbine exhaust gases to cool them, and a water storage disposed at the bottom of the steam cooling chamber that stores condensed water cooled from the steam and the cooling water. The steam cooling chamber includes a first cooling water spraying mechanism and a second cooling water spraying mechanism.
    Type: Application
    Filed: July 13, 2012
    Publication date: June 20, 2013
    Applicant: FUJI ELECTRIC CO., LTD.
    Inventors: Takashi Moriyama, Ryoji Muramoto, Yoshiki Oka
  • Publication number: 20120138665
    Abstract: A method for fabricating an optical semiconductor device, including: melting a solder supplied on a carrier; mounting a semiconductor laser chip on the melted solder with a tool for holding the semiconductor laser chip; cooling the solder; releasing the tool from the semiconductor laser chip after the solder is cooled; remelting the solder after the tool is released from the semiconductor laser chip; and recooling the remelted solder.
    Type: Application
    Filed: December 5, 2011
    Publication date: June 7, 2012
    Applicant: SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
    Inventor: Yoshiki Oka
  • Patent number: 5307297
    Abstract: In a data processor having a box type unit in which a keyboard and a folding display are incorporated, the data processor includes a main unit which has a receiver for wireless signals on an external side wall close to a supporter for pivotally supporting the folding display, and an auxiliary input apparatus having a case unit and a wireless signal transmitting unit at a corner of said case unit which is opposed to the receiving unit of said main unit when juxtaposed with said keyboard.
    Type: Grant
    Filed: May 5, 1992
    Date of Patent: April 26, 1994
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Shigeki Iguchi, Yukihiko Ueno, Seiichi Senoo, Tomoyuki Yano, Tokuyuki Shirasuka, Akira Mitarai, Yoshitaka Fukuma, Yoshito Kataoka, Hirofumi Nishikawa, Yasumasa Yamanaka, Yoshiki Oka, Masashi Hara, Masaharu Satoh