Abstract: To provide a technique capable of handling quantitative data in a spectrum type microparticle measurement device without causing deterioration of the SNR. The present technology provides a microparticle measurement spectrometer including: a spectroscopic element that disperses light emitted from microparticles flowing through a flow path; and a photoelectric conversion array that has a plurality of light receiving elements having different detection wavelength ranges and converts optical information obtained by the light receiving elements into electrical information, in which the photoelectric conversion array has a uniform output of all channels when light with which the amount of light per unit wavelength becomes same is incident.

Abstract: To provide a technique capable of handling quantitative data in a spectrum type microparticle measurement device without causing deterioration of the SNR. The present technology provides a microparticle measurement spectrometer including a spectroscopic element that disperses light emitted from microparticles flowing through a flow path, and a photoelectric conversion array that has a plurality of light receiving elements having different detection wavelength ranges and converts optical information obtained by the light receiving elements into electrical information, in which the photoelectric conversion array has a uniform output of all channels when light with which the amount of light per unit wavelength becomes same is incident.

Abstract: A substrate cleaning apparatus includes a holder configured to hold a substrate; a circular ring-shaped body; grooves formed in a radial shape at an upper portion of the circular ring-shaped body, each groove having a bottom located on the circular ring-shaped body; a sliding surface which is a top surface of the circular ring-shaped body between the respective grooves, and configured to be slid on a bottom surface of the substrate; a supporting body configured to support and rotate the circular ring-shaped body in a circumferential direction; a cleaning liquid supply configured to allow a cleaning liquid to be absorbed into the circular ring-shaped body; and a relatively moving mechanism configured to move the substrate and the supporting body relative to each other in a state that the sliding surface being rotated and having absorbed the cleaning liquid presses the bottom surface of the substrate.

Abstract: A substrate cleaning apparatus configured to clean a surface of a substrate having a circular shape by bringing a cleaning member into contact with the surface of the substrate and rotating the substrate and the cleaning member relatively is provided. A contact region of the cleaning member which comes into contact with the surface of the substrate is widened in a radial shape from a center side of the substrate toward a peripheral side thereof.

Abstract: A detection optical system includes an objective lens, a first relay lens, a second relay lens, and an imaging lens, which are arranged in order from a side of a specimen along an optical path of light from the specimen illuminated by a light source. A primary imaging plane is provided on the optical path between the first relay lens and the second relay lens. An aspherical correction plate that corrects spherical aberration is arranged at a position located between the second relay lens and the imaging lens and substantially conjugate with a pupil position of the objective lens.

Abstract: A substrate processing apparatus includes a polishing member having a polishing surface configured to perform a polishing of a main surface of a substrate; a first dressing member having a first dressing surface configured to perform a dressing of the polishing surface; a second dressing member having a second dressing surface configured to perform a dressing of the first dressing surface; a holding member configured to hold the polishing member and the second dressing member; and a driving unit configured to, by moving the holding member, switch a first state in which the first dressing surface and the polishing surface come into contact with each other to perform the dressing of the polishing surface and a second state in which the first dressing surface and the second dressing surface come into contact with each other to perform the dressing of the first dressing surface.

Abstract: To make multicolor analysis possible while suppressing an increase in size. An optical measuring device according to an embodiment includes: a spectroscopic optical system (37A to 37E) that spectrally disperses a fluorescent ray emitted from a specimen that passes through each of a plurality of irradiation spots arrayed in a first direction in a second direction included in a plane parallel to the first direction; and an image sensor (34) that receives the fluorescent ray spectrally dispersed by the spectroscopic optical system and generates image data. The second direction is inclined with respect to a plane vertical to the first direction.

Abstract: The present invention relates to a membrane separation system including a plurality of separation membrane elements connected to one another, each of the separation membrane elements including a plurality of separation membrane pairs, each separation membrane pair including separation membranes each having a feed-side surface and a permeate-side surface and disposed such that the feed-side surfaces face each other, in which the plurality of separation membrane elements include a first separation membrane element and a second separation membrane element, and at least one first separation membrane element serves as a stage preceding the second separation membrane element.

Abstract: To provide a microparticle measurement technology capable of supporting excitation light in a wideband wavelength range. The present technology provides a microparticle measurement device provided with a plurality of objective lenses for excitation light irradiation used for irradiating microparticles flowing through a flow path with excitation light, in which at least one of the objective lenses for excitation light irradiation is used for detecting scattered light emitted from the microparticles by the excitation light with which the microparticles are irradiated through another one of the objective lenses for excitation light irradiation.

Abstract: To provide a technique capable of handling quantitative data in a spectrum type microparticle measurement device without causing deterioration of the SNR. The present technology provides a microparticle measurement spectrometer including: a spectroscopic element that disperses light emitted from microparticles flowing through a flow path; and a photoelectric conversion array that has a plurality of light receiving elements having different detection wavelength ranges and converts optical information obtained by the light receiving elements into electrical information, in which the photoelectric conversion array has a uniform output of all channels when light with which the amount of light per unit wavelength becomes same is incident.

Abstract: A dressing apparatus includes a bus member which is equipped with a ceiling plate and a circular or polygonal cylindrical skirt portion provided at a bottom surface of the ceiling plate and which is configured to accommodate a polishing pad from thereabove. The bus member includes a dual fluid nozzle configured to jet a cleaning liquid and a gas onto a polishing surface of the polishing pad; a dress board configured to come into contact with the polishing surface of the polishing pad; and a rinse nozzle configured to supply a rinse liquid onto a contact surface between the polishing surface of the polishing pad and the dress board. A cleaning liquid, a fragment of a grindstone or a sludge is suppressed from being scattered around by the skirt portion.

Abstract: A substrate cleaning apparatus configured to clean a surface of a substrate having a circular shape by bringing a cleaning member into contact with the surface of the substrate and rotating the substrate and the cleaning member relatively is provided. A contact region of the cleaning member which comes into contact with the surface of the substrate is widened in a radial shape from a center side of the substrate toward a peripheral side thereof.

Abstract: According to the present invention, even when a high recovery ratio operation is performed, the influence of concentration of ingredients to be separated in the feed fluid can be reduced, the concentration polarization can be prevented by increasing the turbulence effect on the membrane surface, and the fluid permeation performance and the separation performance of the separation membrane element can be maintained.

Abstract: A dressing apparatus 200 includes a bus member 203 which is equipped with a ceiling plate 201 and a circular or polygonal cylindrical skirt portion 202 provided at a bottom surface of the ceiling plate 201 and which is configured to accommodate a polishing pad 131 from thereabove. The bus member 203 includes a dual fluid nozzle 204 configured to jet a cleaning liquid and a gas onto a polishing surface of the polishing pad 131; a dress board 205 configured to come into contact with the polishing surface of the polishing pad 131; and a rinse nozzle 206 configured to supply a rinse liquid onto a contact surface between the polishing surface of the polishing pad 131 and the dress board 205. A cleaning liquid, a fragment of a grindstone or a sludge is suppressed from being scattered around by the skirt portion 202.

Abstract: In order to provide a composite semipermeable membrane which combines strength and water permeability, the present invention provides a composite semipermeable membrane including: a supporting membrane including a substrate and a porous support; and a separation functional layer disposed on the porous support, in which the substrate has a weight A per unit area, a portion of the porous support which is located within the substrate has a weight B per unit area, and a sum of the weight A and the weight B, (A+B), is 30 to 100 g/m2, and a ratio between the weight A and the weight B, B/A, is 0.10 to 0.60.

Abstract: A substrate warpage correction method according to this disclosure corrects warpage of a substrate without performing a process on a front surface of the substrate. The substrate warpage correction method includes a surface roughening of performing a surface roughening process on a rear surface of the substrate using a surface roughening processing apparatus configured to be able to perform the surface roughening process on the rear surface of the substrate, to form grooves in the rear surface to thereby correct the warpage of the substrate.

Abstract: The present invention relates to a membrane separation system including a plurality of separation membrane elements connected to one another, each of the separation membrane elements including a plurality of separation membrane pairs, each separation membrane pair including separation membranes each having a feed-side surface and a permeate-side surface and disposed such that the feed-side surfaces face each other, in which the plurality of separation membrane elements include a first separation membrane element and a second separation membrane element, and at least one first separation membrane element serves as a stage preceding the second separation membrane element.

Abstract: There is provided a microchip including a plurality of substrate layers having a flow path in which a liquid containing microparticles flows in at least one of the substrate layers, the microchip at least including: an optical radiation region in which light is radiated to microparticles contained in a fluid flowing in the flow path from a side surface of the substrate layers.

Abstract: A substrate processing apparatus includes a polishing member having a polishing surface configured to perform a polishing of a main surface of a substrate; a first dressing member having a first dressing surface configured to perform a dressing of the polishing surface; a second dressing member having a second dressing surface configured to perform a dressing of the first dressing surface; a holding member configured to hold the polishing member and the second dressing member; and a driving unit configured to, by moving the holding member, switch a first state in which the first dressing surface and the polishing surface come into contact with each other to perform the dressing of the polishing surface and a second state in which the first dressing surface and the second dressing surface come into contact with each other to perform the dressing of the first dressing surface.

Abstract: A substrate processing apparatus includes: a first holding part configured to hold a substrate; a second holding part configured to hold the substrate; a sliding member configured to rotate about a vertical axis so that the sliding member slides on a back surface of the substrate; a revolution mechanism configured to revolve the sliding member under rotation about a vertical revolution axis; and a relative movement mechanism configured to horizontally move a relative position between the substrate and a revolution trajectory of the sliding member so that when the substrate is held by the first holding part, the sliding member slides on a central portion of the back surface of the substrate, and when the substrate is held by the second holding part, the sliding member slides on the peripheral portion of the back surface of the substrate under rotation.