Patents by Inventor Yoshiki Yabuhara

Yoshiki Yabuhara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of packaging compound semiconductor substrates
    Patent number: 8381493
    Abstract: Affords a compound semiconductor substrate packaging method for preventing oxidation of the surface of compound semiconductor substrates.
    Type: Grant
    Filed: March 27, 2009
    Date of Patent: February 26, 2013
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Takayuki Nishiura, Yoshio Mezaki, Yoshiki Yabuhara
  • Method of Packaging Compound Semiconductor Substrates
    Publication number: 20090249747
    Abstract: Affords a compound semiconductor substrate packaging method for preventing oxidation of the surface of compound semiconductor substrates.
    Type: Application
    Filed: March 27, 2009
    Publication date: October 8, 2009
    Applicant: Sumitomo Electric Industries, Ltd.
    Inventors: Takayuki Nishiura, Yoshio Mezaki, Yoshiki Yabuhara