Abstract: It is related to improving a performance of a semiconductor device and suppressing yield deterioration. Using a resist pattern as a mask, an ion-implantation is performed from an upper surface of a semiconductor substrate to form an ion-implanted layer in the semiconductor substrate. By subsequently, another ion-implantation is performed. Then, another ion-implanted layer is formed in the semiconductor substrate so as to overlap with the ion-implanted layer. Next, a heat treatment is performed on the semiconductor substrate to diffuse impurities contained in the ion-implanted layers, thereby an p-type floating region is formed.

Abstract: An information notification system notifies a user of a vehicle of information. A first condition is that one or more time-designated speed limit signs recognized by a camera mounted on the vehicle designate all times of day as a whole. The information notification system determines whether or not the first condition is satisfied. When the first condition is not satisfied, the information notification system notifies the user of at least a legal speed limit on a road on which the one or more time-designated speed limit signs are installed, based on reference information on the legal speed limit in a region in which the vehicle is used.

Abstract: A fixing device includes a fixing rotator, a pressure rotator, a heater inside the fixing rotator, a reflector, and a sliding member. The pressure rotator is in contact with the fixing rotator to form a nip and presses a recording medium passing through the nip. The reflector includes a reflecting portion that reflects radiant heat radiated by the heater toward an inner circumferential surface of the fixing rotator and a pressure receiving portion that receives a pressing force of the pressure rotator via the fixing rotator. The pressure receiving portion is thermally coupled to the reflecting portion. The sliding member is between the pressure receiving portion and the fixing rotator and in contact with the pressure receiving portion and the fixing rotator. With respect to the inner circumferential surface of the fixing rotator, the sliding member has a smaller friction coefficient than a surface of the pressure receiving portion.

Abstract: The fixing device includes a fixing member, a heat source, a pressure member, a nip forming member, and a heat equalizing member. The heat equalizing member covers a face of the nip forming member, the face facing the fixing member, and transfers heat in an axial direction of the fixing member. The fixing member includes at least a tubular base made of metal and a sliding layer made of heat resistant resin on an inner circumferential surface of the base. The heat equalizing member made of aluminum or an aluminum alloy includes an alumite layer on a surface facing an inner circumferential surface of the fixing member. A plurality of micropores in the alumite layer is filled with a solid lubricant having a coefficient of friction lower than that of the alumite layer. The alumite layer has a thickness smaller than that of the sliding layer of the fixing member.

Abstract: A method of producing a semiconductor device, the method includes steps of: detecting a defect included in a semiconductor layer; forming a metal film on the semiconductor layer; after forming the metal film on the semiconductor layer, exposing the semiconductor layer through the metal film by removing a portion of the metal film by irradiation with a first laser emitting red or infrared light; and after the step of exposing the semiconductor layer, removing a portion of the semiconductor layer by irradiation with a second laser emitting ultraviolet light, said portion of the semiconductor layer including the defect. A diameter of said portion of the metal film is greater than a diameter of said portion of the semiconductor layer in a plan view. Said portion of the metal film overlaps with said portion of the semiconductor layer in the plan view.

Abstract: A nip formation pad includes a base, a high thermal conduction member, and an attachment. The high thermal conduction member has a thermal conductivity greater than a thermal conductivity of the base. The attachment is attached to the high thermal conduction member by elastic deformation of the attachment on the base held between the high thermal conduction member and the attachment.

Abstract: Provided is an adaptor including: a housing; and a terminal held by the housing, in which the housing includes: a first mating recess opening in a first opening direction; a plurality of second mating recesses opening in a second opening direction opposite to the first opening direction; and a projection portion, the terminal includes: a first contact portion extending in the first opening direction in the first mating recess; and a plurality of second contact portions extending in the second opening direction in the plurality of second mating recesses, respectively, and the projection portion is configured to protrude in the first opening direction from an inner surface, which is orthogonal to the first opening direction, of the first mating recess along the first contact portion in the first mating recess.

Abstract: A fixing device includes a fixing rotator, a pressure rotator, a heater inside the fixing rotator, a reflector, and a sliding member. The pressure rotator is in contact with the fixing rotator to form a nip and presses a recording medium passing through the nip. The reflector includes a reflecting portion that reflects radiant heat radiated by the heater toward an inner circumferential surface of the fixing rotator and a pressure receiving portion that receives a pressing force of the pressure rotator via the fixing rotator. The pressure receiving portion is thermally coupled to the reflecting portion. The sliding member is between the pressure receiving portion and the fixing rotator and in contact with the pressure receiving portion and the fixing rotator. With respect to the inner circumferential surface of the fixing rotator, the sliding member has a smaller friction coefficient than a surface of the pressure receiving portion.

Abstract: A nip former that forms a nip between an endless belt and a pressure rotator includes a base that is made of aluminum and has a nip forming face disposed opposite the nip. An anodic oxidation coating is treated with sealing and coats at least the nip forming face. The anodic oxidation coating has a thickness that is not smaller than 22 ?m and is not greater than 45 ?m and a variation in thickness that is not greater than 20 percent. The base and the anodic oxidation coating define a nip forming portion that is disposed opposite the nip. The nip forming portion has a thickness that is not smaller than 0.40 mm and is not greater than 1.20 mm.

Abstract: A nip former that forms a nip between an endless belt and a pressure rotator includes a base that is made of aluminum and has a nip forming face disposed opposite the nip. An anodic oxidation coating is treated with sealing and coats at least the nip forming face. The anodic oxidation coating has a thickness that is not smaller than 22 ?m and is not greater than 45 ?m and a variation in thickness that is not greater than 20 percent. The base and the anodic oxidation coating define a nip forming portion that is disposed opposite the nip. The nip forming portion has a thickness that is not smaller than 0.40 mm and is not greater than 1.20 mm.

Abstract: A population of antibodies including homogeneous antibodies in which N-linked complex sugar chains attached to asparagine (Asn) at position 297 of CH domains of Fc regions of two heavy chains on the left and the right of each antibody are sugar chains structurally different from each other is described as well as a method of producing the population of antibodies.

Abstract: The fixing device includes a fixing member, a heat source, a pressure member, a nip forming member, and a heat equalizing member. The heat equalizing member covers a face of the nip forming member, the face facing the fixing member, and transfers heat in an axial direction of the fixing member. The fixing member includes at least a tubular base made of metal and a sliding layer made of heat resistant resin on an inner circumferential surface of the base. The heat equalizing member made of aluminum or an aluminum alloy includes an alumite layer on a surface facing an inner circumferential surface of the fixing member. A plurality of micropores in the alumite layer is filled with a solid lubricant having a coefficient of friction lower than that of the alumite layer. The alumite layer has a thickness smaller than that of the sliding layer of the fixing member.

Abstract: A nip formation pad includes a base, a high thermal conduction member, and an attachment. The high thermal conduction member has a thermal conductivity greater than a thermal conductivity of the base. The attachment is attached to the high thermal conduction member by elastic deformation of the attachment on the base held between the high thermal conduction member and the attachment.

Abstract: A fixing device includes an endless belt that rotates and is heated by a heat source. A thermal conduction aid includes a contact portion, an upstream bent portion, and a downstream bent portion. The contact portion contacts the endless belt. The upstream bent portion and the downstream bent portion are disposed upstream and downstream from the contact portion in a rotation direction of the endless belt, respectively, and are extended in a longitudinal direction of the thermal conduction aid. A recess is disposed in at least one of the upstream bent portion and the downstream bent portion. The recess spans a center of the thermal conduction aid in the longitudinal direction thereof and is recessed from an edge of the at least one of the upstream bent portion and the downstream bent portion in a short direction thereof.

Abstract: A nip forming member includes a base material and a thermal conductive member that overlaps the base material and has a higher thermal conductivity than a thermal conductivity of the base material. The base material has protrusions projecting to one side or another side in a short direction on a part of a longitudinal direction on both sides in the short direction. The thermal conductive member has fitting holes into which the protrusions are fitted in both sides in the short direction.

Abstract: A fixing device includes an endless belt that rotates and is heated by a heat source. A thermal conduction aid includes a contact portion, an upstream bent portion, and a downstream bent portion. The contact portion contacts the endless belt. The upstream bent portion and the downstream bent portion are disposed upstream and downstream from the contact portion in a rotation direction of the endless belt, respectively, and are extended in a longitudinal direction of the thermal conduction aid. A recess is disposed in at least one of the upstream bent portion and the downstream bent portion. The recess spans a center of the thermal conduction aid in the longitudinal direction thereof and is recessed from an edge of the at least one of the upstream bent portion and the downstream bent portion in a short direction thereof.

Abstract: A heating device includes a first rotator, a heater, a second rotator to contact an outer surface of the first rotator, a nip formation pad inside a loop of the first rotator to form a nip, a thermal equalizer to cover a surface of the nip formation pad opposite the first rotator and transport heat in an axial direction of the first rotator, and a lubricant disposed between the thermal equalizer and the first rotator. The thermal equalizer has a plurality of concave portions on a surface opposite the inner surface of the first rotator. The concave portion has a shape substantially symmetrical with respect to a first center line extending in a longitudinal direction of the thermal equalizer and a second center line in a cross section of the concave portion viewed from a direction perpendicular to a direction of movement of the first rotator.

Abstract: A fixing device includes a fixing rotator that rotates and includes an inner face. A pressure rotator is disposed opposite the fixing rotator and rotates. A nip former sandwiches the fixing rotator together with the pressure rotator to form a nip between the fixing rotator and the pressure rotator. The nip former includes an outer face disposed opposite the inner face of the fixing rotator. The inner face of the fixing rotator and the outer face of the nip former sandwich a lubricant. At least one of the inner face of the fixing rotator and the outer face of the nip former includes a projection having a volume smaller than 0.3 ml/m2 and a recess having a spatial volume greater than 0.08 ml/m2. The volume and the spatial volume are three-dimensional surface roughness parameters, respectively, defined by the International Organization for Standardization 25178 standard in an initial state before the fixing rotator rotates.

Abstract: A fixing device includes a fixing rotator that rotates and includes an inner face. A pressure rotator is disposed opposite the fixing rotator and rotates. A nip former sandwiches the fixing rotator together with the pressure rotator to form a nip between the fixing rotator and the pressure rotator. The nip former includes an outer face disposed opposite the inner face of the fixing rotator. The inner face of the fixing rotator and the outer face of the nip former sandwich a lubricant. At least one of the inner face of the fixing rotator and the outer face of the nip former includes a projection having a volume smaller than 0.3 ml/m2 and a recess having a spatial volume greater than 0.08 ml/m2. The volume and the spatial volume are three-dimensional surface roughness parameters, respectively, defined by the International Organization for Standardization 25178 standard in an initial state before the fixing rotator rotates.

Abstract: A heating device includes a first rotator, a heater, a second rotator to contact an outer surface of the first rotator, a nip formation pad inside a loop of the first rotator to form a nip, a thermal equalizer to cover a surface of the nip formation pad opposite the first rotator and transport heat in an axial direction of the first rotator, and a lubricant disposed between the thermal equalizer and the first rotator. The thermal equalizer has a plurality of concave portions on a surface opposite the inner surface of the first rotator. The concave portion has a shape substantially symmetrical with respect to a first center line extending in a longitudinal direction of the thermal equalizer and a second center line in a cross section of the concave portion viewed from a direction perpendicular to a direction of movement of the first rotator.