Abstract: An electronic component package includes a case having a cavity portion including an electronic component therein, and a lid member which is fusion-welded to the case via a fusion-welding layer to hermetically seal the cavity portion. The case has a first metal layer laminated on the case so as to be exposed on the open side at the cavity portion. The lid member has a core portion, and a second metal layer laminated on a side of the core portion facing the case. The fusion-welding layer has a soldering material layer formed of a soldering material, and first and second intermetallic compound layers disposed on opposite sides of the soldering material layer as a result of diffusion of a major component of the soldering material into the first metal layer and the second metal layer.

Abstract: An electronic component package includes a case having a cavity portion including an electronic component therein, and a lid member which is fusion-welded to the case via a fusion-welding layer to hermetically seal the cavity portion. The case has a first metal layer laminated on the case so as to be exposed on the open side at the cavity portion. The lid member has a core portion, and a second metal layer laminated on a side of the core portion facing the case. The fusion-welding layer has a soldering material layer formed of a soldering material, and first and second intermetallic compound layers disposed on opposite sides of the soldering material layer as a result of diffusion of a major component of the soldering material into the first metal layer and the second metal layer.

Abstract: An electronic component package includes a case having a cavity portion including an electronic component therein, and a lid member which is fusion-welded to the case via a fusion-welding layer to hermetically seal the cavity portion. The case has a first metal layer laminated on the case so as to be exposed on the open side at the cavity portion. The lid member has a core portion, and a second metal layer laminated on a side of the core portion facing the case. The fusion-welding layer has a soldering material layer formed of a soldering material, and first and second intermetallic compound layers disposed on opposite sides of the soldering material layer as a result of diffusion of a major component of the soldering material into the first metal layer and the second metal layer.

Abstract: A quartz oscillator device of the present invention comprises a quartz oscillating plate having two major surfaces, each of which is formed with an excitation electrode and lead electrodes drawn out of the excitation electrode, and electrode pads formed on a base, wherein the quartz oscillating plate and the electrode pads are electrically connected via a silicone-based conductive adhesive. Among the excitation electrode and the lead electrodes, at least each of the lead electrodes comprises a Cr film layer, a Au film layer, and a thin Cr film layer or a thin Ag film layer, which are laminated on the quartz oscillating plate in this order. In addition, each electrode pad comprises a metallized layer made of tungsten or molybdenum, a Ni film layer and a Au film layer, which are laminated on the base in this order; and Ni in the Ni film layer is diffused at least into a predetermined area of the Au film layer in each electrode pad where the silicone-based conductive adhesive is applied.

Abstract: An electronic component package according to the present invention includes a case (1) having a cavity portion containing an electronic component therein, and a lid member (8) fusion-welded to the case (1) via a fusion-welding layer (20) to close the cavity portion hermetically. The case (1) has a first metal layer (5) laminated on the case (1) in a manner to be exposed on the cavity open side. The lid member (8) has a core portion (9), and a second metal layer (10) laminated on a side of the core portion (9) facing the case (1). The fusion-welding layer (20) has a soldering material layer (12A) formed of a soldering material, and first and second intermetallic compound layers (5A) and (10A), respectively, formed on opposite sides of the soldering material layer (12A) as a result of diffusion of a major component of the soldering material into the first metal layer (5) and the second metal layer (10).

Abstract: A quartz oscillator device of the present invention comprises a quartz oscillating plate having two major surfaces, each of which is formed with an excitation electrode and lead electrodes drawn out of the excitation electrode, and electrode pads formed on a base, wherein the quartz oscillating plate and the electrode pads are electrically connected via a silicone-based conductive adhesive. Among the excitation electrode and the lead electrodes, at least each of the lead electrodes comprises a Cr film layer, a Au film layer, and a thin Cr film layer or a thin Ag film layer, which are laminated on the quartz oscillating plate in this order. In addition, each electrode pad comprises a metallized layer made of tungsten or molybdenum, a Ni film layer and a Au film layer, which are laminated on the base in this order; and Ni in the Ni film layer is diffused at least into a predetermined area of the Au film layer in each electrode pad where the silicone-based conductive adhesive is applied.