Abstract: A multilayer coil component including: a magnetic part that contains Fe, Zn, V, and Ni and optionally contains Mn and/or Cu; and a conductor part that contains copper. In the magnetic part, Fe is in an amount of 34.0 to 48.5 mol % expressed as Fe2O3 equivalent, Zn is in an amount of 6.0 to 45.0 mol % expressed as ZnO equivalent, Mn is in an amount of 0 to 7.5 mol % expressed as Mn2O3 equivalent, Cu is in an amount of 0 to 5.0 mol % expressed as CuO equivalent, and V is in an amount of 0.5 to 5.0 mol % expressed as V2O5 equivalent, with respect to the total amount of Fe expressed as Fe2O3 equivalent, Zn expressed as ZnO equivalent, V expressed as V2O5 equivalent, and Ni expressed as NiO equivalent, and optionally present Cu expressed as CuO equivalent and optionally present Mn expressed as Mn2O3 equivalent.

Abstract: A laminated coil component that can use inexpensive copper as an internal conductor, and has excellent direct current superimposition characteristics is provided. In a laminated coil component including: a magnetic section including a ferrite material; a non-magnetic section including a non-magnetic ferrite material; and a coiled conductor section containing copper as a main component embedded inside the magnetic section and the non-magnetic section, the non-magnetic section contains at least Fe, Mn and Zn, and optionally Cu. The non-magnetic section has a Fe content of 40.0 mol % to 48.5 mol % in terms of Fe2O3, a Mn content of 0.5 mol % to 9 mol % in terms of Mn2O3 and a Cu content of 8 mol % or less in terms of CuO.

Abstract: A multilayer coil component including a magnetic part formed of a ferrite material, a non-magnetic part formed of a non-magnetic ferrite material, and a coiled conductive part embedded in the magnetic part and the non-magnetic part. The non-magnetic part has an Fe content of 36.0 to 48.5 mol % in terms of Fe2O3, a Zn content of 46.0 to 57.5 mol % in terms of ZnO, a V content of 0.5 to 5.0 mol % in terms of V2O5, a Mn content of 0 to 7.5 mol % in terms of Mn2O3, and a Cu content of 0 to 5.0 mol % in terms of CuO with respect to the sum of the Fe content in terms of Fe2O3, the Zn content in terms of ZnO, the V content in terms of V2O5, and if present, the Cu content in terms of CuO, and the Mn content in terms of Mn2O3.

Abstract: A multilayer coil component including: a magnetic part that contains Fe, Zn, V, and Ni and optionally contains Mn and/or Cu; and a conductor part that contains copper. In the magnetic part, Fe is in an amount of 34.0 to 48.5 mol % expressed as Fe2O3 equivalent, Zn is in an amount of 6.0 to 45.0 mol % expressed as ZnO equivalent, Mn is in an amount of 0 to 7.5 mol % expressed as Mn2O3 equivalent, Cu is in an amount of 0 to 5.0 mol % expressed as CuO equivalent, and V is in an amount of 0.5 to 5.0 mol % expressed as V2O5 equivalent, with respect to the total amount of Fe expressed as Fe2O3 equivalent, Zn expressed as ZnO equivalent, V expressed as V2O5 equivalent, and Ni expressed as NiO equivalent, and optionally present Cu expressed as CuO equivalent and optionally present Mn expressed as Mn2O3 equivalent.

Abstract: A coil conductor and a via electrode placed away from the coil conductor are embedded in a magnetic layer. The magnetic layer is sandwiched between a pair of non-magnetic layers. The coil conductor and the via electrode are formed from a conductive material containing Cu as its main constituent, and the magnetic layer is formed from Ni—Mn—Zn ferrite where the CuO molar content is 5 mol % or less, and (x, y) falls within the range of A (25, 1), B (47, 1), C (47, 7.5), D (45, 7.5), E (45, 10), F (35, 10), G (35, 7.5), and H (25, 7.5) when the molar content x of Fe2O3 and the molar content y of Mn2O3 are represented by (x, y). Thus, insulation properties can be ensured, favorable electrical characteristics can be achieved, and a ceramic electronic component is achieved which is able to be reduced in size.

Abstract: A ceramic multilayer substrate incorporating a chip-type ceramic component, in which, even if the chip-type ceramic component is mounted on the surface of the ceramic multilayer substrate, bonding strength between the chip-type ceramic component and an internal conductor or a surface electrode of the ceramic multilayer substrate is greatly improved and increased. The ceramic multilayer substrate includes a ceramic laminate in which a plurality of ceramic layers are stacked, an internal conductor disposed in the ceramic laminate, a surface electrode disposed on the upper surface of the ceramic laminate, and a chip-type ceramic component bonded to the internal conductor or the surface electrode through an external electrode. The internal conductor or the surface electrode is bonded to the external electrode through a connecting electrode, and the connecting electrode forms a solid solution with any of the internal conductor, the surface electrode, and the external electrode.

Abstract: A laminated coil component that can use inexpensive copper as an internal conductor, and has excellent direct current superimposition characteristics is provided. In a laminated coil component including: a magnetic section including a ferrite material; a non-magnetic section including a non-magnetic ferrite material; and a coiled conductor section containing copper as a main component embedded inside the magnetic section and the non-magnetic section, the non-magnetic section contains at least Fe, Mn and Zn, and optionally Cu. The non-magnetic section has a Fe content of 40.0 mol % to 48.5 mol % in terms of Fe2O3, a Mn content of 0.5 mol % to 9 mol % in terms of Mn2O3 and a Cu content of 8 mol % or less in terms of CuO.

Abstract: A ceramic multilayer substrate incorporating a chip-type ceramic component, in which, even if the chip-type ceramic component is mounted on the surface of the ceramic multilayer substrate, bonding strength between the chip-type ceramic component and an internal conductor or a surface electrode of the ceramic multilayer substrate is greatly improved and increased. The ceramic multilayer substrate includes a ceramic laminate in which a plurality of ceramic layers are stacked, an internal conductor disposed in the ceramic laminate, a surface electrode disposed on the upper surface of the ceramic laminate, and a chip-type ceramic component bonded to the internal conductor or the surface electrode through an external electrode. The internal conductor or the surface electrode is bonded to the external electrode through a connecting electrode, and the connecting electrode forms a solid solution with any of the internal conductor, the surface electrode, and the external electrode.

Abstract: A ceramic multilayer substrate incorporating a chip-type ceramic component, in which, even if the chip-type ceramic component is mounted on the surface of the ceramic multilayer substrate, bonding strength between the chip-type ceramic component and an internal conductor or a surface electrode of the ceramic multilayer substrate is greatly improved and increased. The ceramic multilayer substrate includes a ceramic laminate in which a plurality of ceramic layers are stacked, an internal conductor disposed in the ceramic laminate, a surface electrode disposed on the upper surface of the ceramic laminate, and a chip-type ceramic component bonded to the internal conductor or the surface electrode through an external electrode. The internal conductor or the surface electrode is bonded to the external electrode through a connecting electrode, and the connecting electrode forms a solid solution with any of the internal conductor, the surface electrode, and the external electrode.

Abstract: A coil conductor and a via electrode placed away from the coil conductor are embedded in a magnetic layer. The magnetic layer is sandwiched between a pair of non-magnetic layers. The coil conductor and the via electrode are formed from a conductive material containing Cu as its main constituent, and the magnetic layer is formed from Ni—Mn—Zn ferrite where the CuO molar content is 5 mol % or less, and (x, y) falls within the range of A (25, 1), B (47, 1), C (47, 7.5), D (45, 7.5), E (45, 10), F (35, 10), G (35, 7.5), and H (25, 7.5) when the molar content x of Fe2O3 and the molar content y of Mn2O3 are represented by (x, y). Thus, insulation properties can be ensured, favorable electrical characteristics can be achieved, and a ceramic electronic component is achieved which is able to be reduced in size.

Abstract: A ceramic multilayer substrate incorporating a chip-type ceramic component, in which, even if the chip-type ceramic component is mounted on the surface of the ceramic multilayer substrate, bonding strength between the chip-type ceramic component and an internal conductor or a surface electrode of the ceramic multilayer substrate is greatly improved and increased. The ceramic multilayer substrate includes a ceramic laminate in which a plurality of ceramic layers are stacked, an internal conductor disposed in the ceramic laminate, a surface electrode disposed on the upper surface of the ceramic laminate, and a chip-type ceramic component bonded to the internal conductor or the surface electrode through an external electrode. The internal conductor or the surface electrode is bonded to the external electrode through a connecting electrode, and the connecting electrode forms a solid solution with any of the internal conductor, the surface electrode, and the external electrode.