Abstract: An attachment (10) for preventing a cover (4) from falling off from a housing (1) is provided. The cover (4) includes an elastic member (54) on each of the right and lefts ends thereof. The elastic members are made elastically deformable by forming slits (56) in the cover (4). The elastic members (54) each have a protrusion (52). In order to mount the cover (4) to the housing (1), the protrusions (52) are inserted into respective ones of holes (7) formed in the housing (1) by inwardly deforming and, then, restoring the elastic members (54). After mounting the cover (4) to the housing (1), the cover falling-off preventing attachment (10) is attached to the cover (4), with side walls 18 of the attachment (10) positioned to extend into the respective slits (56), whereby the deformation of the elastic members (54) is prevented.

Abstract: An attachment (10) for preventing a cover (4) from falling off from a housing (1) is provided. The cover (4) includes an elastic member (54) on each of the right and lefts ends thereof. The elastic members are made elastically deformable by forming slits (56) in the cover (4). The elastic members (54) each have a protrusion (52). In order to mount the cover (4) to the housing (1), the protrusions (52) are inserted into respective ones of holes (7) formed in the housing (1) by inwardly deforming and, then, restoring the elastic members (54). After mounting the cover (4) to the housing (1), the cover falling-off preventing attachment (10) is attached to the cover (4), with side walls 18 of the attachment (10) positioned to extend into the respective slits (56), whereby the deformation of the elastic members (54) is prevented.

Abstract: A power supply apparatus has chassis (42, 44) mounted on opposing surfaces of a heat sink (40). Printed circuit boards (46, 48) are disposed outward of the chassis (42, 44) and detachably secured to the chassis (42, 44). Semiconductor modules (4, 16a, 16b, 32) are mounted on the respective surfaces of the heat sink (40) facing toward the printed circuit boards (46, 48) and extend through the chassis (42, 44). The semiconductor modules (4, 16a, 16b, 32) are electrically connected to the printed circuit boards (46, 48) to form a power supply circuit.

Abstract: A power supply device includes power semiconductor devices generating Joule's heat by themselves and circuit components generating no considerable heat by themselves but, as a group, generate a slight rise in temperature, which are included in a power supply circuit of the device. A structure is arranged to forcibly cool these semiconductor devices and circuit components by partitioning the interior of a housing of the Dower supply device to form a passage for an air flow, providing the housing with inlet and outlet openings for the air flow and providing the passage with a ventilating fan.