Abstract: A lamp unit includes a light source, and a socket on which the light source unit is mounted. The socket includes a light source holder that holds the light source, and a connector that supplies power to the light source, and the light source holder includes a recess extending along a light source unit mounting surface from an outside to a portion immediately below the light source.

Abstract: A lamp unit includes a light source, and a socket on which the light source unit is mounted. The socket includes a light source holder that holds the light source, and a connector that supplies power to the light source, and the light source holder includes a recess extending along a light source unit mounting surface from an outside to a portion immediately below the light source.

Abstract: A light source unit includes a board, a resin-molded unit formed using a resin material as a base material and having thermal conductivity, and a socket housing including a heat sink formed of a metal material, and a board attachment portion to which the board is attached and a covered surface which is covered with the resin-molded unit, wherein the resin-molded unit is formed with a holding hole communicating with the covered surface, and the heat sink and the resin-molded unit are formed by integral molding when a portion of the covered surface and a portion of the attachment surface are pressed by a portion of a mold inserted through the holding hole and another portion of the mold, respectively.

Abstract: In one embodiment of a light source unit, the heat-dissipation plate is provided with a first heat-dissipation portion in contact with the substrate, the resin molding part is provided with a plurality of heat-dissipation fins and an engaging portion to be engaged with a predetermined member, and the socket housing is formed by an integral molding of the heat-dissipation plate and the resin molding part.

Abstract: A light source unit includes a socket housing including a heat sink formed of a metal material and having a board attachment portion, and a resin-molded unit formed using a resin material as a base material and having thermal conductivity, a board attached to the board attachment portion, and a light emitting element mounted on the board and configured to function as a light source. The board attachment portion is formed with an attachment surface to which the board is attached and a covered surface which is covered with the resin-molded unit. A holding hole communicating with the covered surface is formed in the resin-molded unit. In the socket housing, the heat sink and the resin-molded unit are formed by integral molding when a portion of the covered surface and a portion of the attachment surface are pressed by a portion of a mold inserted through the holding hole and another portion of the mold, respectively.

Abstract: In one embodiment of a light source unit, the heat-dissipation plate is provided with a first heat-dissipation portion in contact with the substrate, the resin molding part is provided with a plurality of heat-dissipation fins and an engaging portion to be engaged with a predetermined member, and the socket housing is formed by an integral molding of the heat-dissipation plate and the resin molding part.