Abstract: There is provided a flexible substrate having excellent flexibility and gas barrier properties. A flexible substrate 100 according to the present invention includes: a base material 20 including an inorganic glass 10 and resin layers 11 and 11? placed on both sides of the inorganic glass 10; and an inorganic thin film 12 placed on a side of one of the resin layers where the inorganic glass is not placed, wherein the inorganic thin film 12 is formed on at least a peripheral edge of one surface of the base material.

Abstract: The present invention provides a transparent substrate that significantly prevents the progress of a crack in a thin-plate glass and the rupture of the glass, and is excellent in bending property and flexibility. A transparent substrate according to an embodiment of the present invention includes: a thin-plate glass having a thickness of 10 ?m to 100 ?m; and a resin layer on at least one side of the thin-plate glass, wherein a shrinkage stress of the resin layer on the thin-plate glass is 5 MPa or more.

Abstract: There is provided a flexible substrate having excellent flexibility and gas barrier properties. A flexible substrate 100 according to the present invention includes: a base material 20 including an inorganic glass 10 and resin layers 11 and 11? placed on both sides of the inorganic glass 10; and an inorganic thin film 12 placed on a side of one of the resin layers where the inorganic glass is not placed, wherein the inorganic thin film 12 is formed on at least a peripheral edge of one surface of the base material.

Abstract: There is provided a flexible substrate having excellent flexibility and gas barrier properties. A flexible substrate 100 according to the present invention includes: a base material 20 including an inorganic glass 10 and resin layers 11 and 11? placed on both sides of the inorganic glass 10; and an inorganic thin film 12 placed on a side of one of the resin layers where the inorganic glass is not placed, wherein the inorganic thin film 12 is formed on at least a peripheral edge of one surface of the base material.

Abstract: There is provided a transparent substrate which is excellent in dimensional stability, which significantly prevents the progress of a crack in an inorganic glass and the rupture of the inorganic glass, and which is excellent in flexibility. A transparent substrate according to an embodiment of the present invention includes: an inorganic glass having a thickness of 10 ?m to 100 ?m; and a resin layer on one side, or each of both sides, of the inorganic glass, wherein: a ratio of a total thickness of the resin layer to a thickness of the inorganic glass is 0.9 to 4; the resin layer has a modulus of elasticity at 25° C. of 1.5 GPa to 10 GPa; and the resin layer has a fracture toughness value at 25° C. of 1.5 MPa·m1/2 to 10 MPa·m1/2.

Abstract: In a conductive laminate, a transparent conductive thin film laminate 2 including at least two transparent conductive thin films and a metal layer 3 are formed in this order on at least one surface of a transparent base. In the transparent conductive thin film laminate 2, a first transparent conductive thin film 21 that is closest to the metal layer 3 is a metal oxide layer, or a composite metal oxide layer containing a principal metal and at least one impurity metal. Transparent conductive thin film 22 other than the first transparent conductive thin film is a composite metal oxide layer containing a principal metal and at least one impurity metal. The content ratio of impurity metal in the first transparent conductive thin film is not the highest of content ratios of impurity metal in the transparent conductive thin films which form the transparent conductive thin film laminate 2.

Abstract: A method of continuously subjecting an elongated substrate to vacuum film formation is disclosed. The method comprises the steps of: feeding a first substrate from a first roll chamber in a first direction from the first roll chamber toward a second roll chamber; degassing the first substrate; forming a film of a second material on the first substrate, in a second film formation chamber; and rolling up the first substrate in the second roll chamber, thereby producing the first substrate, and comprises similar steps to produce a second substrate. In advance of producing the first substrate with the second material film, the first cathode electrode of the first film formation chamber is removed from the first film formation chamber, and, in advance of producing the second substrate with the first material film, the second cathode electrode of the second film formation chamber is removed from the second film formation chamber.

Abstract: The film formation method comprises the steps of: unrolling and feeding an elongated substrate wound in a roll form from a first roll chamber in a direction from the first roll chamber toward a second roll chamber, using a first surface as a surface for film formation; degassing the fed substrate; forming a first material film on the first surface of the degassed substrate in a first film formation chamber; forming a second material film on the first material film in a second film formation chamber; taking up the substrate in a roll form in the second roll chamber, the substrate having the material films formed thereon; unrolling and feeding the taken up substrate from the first roll chamber in the direction, using a second surface opposite the first surface of the substrate as a surface for film formation; and repeating all the above treatments.

Abstract: There is provided a flexible substrate having excellent flexibility and gas barrier properties. A flexible substrate 100 according to the present invention includes: a base material 20 including an inorganic glass 10 and resin layers 11 and 11? placed on both sides of the inorganic glass 10; and an inorganic thin film 12 placed on a side of one of the resin layers where the inorganic glass is not placed, wherein the inorganic thin film 12 is formed on at least a peripheral edge of one surface of the base material.

Abstract: The film formation method comprises the steps of: unrolling and feeding an elongated substrate wound in a roll form from a first roll chamber in a direction from the first roll chamber toward a second roll chamber, using a first surface as a surface for film formation; degassing the fed substrate; forming a first material film on the first surface of the degassed substrate in a first film formation chamber; forming a second material film on the first material film in a second film formation chamber; taking up the substrate in a roll form in the second roll chamber, the substrate having the material films formed thereon; unrolling and feeding the taken up substrate from the first roll chamber in the direction, using a second surface opposite the first surface of the substrate as a surface for film formation; and repeating all the above treatments.

Abstract: The film formation method comprises the steps of: unrolling and feeding an elongated substrate wound in a roll form from a first roll chamber in a first direction from the first roll chamber toward a second roll chamber, using a first surface as a surface for film formation; degassing the substrate fed in the first direction; forming a second material film on the first surface of the substrate in a second film formation chamber; taking up the substrate in a roll form in the second roll chamber, the substrate having the second material film formed thereon; unrolling and feeding the substrate from the second roll chamber in a second direction from the second roll chamber toward the first roll chamber; forming a first material film on the second material film in a first film formation chamber; taking up the substrate in a roll form in the first roll chamber.

Abstract: The film formation method comprises the steps of: unrolling and feeding an elongated substrate wound in a roll form from a first roll chamber in a first direction from the first roll chamber toward a second roll chamber; degassing the fed substrate; forming a first material film on a first surface in a first film formation chamber; guiding the substrate having the first material film formed thereon to a second film formation chamber in a second direction from the second roll chamber toward the first roll chamber; forming, in the second film formation chamber, a second material film on a second surface opposite the first surface of the substrate when it is being guided in the second direction; taking up, in a third roll chamber provided between the first roll chamber and the second roll chamber, the substrate in a roll state.

Abstract: In a conductive laminate, a transparent conductive thin film laminate 2 including at least two transparent conductive thin films and a metal layer 3 are formed in this order on at least one surface of a transparent base. In the transparent conductive thin film laminate 2, a first transparent conductive thin film 21 that is closest to the metal layer 3 is a metal oxide layer, or a composite metal oxide layer containing a principal metal and at least one impurity metal. Transparent conductive thin film 22 other than the first transparent conductive thin film is a composite metal oxide layer containing a principal metal and at least one impurity metal. The content ratio of impurity metal in the first transparent conductive thin film is not the highest of content ratios of impurity metal in the transparent conductive thin films which form the transparent conductive thin film laminate 2.

Abstract: The film formation method comprises the steps of: unrolling and feeding an elongated substrate wound in a roll form from a first roll chamber in a direction from the first roll chamber toward a second roll chamber, using a first surface as a surface for film formation; degassing the fed substrate; forming a first material film on the first surface of the degassed substrate in a first film formation chamber; forming a second material film on the first material film in a second film formation chamber; taking up the substrate in a roll form in the second roll chamber, the substrate having the material films formed thereon; unrolling and feeding the taken up substrate from the first roll chamber in the direction, using a second surface opposite the first surface of the substrate as a surface for film formation; and repeating all the above treatments.

Abstract: The film formation method comprises the steps of: unrolling and feeding an elongated substrate wound in a roll form from a first roll chamber in a first direction from the first roll chamber toward a second roll chamber, using a first surface as a surface for film formation; degassing the substrate fed in the first direction; forming a second material film on the first surface of the substrate in a second film formation chamber; taking up the substrate in a roll form in the second roll chamber, the substrate having the second material film formed thereon; unrolling and feeding the substrate from the second roll chamber in a second direction from the second roll chamber toward the first roll chamber; forming a first material film on the second material film in a first film formation chamber; taking up the substrate in a roll form in the first roll chamber.

Abstract: The film formation method comprises the steps of: unrolling and feeding an elongated substrate wound in a roll form from a first roll chamber in a first direction from the first roll chamber toward a second roll chamber; degassing the fed substrate; forming a first material film on a first surface in a first film formation chamber; guiding the substrate having the first material film formed thereon to a second film formation chamber in a second direction from the second roll chamber toward the first roll chamber; forming, in the second film formation chamber, a second material film on a second surface opposite the first surface of the substrate when it is being guided in the second direction; taking up, in a third roll chamber provided between the first roll chamber and the second roll chamber, the substrate in a roll state.

Abstract: A method of continuously subjecting an elongated substrate to vacuum film formation is disclosed. The method comprises the steps of: feeding a first substrate from a first roll chamber in a first direction from the first roll chamber toward a second roll chamber; degassing the first substrate; forming a film of a second material on the first substrate, in a second film formation chamber; and rolling up the first substrate in the second roll chamber, thereby producing the first substrate, and comprises similar steps to produce a second substrate. In advance of producing the first substrate with the second material film, the first cathode electrode of the first film formation chamber is removed from the first film formation chamber, and, in advance of producing the second substrate with the first material film, the second cathode electrode of the second film formation chamber is removed from the second film formation chamber.

Abstract: A manufacturing method of a conductive laminated film suppressing a wrinkle has a metal layer forming step in which a conductive metal layer is continuously formed on a surface of a long transparent conductive film where a transparent conductive layer is formed while the transparent conductive film, including a long transparent film base containing a polyester resin as a constituting material and the transparent conductive layer formed thereon, is transported. The metal layer forming step is performed under a reduced pressure atmosphere of 1 Pa or less. The long transparent conductive film is continuously transported by application of a transport tensile force, and the conductive metal layer is continuously deposited on the surface where the transparent conductive layer is formed in a state in which a surface where the transparent conductive layer is not formed contacts the surface of a film-forming roll.

Abstract: There is provided a substrate for a display device that has excellent gas barrier properties, flexibility, heat resistance and transparency, and has excellent dimensional stability, operability, and secondary processing characteristics. A substrate for a display device according to the present invention includes: an inorganic glass; and resin layers placed on both sides of the inorganic glass. Preferably, a ratio drsum/dg between a total thickness drsum of the resin layer and a thickness dg of the inorganic glass is 0.5 to 2.2. Preferably, the resin layers on both sides of the inorganic glass are each composed of the same material, each have the same thickness, and a thickness of each of the resin layers is equal to the thickness of the inorganic glass. Preferably, an average coefficient of linear expansion at 170° C. of the substrate for a display device is 20 ppm ° C.?1 or less.

Abstract: The present invention provides a transparent substrate that significantly prevents the progress of a crack in a thin-plate glass and the rupture of the glass, and is excellent in bending property and flexibility. A transparent substrate according to an embodiment of the present invention includes: a thin-plate glass having a thickness of 10 ?m to 100 ?m; and a resin layer on at least one side of the thin-plate glass, wherein a shrinkage stress of the resin layer on the thin-plate glass is 5 MPa or more.