Patents by Inventor Yoshimi Ishinami

Yoshimi Ishinami has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flexible sheet reinforced with poly(aromatic amide) non-woven fabric and use thereof
    Patent number: 5049435
    Abstract: A flexible sheet which comprises a non-woven fabric made predominantly from a poly(aromatic amide) component which is impregnated with a heat- and/or light-curable resin, wherein the non-woven fabric satisfies the following conditions:5 g/m.sup.2 <weight per unit area<35 g/m.sup.2, and0.15 g/cm.sup.3 .ltoreq.density.ltoreq.0.8 g/cm.sup.3,which has well balanced properties, such as excellent heat dimensional stability, heat resistance (soldering resistance), water resistance, solvent resistance, electrical insulating properties and mechanical properties and is useful for the preparation of a flexible printed circuit board, and use thereof for a flexible metal-clad laminate and a flexible printed circuit board.
    Type: Grant
    Filed: October 2, 1989
    Date of Patent: September 17, 1991
    Assignee: Toyo Boseki Kabushiki Kaisha
    Inventors: Keiichi Uno, Yoshimi Ishinami, Masaaki Nakamura, Tomohiko Nakao
  • Flexible sheet reinforced with poly(aromatic amide) non-woven fabric and use thereof
    Patent number: 4897301
    Abstract: A flexible sheet which comprises a non-woven fabric made predominantly from a poly(aromatic amide) component which is impregnated with a heat- and/or light-curable resin, wherein the non-woven fabric satisfies the following conditions:5 g/m.sup.2 <weight per unit area<35 g/m.sup.2, and0.15 g/cm.sup.3 .ltoreq.density.ltoreq.0.8 g/cm.sup.3,which has well balanced properties, such as excellent heat dimensional stability, heat resistance (soldering resistance), water resistance, solvent resistance, electrical insulating properties and mechanical properties and is useful for the preparation of a flexible printed circuit board, and use thereof for a flexible metal-clad laminate and a flexible printed circuit board.
    Type: Grant
    Filed: January 22, 1986
    Date of Patent: January 30, 1990
    Assignee: Toyo Boseki Kabushiki Kaisha
    Inventors: Keiichi Uno, Yoshimi Ishinami, Masaaki Nakamura, Tomohiko Nakao