Abstract: The objective of the invention is to prevent electrostatic destruction of semiconductor chips during resin molding. With the semiconductor device manufacturing method, a substrate 400 that includes on the surface multiple semiconductor chips 410 and liquid resin 434 supplied to multiple semiconductor devices is supported by an electrically insulated lower die 200. An upper die 110 in which multiple shape-forming parts (cavities) 112 are formed is pressed against lower die 200 through the medium of a polymer release film 300, and liquid resin 434 on the substrate is molded.

Abstract: A device with a semiconductor chip assembled on a planar substrate and encapsulation compound surrounding the assembled chip and a portion of the substrate near the chip; the compound has a planar top area. The encapsulation compound has a plurality of side areas reaching from the substrate to the top area; these side areas form edge lines with the top area, where the top area plane intersects with the respective plane of each side area. The encapsulation compound is recessed along the edge lines so that the material is caved-in along the lines; this feature causes the recess to prevent any compound from the side area planes to reach the top area plane, whereby the planarity of the top area is preserved.

Abstract: The presence of defects in a wiring pattern is checked by a visual method, by image processing, or the like, and when a defect is detected, information such as the position, coordinates, and size of the defect is confirmed, the type of defect is confirmed, and a processing method and processing conditions are set in accordance with the defect type and conditions (step S1). Shorting defects are corrected based on the processing method and processing conditions that have been set and the defect information that has been confirmed (step S2). Subsequently, disconnection defects are corrected based on the set processing method and processing conditions and the confirmed defect information (step S3). Upon completion of these correction operations, a determination is made as to whether the defects have been corrected (step S4). By this means, the operating time for wiring correction can be shortened, and automation facilitated.

Abstract: An antenna for receiving electromagnetic waves in a desired frequency band, includes a radiating conductor and a ground conductor, a feeder part, a wavelength-shortening section, and a magnetic field applying section. The radiating conductor and a ground conductor resonate at a resonance point frequency. The feeder part is configured to feed the radiating conductor with electricity. The wavelength-shortening section in which a magnetic body having both a dielectric property and a magnetic property is disposed close to the radiating conductor shifts the resonance point frequency into a band lower than the desired frequency band by a wavelength-shortening effect obtained based on the dielectric property and the magnetic property. The magnetic field applying section is configured to apply a magnetic field to the magnetic body so as to reduce a magnetic loss due to the magnetic body.

Abstract: A compression molding method for forming a mold cap over an integrated circuit structure is provided. A film is positioned adjacent a first die structure such that a mold block coupled to the film is located in a die cavity in the first die structure. The mold block comprises mold compound and at least substantially holding its own shape. An integrated circuit structure including one or more integrated circuit devices coupled to a substrate is positioned adjacent a second die structure. At least one of the first die structure and the second die structure is moved toward the other die structure to cause the integrated circuit structure to compress the mold block within the die cavity in order to form a mold cap covering at least one of the one or more integrated circuit devices.

Abstract: The objective of the invention is to provide a method of manufacturing a semiconductor device that allows individual molding of plural semiconductor chips carried on a surface of the substrate. It includes the following process steps: a process step in which plural semiconductor elements 102 are arranged on the surface of substrate 100; a process step in which the inner side of substrate 102 is fixed on lower die 130; a process step in which liquid resin 114 is supplied from nozzle 112 onto each of the semiconductor elements in order to cover at least a portion of each of semiconductor chips 102; a process step in which the upper die having plural cavities 144 formed in one surface is pressed onto the lower die, and liquid resin 114 is molded at a prescribed temperature by means of plural cavities 144; and a process step in which cavities 144 of upper die 140 are detached from the substrate, and plural molding resin portions are formed individually.

Abstract: A device with a semiconductor chip (801) assembled on a planar substrate (802) and encapsulation compound (810) surrounding the assembled chip and a portion of the substrate near the chip; the compound has a planar top area (811). The encapsulation compound has a plurality of side areas (812) reaching from the substrate to the top area; these side areas form edge lines with the top area, where the top area plane intersects with the respective plane of each side area. The encapsulation compound is recessed (813) along the edge lines so that the material is caved-in along the lines; this feature causes the recess to prevent any compound from the side area planes to reach the top area plane, whereby the planarity of the top area is preserved.

Abstract: An objective of this invention is to extend the range of choosing organic dye compounds as light-absorbing agent in a variety of fields of, for example, information storage, information display, solar energy generation, electric machinery apparatus, electric communicating apparatus, optical apparatus, cloth, building/bedding/decorating product, sanitary and health goods, and agricultural material by providing an organic dye compound which is superior in light-absorbing property, light resistance, and solubility in the near-infrared region: The objective is attainable by providing a cyanine dye that bears within the same molecule a plurality of cyanine dye skeletons bound to a divalent group(s) and an organometallic complex as counter ion, as well as substantially absorbing a light with a wavelength longer than 700 nm.

Abstract: A head substrate and a protective substrate are formed of an electrostatic-discharge resistant conductive material having an electrical resistivity of 102 to 1010 ?cm. These substrates are electrically connected to a base metal through the use of conductive paste and are set to a ground potential via the base metal and a rotating drum. This suppresses a discharge current flowing through an MR element when an electrostatically charged substance touches or approaches a magnetic reproducing head, a terminal, a conducting wire, etc. to generate an electrostatic discharge. The magnetic reproducing head including an MR element and the like is prevented against an electrostatic discharge damage. It is possible to provide the magnetic reproducing head, a head drum apparatus, and a magnetic recording-reproducing apparatus which can highly effectively prevent an electrostatic discharge damage.

Abstract: A head substrate and a protective substrate are formed of an electrostatic-discharge resistant conductive material having an electrical resistivity of 102 to 1010 ?cm. These substrates are electrically connected to a base metal through the use of conductive paste and are set to a ground potential via the base metal and a rotating drum. This suppresses a discharge current flowing through an MR element when an electrostatically charged substance touches or approaches a magnetic reproducing head, a terminal, a conducting wire, etc. to generate an electrostatic discharge. The magnetic reproducing head including an MR element and the like is prevented against an electrostatic discharge damage. It is possible to provide the magnetic reproducing head, a head drum apparatus, and a magnetic recording-reproducing apparatus which can highly effectively prevent an electrostatic discharge damage.

Abstract: A compression molding method for forming a mold cap over an integrated circuit structure is provided. A film is positioned adjacent a first die structure such that a mold block coupled to the film is located in a die cavity in the first die structure. The mold block comprises mold compound and at least substantially holding its own shape. An integrated circuit structure including one or more integrated circuit devices coupled to a substrate is positioned adjacent a second die structure. At least one of the first die structure and the second die structure is moved toward the other die structure to cause the integrated circuit structure to compress the mold block within the die cavity in order to form a mold cap covering at least one of the one or more integrated circuit devices.

Abstract: A head substrate and a protective substrate are formed of an electrostatic-discharge resistant conductive material having an electrical resistivity of 102 to 1010 ?cm. These substrates are electrically connected to a base metal through the use of conductive paste and are set to a ground potential via the base metal and a rotating drum. This suppresses a discharge current flowing through an MR element when an electrostatically charged substance touches or approaches a magnetic reproducing head, a terminal, a conducting wire, etc. to generate an electrostatic discharge. The magnetic reproducing head including an MR element and the like is prevented against an electrostatic discharge damage. It is possible to provide the magnetic reproducing head, a head drum apparatus, and a magnetic recording-reproducing apparatus which can highly effectively prevent an electrostatic discharge damage.

Abstract: The object of the present invention is to improve convenience of a telephone equipped with a speaker. In order to attain this object, the telephone equipped with a speaker in accordance with the present invention comprises a telephone body and a speakerphone functional unit comprising a microphone and a speaker and capable of being detachably mounted on the telephone body. The speakerphone functional unit comprises a wireless unit, and exchange of voice signals and control signals with the telephone body is conducted via the wireless circuit. As a result, the speakerphone functional unit can be freely used anywhere, without selecting a special location therefor.

Abstract: A head substrate and a protective substrate are formed of an electrostatic-discharge resistant conductive material having an electrical resistivity of 102 to 1010 &OHgr;cm. These substrates are electrically connected to a base metal through the use of conductive paste and are set to a ground potential via the base metal and a rotating drum. This suppresses a discharge current flowing through an MR element when an electrostatically charged substance touches or approaches a magnetic reproducing head, a terminal, a conducting wire, etc. to generate an electrostatic discharge. The magnetic reproducing head including an MR element and the like is prevented against an electrostatic discharge damage. It is possible to provide the magnetic reproducing head, a head drum apparatus, and a magnetic recording-reproducing apparatus which can highly effectively prevent an electrostatic discharge damage.

Abstract: A spread spectrum communication equipment comprises a correlator outputting a correlation output signal, a timing generator generating two timing signals in response to a correlation peak value, detecting circuits for detecting information of a correlation output signal based on either one of the timing signals, receiving information detected in either one of the detecting circuits and checking whether the information coincides with the ID code, a switching circuit for selecting connection or disconnection between the detecting circuits and a demodulator, and a control circuit responsive to outputs of the checking circuits for selecting connection or disconnection with the switching circuit.

Abstract: A spread spectrum communication equipment comprises a correlator outputting a correlation output signal, a timing generator generating two timing signals in response to a correlation peak value, detecting circuits for detecting information of a correlation output signal based on either one of the timing signals, receiving information detected in either one of the detecting circuits and checking whether the information coincides with the ID code, a switching circuit for selecting connection or disconnection between the detecting circuits and a demodulator, and a control circuit responsive to outputs of the checking circuits for selecting connection or disconnection with the switching circuit.

Abstract: The present invention relates to a radio communication apparatus for transmitting and receiving signals according to a modulation technique using the so-called flipper, and more particularly to a radio communication apparatus which can detect a flipper data element in a received signal, with simple configuration in the receiver's side. The invention further relates to a radio communication apparatus which can efficiently execute verification of an ID code also in the transmitter side, for instance, by verifying the ID code by checking for the flipper data element to determine whether it is included.

Abstract: A two-needle sewing machine includes first and second sewing needles for performing two stitching operations at the same time; a motor for driving the first and second sewing needles; first and second thread cutting mechanisms provided for the first and second sewing needles, respectively, for cutting threads at the ends of the stitching operations; a first actuator and a second actuator for driving respective ones of the first and second thread cutting mechanisms; and a thread cutting control circuit which stores data corresponding to the timing of a first thread cutting drive signal to the first actuator and the timing of a second thread cutting drive signal to the second actuator, both signals corresponding to rotational speeds of the motor, and which, according to the data and the rotational speeds of the motor, applies the first and second thread cutting drive signals to the first and second actuators at different times defined by the data.

Abstract: A control device for sewing machines which includes a drive system controller which controls each of numerous driving units provided in the sewing machine and which is connected to an optional command system controller that is positioned outside of the sewing machine. Thus, a control code from the outside command system may be input and decoded to control the drive system controller.

Abstract: A typewriter which has a minimized dimension in the direction of the depth and requires a minimized overall installation area. The typewriter includes a keyboard mounted at a portion near a top, front side of the typewriter housing and is pivotable from and to a horizontal position. When pivoted in a normally closed position, it lies substantially in a plane of a top opening formed in the typewriter housing. The keyboard is located such that its rear end is positioned very close to a platen mounted at a rear portion of the typewriter housing and covers the area of movement of a ribbon cassette carried on a carrier that is mounted to the typewriter housing and moves parallel to the platen.