Patents by Inventor Yoshimichi Morita

Yoshimichi Morita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11942761
    Abstract: Provided here are: a laser diode section provided on a surface of an n-type InP substrate; a spot-size converter section provided on a surface of the n-type InP substrate, the spot-size converter section being composed of a core layer which causes emitted laser light to propagate therein, a p-type InP cladding layer on a front surface side of the core layer, an n-type InP cladding layer—on a back surface side of the core layer, n-type InP cladding layers provided on the both sides of the core layer, and a p-type InP cladding layer provided on respective surfaces of the p-type InP cladding layer and the first cladding layers; a window region provided on a surface of the n-type InP substrate—that is placed on a front-end side of the core layer; and a monitor PD as a monitor section provided on a surface of the window region.
    Type: Grant
    Filed: January 9, 2019
    Date of Patent: March 26, 2024
    Assignee: Mitsubishi Electric Corporation
    Inventor: Yoshimichi Morita
  • Publication number: 20240061279
    Abstract: An optical semiconductor device according to the present disclosure includes at least one laser, a plurality of EA modulators to which an output of the laser is connected on an input side and which have absorption peak wavelengths different from each other, a multiplexer to which outputs of the plurality of EA modulators are connected on an input side and to which a waveguide is connected on an output side, a temperature detector configured to detect a temperature of the laser or the plurality of EA modulators and a selection control circuitry configured to switch an EA modulator to operate among the plurality of EA modulators in accordance with a detected temperature of the temperature detector.
    Type: Application
    Filed: May 13, 2021
    Publication date: February 22, 2024
    Applicant: Mitsubishi Electric Corporation
    Inventor: Yoshimichi MORITA
  • Publication number: 20230102522
    Abstract: A semiconductor optical integrated element of the present disclosure includes: a laser diode portion which is provided on one end side above a substrate, has a first optical waveguide, and emits a laser beam; a modulator portion which is provided on another end side, has a second optical waveguide, and modulates the laser beam; a separation region provided between the laser diode portion and the modulator portion; and a pair of grooves provided on both sides along the first optical waveguide and the second optical waveguide. The second optical waveguide in the separation region and the second optical waveguide in a part on the separation region side in the modulator portion have a buried structure, and the second optical waveguide in a remaining part in the modulator portion has a high-mesa-ridge structure.
    Type: Application
    Filed: April 27, 2020
    Publication date: March 30, 2023
    Applicant: Mitsubishi Electric Corporation
    Inventors: Yusuke AZUMA, Yoshimichi MORITA
  • Publication number: 20220006262
    Abstract: Provided here are: a laser diode section provided on a surface of an n-type InP substrate; a spot-size converter section provided on a surface of the n-type InP substrate, the spot-size converter section being composed of a core layer which causes emitted laser light to propagate therein, a p-type InP cladding layer on a front surface side of the core layer, an n-type InP cladding layer—on a back surface side of the core layer, n-type InP cladding layers provided on the both sides of the core layer, and a p-type InP cladding layer provided on respective surfaces of the p-type InP cladding layer and the first cladding layers; a window region provided on a surface of the n-type InP substrate-that is placed on a front-end side of the core layer; and a monitor PD as a monitor section provided on a surface of the window region.
    Type: Application
    Filed: January 9, 2019
    Publication date: January 6, 2022
    Applicant: Mitsubishi Electric Corporation
    Inventor: Yoshimichi MORITA
  • Patent number: 11211768
    Abstract: A semiconductor optical integrated device according to the present invention includes a conductive substrate, a laser provided to the conductive substrate, a semi-insulating semiconductor layer provided on the conductive substrate, a photodiode provided on the semi-insulating semiconductor layer and a waveguide that is provided on the conductive substrate and guides output light of the laser to the photodiode, wherein an anode of the photodiode and a cathode of the photodiode are drawn from an upper surface side of the photodiode, and the waveguide and the photodiode are separated from each other by the semi-insulating semiconductor layer.
    Type: Grant
    Filed: October 3, 2017
    Date of Patent: December 28, 2021
    Assignee: Mitsubishi Electric Corporation
    Inventors: Keisuke Matsumoto, Yoshimichi Morita
  • Publication number: 20200274318
    Abstract: A semiconductor optical integrated device according to the present invention includes a conductive substrate, a laser provided to the conductive substrate, a semi-insulating semiconductor layer provided on the conductive substrate, a photodiode provided on the semi-insulating semiconductor layer and a waveguide that is provided on the conductive substrate and guides output light of the laser to the photodiode, wherein an anode of the photodiode and a cathode of the photodiode are drawn from an upper surface side of the photodiode, and the waveguide and the photodiode are separated from each other by the semi-insulating semiconductor layer.
    Type: Application
    Filed: October 3, 2017
    Publication date: August 27, 2020
    Applicant: Mitsubishi Electric Corporation
    Inventors: Keisuke MATSUMOTO, Yoshimichi MORITA
  • Patent number: 9246622
    Abstract: A semiconductor optical element and an optical module in which extinction ratio variation among integrated optical modulation elements is reduced. An optical module has a wavelength multiplexer that multiplexes light respectively emerging from electric-field-absorption modulator (EAM) portions of integrated optical modulation elements, and that outputs the multiplexed light. The integrated optical modulation element has a signal input terminal, a laser element portion, and an EAM portion. Each of the integrated optical modulation elements has a difference between an oscillation wavelength and a barrier layer bandgap wavelength, represented as an LDBG wavelength difference. Variation of the LDBG wavelength differences is limited within a range of ±1 nm.
    Type: Grant
    Filed: May 1, 2014
    Date of Patent: January 26, 2016
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Asami Uchiyama, Koichi Akiyama, Yusuke Azuma, Yoshimichi Morita, Takeshi Yamatoya
  • Publication number: 20150093115
    Abstract: A semiconductor optical element and an optical module in which extinction ratio variation among integrated optical modulation elements is reduced. An optical module has a wavelength multiplexer that multiplexes light respectively emerging from electric-field-absorption modulator (EAM) portions of integrated optical modulation elements, and that outputs the multiplexed light. The integrated optical modulation element has a signal input terminal, a laser element portion, and an EAM portion. Each of the integrated optical modulation elements has a difference between an oscillation wavelength and a barrier layer bandgap wavelength, represented as an LDBG wavelength difference. Variation of the LDBG wavelength differences is limited within a range of ±1 nm.
    Type: Application
    Filed: May 1, 2014
    Publication date: April 2, 2015
    Applicant: Mitsubishi Electric Corporation
    Inventors: Asami Uchiyama, Koichi Akiyama, Yusuke Azuma, Yoshimichi Morita, Takeshi Yamatoya
  • Patent number: 8457451
    Abstract: A semiconductor optical element having a mesa structure formed by wet etching, includes a mesa structure having a ridge-type mesa structure or a high-mesa-type mesa structure, the mesa structure being disposed on a semiconductor substrate, and an extended mesa on the semiconductor substrate, the extended mesa being connected to a corner of the mesa structure and being the same material as the mesa structure.
    Type: Grant
    Filed: January 21, 2010
    Date of Patent: June 4, 2013
    Assignee: Mitsubishi Electric Corporation
    Inventors: Takeshi Yamatoya, Yoshimichi Morita, Chikara Watatani
  • Publication number: 20100272389
    Abstract: A semiconductor optical element having a mesa structure formed by wet etching, includes a mesa structure having a ridge-type mesa structure or a high-mesa-type mesa structure, the mesa structure being disposed on a semiconductor substrate, and an extended mesa on the semiconductor substrate, the extended mesa being connected to a corner of the mesa structure and being the same material as the mesa structure.
    Type: Application
    Filed: January 21, 2010
    Publication date: October 28, 2010
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Takeshi Yamatoya, Yoshimichi Morita, Chikara Watatani