Abstract: An upper die of a forming apparatus includes a first curved portion and a second curved portion between a second concave section and an upper holding surface. The first curved portion is curved in a direction away from the upper die. The second curved portion is curved toward the upper die. A blank holding surface of a blank holder holds a blank between the blank holding surface and the upper holding surface of the upper die. The blank holding surface faces the second curved portion. The blank holding surface includes a blank curved surface recessed along the second curved portion.

Abstract: An upper die of a forming apparatus includes a first curved portion and a second curved portion between a second concave section and an upper holding surface. The first curved portion is curved in a direction away from the upper die. The second curved portion is curved toward the upper die. A blank holding surface of a blank holder holds a blank between the blank holding surface and the upper holding surface of the upper die. The blank holding surface faces the second curved portion. The blank holding surface includes a blank curved surface recessed along the second curved portion.

Abstract: A molding recessed part of a lower mold constituting a press molding device is provided with a first blank holder, and a circular second blank holder is freely movably provided on one outer peripheral side of the first blank holder. Meanwhile, of first and second blank holes opened in blank material, straight-line parts of the second blank hole have formed therein a pair of tensile force adjusting parts, and arched parts of first and second opening parts are mounted on the second blank holder. Furthermore, when draw forming of the blank material is performed, the tensile force imparted to the straight-line parts to the outside is adjusted by the tensile force adjusting parts, and the tensile force imparted to the arched parts to the outside in the radial direction is adjusted by the second blank holder.

Abstract: A method for producing an oligosilane which includes a reaction step of producing an oligosilane by dehydrogenative coupling of hydrosilane. The reaction step is carried out in the presence of a catalyst containing at least one transition element selected from the group consisting of Periodic Table group 3 transition elements, group 4 transition elements, group 5 transition elements, group 6 transition elements, and group 7 transition elements. Also disclosed is a method for producing a catalyst for dehydrogenative coupling that produces an oligosilane by dehydrogenative coupling of hydrosilane.

Abstract: An object of the present invention is to provide an oligosilane production method with which a target oligosilane can be selectively produced. Oligosilanes can be efficiently produced at an improved selectivity for a target oligosilane by using, as a raw material, not only monosilane but also an oligosilane with a smaller number of silicon atoms than the target oligosilane or conversely an oligosilane with a larger number of silicon atoms than the target oligosilane.

Abstract: An object of the present invention is to provide a method for producing oligosilane and in particular to provide a method that can efficiently produce oligosilane at lower temperatures and with an improved yield and selectivity. In the dehydrogenative coupling reaction of hydrosilane, oligosilane can be efficiently produced at an improved selectivity for oligosilane, and in particular at an improved selectivity for disilane, by carrying out the reaction in the presence of zeolite having pores with a minor diameter of at least 0.43 nm and a major diameter of not more than 0.69 nm.

Abstract: An electrostatic discharge protector including two electrodes for forming a discharge gap, and a discharge gap filling-member including a discharge gap filing composition filed in the discharge gap, the discharge gap filling composition contains metal particles (A) obtainable by metal particles with a hydrolyzed product of a metal alkoxide represented by the following formula (1) and a binder component (C), and the electrostatic discharge protector includes the composition; R—O-[M(OR)2—O—]n—R??(1) wherein M is a metal atom, O is an oxygen atom, R is an alkyl group, all or a part of R's may be the same as or different each other, and n is an integer of 1 to 40. Also disclosed is an electronic circuit board including the electrostatic discharge protector and an electronic device.

Abstract: The present invention provides an electrostatic discharge protector capable of protecting electronic circuit boards having various designs from electrostatic discharge freely, simply and easily. The electrostatic discharge protector of the present invention comprises at least three conductive members containing one pair of electrodes and the conductive members other than the electrodes, the conductive members are each disposed in such a way that the gap between one conductive member and the other conductive member has a width of 0.1 to 10 ?m, an insulating member is disposed and embedded in at least one of gaps having a width of 0.1 to 10 ?m which are adjacent to each conductive member and one electrode is connected to the other electrode paired with the one electrode through the insulating member and the conductive members other than electrodes.

Abstract: A discharge gap-filling composition including a metal powder (A), a binder component (B) and a diluent (C). The diluent (C) has two or more characteristic groups in a molecule, and the characteristic groups are not directly bonded to each other in a molecule but are bonded to each other through a hydrocarbon group or a silicon atom.

Abstract: A discharge gap filling composition which includes metal powders (A) and a binder component (B), wherein surfaces of primary particles of the metal powders (A) are coated with a film composed of a metal oxide, and the primary particles of the metal powders (A) have a flake form. An electrostatic discharge protector is obtained using the composition.

Abstract: A hot bulge forming die apparatus forms a preheated tubular material 10a into a tubular material 10d. The hot bulge forming die apparatus includes a lower die 21B having a cavity surface 211B and an upper die 31B having a cavity surface 311B. An elongated hole 215 is formed in a circumferential edge portion 215 of the lower die 21B so as to extend outwards, and a projection 315 is formed on a circumferential edge portion 314 of the upper die 31B so as to fit in the elongated hole 215. When the dies are clamped together, the projection 315 formed on the circumferential edge portion 314 of the upper die 31B fits in the elongated hole 215 formed in the circumferential edge portion 214 of the lower die 21B.

Abstract: The present invention provides an electrostatic discharge protector capable of taking measures for electrostatic discharge against electronic wiring boards having various designs freely, simply and easily, having excellent accuracy of regulating an operating voltage and capable of being downsized and decreased on its cost, and also provides a resin composition for a discharge gap capable of preparing the electrostatic discharge protector. The resin composition for filling a discharge gap of an electrostatic discharge protector comprises a resin having a urethane structure represented by the formula (1): wherein plural R's are each independently an alkylene group of 1 to 18 carbon atoms, X is a bivalent organic group and m and n are each independently an integer of 1 to 20. The electrostatic discharge protector is obtainable by filling the discharge gap with the resin composition. The discharge gap has a width of 2 to 10 ?m.

Abstract: A discharge gap filling composition which includes metal powders (A) and a binder component (B), wherein surfaces of primary particles of the metal powders (A) are coated with a film composed of a metal oxide, and the primary particles of the metal powders (A) have a flake form. An electrostatic discharge protector is obtained using the composition.

Abstract: The present invention provides an electrostatic discharge protector capable of simply taking ESD measures with a free shape against electronic circuit boards having various designs, having excellent regulation accuracy for an operating voltage and capable of downsizing and cost decreasing, and also provides a discharge gap filling composition capable of using in the production of the electrostatic discharge protector. The discharge gap filling composition comprises metal particles (A) obtainable by metal particles with a hydrolyzed product of a metal alkoxide represented by the following formula (1) and a binder component (C), and the electrostatic discharge protector comprises the composition; R—O—[M(OR)2—O—]n—R??(1) wherein M is a metal atom, O is an oxygen atom, R is an alkyl group, all or a part of R's may be the same as or different each other, and n is an integer of 1 to 40.

Abstract: A discharge gap filling composition for an electrostatic discharge protector. The composition contains oxide film coated metal particles (A), a layered substance (B) and a binder component (C). Also disclosed is an electrostatic discharge protector including a discharge gap and a discharge gap filling material containing the discharge gap filling composition that is filled in the discharge gap.

Abstract: The present invention provides an electrostatic discharge protector capable of taking measures for electrostatic discharge against electronic wiring boards having various designs freely, simply and easily, having excellent accuracy of regulating an operating voltage and capable of being downsized and decreased on its cost, and also provides a resin composition for a discharge gap capable of preparing the electrostatic discharge protector. The resin composition for filling a discharge gap of an electrostatic discharge protector comprises a resin having a urethane structure represented by the formula (1): wherein plural R's are each independently an alkylene group of 1 to 18 carbon atoms, X is a bivalent organic group and m and n are each independently an integer of 1 to 20. The electrostatic discharge protector is obtainable by filling the discharge gap with the resin composition. The discharge gap has a width of 2 to 10 ?m.

Abstract: The present invention provides an electrostatic discharge protector capable of protecting electronic circuit boards having various designs from electrostatic discharge freely, simply and easily. The electrostatic discharge protector of the present invention comprises at least three conductive members containing one pair of electrodes and the conductive members other than the electrodes, the conductive members are each disposed in such a way that the gap between one conductive member and the other conductive member has a width of 0.1 to 10 ?m, an insulating member is disposed and embedded in at least one of gaps having a width of 0.1 to 10 ?m which are adjacent to each conductive member and one electrode is connected to the other electrode paired with the one electrode through the insulating member and the conductive members other than electrodes.

Abstract: In a hot bulge forming apparatus 1, a preheated tubular material 10b is disposed in a cavity 33A defined by dies 21A, 31A, air is supplied into an interior of the tubular material 10b so that the tubular material 10b is pressed against cavity surfaces 211A, 311A by the pressure of the air to thereby form the tubular material 10b into a shape defined by the cavity 33A. Thereafter, the resulting tubular material 10c is disposed in a cavity 33B defined by dies 21B, 31B, and air is supplied into an interior of the tubular material 10c so that the tubular material 10c is pressed against cavity surfaces 211B, 311B by the pressure of the air to thereby form the tubular material 10c into a shape defined by the cavity 33B while the tubular material 10c is cooled by the cavity surfaces 211B, 311B. Projecting portions 331 each having an arc-shaped section are formed at portions of the cavity surfaces 211A, 311A against which lengthwise end sides of the tubular material 10b are pressed.

Abstract: A hot bulge forming die apparatus forms a preheated tubular material 10a into a tubular material 10d. The hot bulge forming die apparatus includes a lower die 21B having a cavity surface 211B and an upper die 31B having a cavity surface 311B. An elongated hole 215 is formed in a circumferential edge portion 215 of the lower die 21B so as to extend outwards, and a projection 315 is formed on a circumferential edge portion 314 of the upper die 31B so as to fit in the elongated hole 215. When the dies are clamped together, the projection 315 formed on the circumferential edge portion 314 of the upper die 31B fits in the elongated hole 215 formed in the circumferential edge portion 214 of the lower die 21B.

Abstract: A die set for press-forming a blank of thin metallic sheet. The die set has a punch and a blank holder. The blank holder has a first bead for restraining an edge of the blank with a constant force. The first bead is disposed further to an inside than a second bead for restraining the edge of the blank with a force that varies during pressing of the blank.