Patents by Inventor Yoshinari Higa

Yoshinari Higa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flexible printed circuit board
    Patent number: 7242087
    Abstract: A flexible printed circuit board includes a substrate layer composed of insulating material, a protection circuit of a thin-film capacitor element, the protection circuit including a first wiring layer on the substrate layer, a dielectric layer, and a counter electrode layer. At least a portion of each of the first wiring layer and the counter electrode layer serves as a terminal. The front surface of each of the first wiring layer and the counter electrode layer, except the terminal portion, is covered with an insulating coating.
    Type: Grant
    Filed: February 15, 2005
    Date of Patent: July 10, 2007
    Assignee: Alps Electric Co., Ltd.
    Inventors: Akira Nakano, Yoshiomi Tsuji, Yoshinari Higa
  • Flexible printed circuit board
    Publication number: 20050189645
    Abstract: A flexible printed circuit board includes a substrate layer composed of insulating material, a protection circuit of a thin-film capacitor element, the protection circuit including a first wiring layer on the substrate layer, a dielectric layer, and a counter electrode layer. At least a portion of each of the first wiring layer and the counter electrode layer serves as a terminal. The front surface of each of the first wiring layer and the counter electrode layer, except the terminal portion, is covered with an insulating coating.
    Type: Application
    Filed: February 15, 2005
    Publication date: September 1, 2005
    Inventors: Akira Nakano, Yoshiomi Tsuji, Yoshinari Higa