Patents by Inventor Yoshinobu Akiha

Yoshinobu Akiha has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10020096
    Abstract: A method for manufacturing a shielded wire harness, includes: wrapping a conductive sheet around a wire harness in a parallel state to the wire harness, the conductive sheet having a long belt shape along a longitudinal direction of the wire harness, and cutting the conductive sheet in matching with a desired electric wire length; allowing an adhesive surface formed on a back surface side of the protection tape to fix the conductive sheet to the wire harness by spirally winding a long protection tape around an outer circumference of the conductive sheet wrapped around the wire harness; and cutting the protection tape in matching with the desired electric wire length.
    Type: Grant
    Filed: March 8, 2017
    Date of Patent: July 10, 2018
    Assignee: YAZAKI CORPORATION
    Inventors: Takahiro Iwasaki, Takuya Sugiyama, Yoshinobu Akiha
  • Publication number: 20170200535
    Abstract: A method for manufacturing a shielded wire harness, includes: wrapping a conductive sheet around a wire harness in a parallel state to the wire harness, the conductive sheet having a long belt shape along a longitudinal direction of the wire harness, and cutting the conductive sheet in matching with a desired electric wire length; allowing an adhesive surface formed on a back surface side of the protection tape to fix the conductive sheet to the wire harness by spirally winding a long protection tape around an outer circumference of the conductive sheet wrapped around the wire harness; and cutting the protection tape in matching with the desired electric wire length.
    Type: Application
    Filed: March 8, 2017
    Publication date: July 13, 2017
    Applicant: YAZAKI CORPORATION
    Inventors: Takahiro IWASAKI, Takuya SUGIYAMA, Yoshinobu AKIHA
  • Publication number: 20140102751
    Abstract: A shielded wire harness includes: a wire harness; a conductive sheet to be wrapped around the wire harness in a parallel state to the wire harness, the conductive sheet having a long belt shape along a longitudinal direction of the wire harness; and a long protection tape to be spirally wound around an outer circumference of the conductive sheet wrapped around the wire harness.
    Type: Application
    Filed: December 17, 2013
    Publication date: April 17, 2014
    Applicant: YAZAKI CORPORATION
    Inventors: Takahiro IWASAKI, Takuya SUGIYAMA, Yoshinobu AKIHA
  • Publication number: 20090235521
    Abstract: A shield harness manufacturing device includes a sheet feeder, a conductor-winding mold, an insulator-winding mold, and a control unit. The conductor-winding mold winds an ALS sheet as an electrically conductive sheet around a wire bundle including at least one covered wire and at least one drain wire. The insulator-winding mold folds a PET sheet as an electrically insulating sheet into two halves and then wraps the ALS-wound wire bundle in the PET sheet over the entire length of the wire bundle. The sheet feeder feeds the ALS sheet into the conductor-winding mold through which the covered wire and the drain wire are passed. The ALS sheet is wound around the covered wire and the drain wire over the entire length of the wires. Thereafter, the ALS-wound wire bundle is inserted into the insulator-winding mold and the sheet feeder feeds the PET sheet into the insulator-winding mold.
    Type: Application
    Filed: March 17, 2009
    Publication date: September 24, 2009
    Applicant: Yazaki Corporation
    Inventors: Yoshiaki Suzuki, Yoshinobu Akiha, Nobuhiro Kakuhari
  • Patent number: 6565773
    Abstract: There is provided conductive paste wherein conductive fillers composed of copper micro-fibers are mixed into thermoplastic resin or thermosetting resin.
    Type: Grant
    Filed: March 28, 2001
    Date of Patent: May 20, 2003
    Assignee: Yazaki Corporation
    Inventors: Hitoshi Ushijima, Yoshinobu Akiha
  • Patent number: 6384345
    Abstract: The three-dimensional circuit body of the present invention is obtained by the steps of forming an insulating layer formed on the three-dimensional, that is, corrugated car body frame, discharging conductive paste along the surface of the insulating layer and curing the conductive paste simultaneously with discharging operation to form the circuit patterns. The circuit pattern is formed by moving the discharging unit and curing unit along the insulating layer formed on the surface of the car body frame, while discharging the conductive paste from the discharging unit onto the insulating layer and curing the same simultaneously with discharging operation, thereby simplifying the manufacturing process of the three dimensional circuit body and reducing consumption of material.
    Type: Grant
    Filed: October 12, 2000
    Date of Patent: May 7, 2002
    Assignee: Yazaki Corporation
    Inventor: Yoshinobu Akiha
  • Publication number: 20010039309
    Abstract: There is provided conductive paste wherein conductive fillers composed of copper micro-fibers are mixed into thermoplastic resin or thermosetting resin.
    Type: Application
    Filed: March 28, 2001
    Publication date: November 8, 2001
    Applicant: Yazaki Corporation
    Inventors: Hitoshi Ushijima, Yoshinobu Akiha
  • Patent number: 6305985
    Abstract: To provide a connector with an electromagnetic shield capable of easily providing an electromagnetic shield layer on the surface of a connector housing with a homogeneous thickness even in the case the connector housing has a complicated structure with many projections and recesses so as to obtain the excellent electromagnetic shield effect without increase of the number of the connector components or increase of the weight, and a manufacturing method and an apparatus therefor. An electromagnetic shield layer is formed on the surface of a connector housing made from a graphitizable material having the insulation property, by graphitization of the material by irradiating the surface of the connector housing with a laser beam in an inert gas atmosphere.
    Type: Grant
    Filed: March 28, 2000
    Date of Patent: October 23, 2001
    Assignee: Yazaki Corporation
    Inventor: Yoshinobu Akiha
  • Patent number: 6054175
    Abstract: A conductive filler has a metallic layer having a low melting point formed on its surface. The filler can give an excellent electric/electromagnetic effect to a matrix.
    Type: Grant
    Filed: May 27, 1998
    Date of Patent: April 25, 2000
    Assignee: Yazaki Corporation
    Inventors: Yoshinobu Akiha, Tatsuya Kato, Hitoshi Ushijima
  • Patent number: 5966805
    Abstract: A connecting end portion of a planar circuit body and method of making same in which an end portion is directly formed into a terminal thereby improving conductivity and simplifying the connection. According to one embodiment, a connecting end portion of a flat cable is formed by laminating a rectangular circuit conductor with an insulating cover material, a terminal member is fixedly secured to the planar circuit conductor at an end portion of the circuit conductor with a conductive adhesive agent, and plated metal layer is formed thereon.
    Type: Grant
    Filed: November 1, 1996
    Date of Patent: October 19, 1999
    Assignee: Yazaki Corporation
    Inventors: Yoshinobu Akiha, Hitoshi Ushijima