Patents by Inventor Yoshinori Kono

Yoshinori Kono has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11991319
    Abstract: An apparatus includes circuitry to receive an input of problem information that is information on a problem, transmit the problem information to an information processing apparatus communicably connected to the apparatus via a network, and receive, from the information processing apparatus, troubleshooting information corresponding to the problem information. The troubleshooting information is information for solving the problem. The circuitry outputs the troubleshooting information, and transmits, to an extraneous resource, a repair request including the problem information and information indicating whether the troubleshooting information has been output.
    Type: Grant
    Filed: September 26, 2022
    Date of Patent: May 21, 2024
    Assignee: RICOH COMPANY, LTD.
    Inventors: Shuuko Kono, Yoshinori Tatsunokuchi, Hirobumi Tsuruoka, Masayoshi Furusawa, Satoru Toya
  • Publication number: 20230230660
    Abstract: An image generation device includes an imaging unit configured to convert data representing an expression level for each microRNA type into image-rendition data serving as data representing a matrix of two dimensions or more, a classification unit configured to perform classification of the image-rendition data, and a contribution-presentation-image generation unit configured to generate a contribution-presentation image representing a contribution of a specific part of the image-rendition data to the classification.
    Type: Application
    Filed: April 21, 2021
    Publication date: July 20, 2023
    Applicant: Kewpie Corporation
    Inventors: Tomoharu NAGAO, Shinichi SHIRAKAWA, Shiori ARII, Yoshinori KONO, Kurataka OTSUKA, Daisuke KURIKI
  • Patent number: 11660796
    Abstract: There is provided a die for extrusion in which an undesired reaction is suppressed in an inside thereof and with which variation in thickness of a resin sheet to be obtained can be reduced. A die for extrusion of the present invention includes: a cylindrical inflow port into which a molten resin flows; a manifold connected to the inflow port; a first slit connected to the manifold; a second slit connected to the first slit; and a lip land connected to the second slit. In the die for extrusion, the shape of a flow path is optimized based on a relationship among a position in the die, an operation time, and a vulcanization degree.
    Type: Grant
    Filed: July 1, 2020
    Date of Patent: May 30, 2023
    Assignee: NITTO DENKO CORPORATION
    Inventors: Yoshinori Kono, Akifumi Kido, Makoto Azukizawa
  • Publication number: 20220344052
    Abstract: An information provision device includes a miRNA divergence value calculation unit 12 that calculates miRNA divergence values from each of the miRNA measurement values in a user miRNA profile and each of the corresponding optimum miRNA values in an optimum miRNA profile, an individual miRNA score calculation unit 13 that calculates individual miRNA scores from each of miRNA importance values of a disease as an object of score calculation listed in a miRNA importance table and each of the miRNA divergence values, and a determination result data generation unit 15 that generates and outputs determination result data based on the individual miRNA scores.
    Type: Application
    Filed: May 28, 2020
    Publication date: October 27, 2022
    Inventors: Kurataka OTSUKA, Yoshinori KONO, Hideto YOSHIDA, Atsushi MIYATA, Yuko FUNABASHI
  • Publication number: 20210039296
    Abstract: There is provided a die for extrusion in which an undesired reaction is suppressed in an inside thereof and with which variation in thickness of a resin sheet to be obtained can be reduced. A die for extrusion of the present invention includes: a cylindrical inflow port into which a molten resin flows; a manifold connected to the inflow port; a first slit connected to the manifold; a second slit connected to the first slit; and a lip land connected to the second slit. In the die for extrusion, the shape of a flow path is optimized based on a relationship among a position in the die, an operation time, and a vulcanization degree.
    Type: Application
    Filed: July 1, 2020
    Publication date: February 11, 2021
    Applicant: NITTO DENKO CORPORATION
    Inventors: Yoshinori Kono, Akifumi Kido, Makoto Azukizawa
  • Patent number: 8689703
    Abstract: A weld-joining structure between an outer panel and an attachment is achieved, which is advantageous in terms of appearance, workability, and cost. To weld-join the outer panel and the attachments including, such as frame members and opening frames and opening frame members, which is a reinforcement or an interior or exterior member for use in the outer panel, the outer panel and the attachment placed on the outer panel are weld-joined by laser welding at overlapping portions of the outer panel and the attachment. The laser welding is performed along a polishing mark formed in one direction on an externally exposed-side surface of the outer panel and the attachment.
    Type: Grant
    Filed: November 30, 2006
    Date of Patent: April 8, 2014
    Assignee: The Kinki Sharyo Co., Ltd.
    Inventors: Hiroji Harada, Yoshinori Kono, Tomonori Sumikawa, Hiroshi Yonetani, Yasuhiro Tanaka, Eiichi Kato
  • Patent number: 8297202
    Abstract: To join vertically and horizontally arranged frame members to the interior face of an outer panel, the horizontal frame members are disposed on the outer panel so as to take precedence over the vertical frame members and are weld-joined to the outer panel. The vertical frame members are placed on the horizontal frame members from the interior side and are weld-joined to the horizontal frame members. The vertical frame member includes a standard-width frame member and a wide-width frame member having a width greater than the width of the standard-width frame member. The vertical frame members are joined to and in contact with the outer panel at a reduced number of points, so that the appearance of the outer panel is maintained in a good condition. With this configuration, a low cost vertical and horizontal frame structure is achieved, which has sufficiently high joint strength that provides the required strength of the outer panel.
    Type: Grant
    Filed: December 6, 2006
    Date of Patent: October 30, 2012
    Assignee: The Kinki Sharyo Co., Ltd.
    Inventors: Yoshinori Kono, Tomonori Sumikawa, Hiroshi Yonetani, Eiichi Kato
  • Publication number: 20100089283
    Abstract: To join vertically and horizontally arranged frame members to the interior face of an outer panel, the horizontal frame members are disposed on the outer panel so as to take precedence over the vertical frame members and are weld-joined to the outer panel. The vertical frame members are placed on the horizontal frame members from the interior side and are weld-joined to the horizontal frame members. The vertical frame member includes a standard-width frame member and a wide-width frame member having a width greater than the width of the standard-width frame member. The vertical frame members are joined to and in contact with the outer panel at a reduced number points, so that the appearance of the outer panel is maintained in a good condition. With this configuration, a low cost vertical and horizontal frame structure is achieved, which has sufficiently high joint strength that provides the required strength of the outer panel.
    Type: Application
    Filed: December 6, 2006
    Publication date: April 15, 2010
    Applicant: THE KINKI SHARYO CO., LTD.
    Inventors: Yoshinori Kono, Tomonori Sumikawa, Hiroshi Yonetani, Eiichi Kato
  • Publication number: 20100077935
    Abstract: A weld-joining structure between an outer panel and an attachment is achieved, which is advantageous in terms of appearance, workability, and cost. To weld-join the outer panel and the attachments including, such as frame members and opening frames and opening frame members, which is a reinforcement or an interior or exterior member for use in the outer panel, the outer panel and the attachment placed on the outer panel are weld-joined by laser welding at overlapping portions of the outer panel and the attachment. The laser welding is performed along a polishing mark formed in one direction on an externally exposed-side surface of the outer panel and the attachment.
    Type: Application
    Filed: November 30, 2006
    Publication date: April 1, 2010
    Applicant: THE KINKI SHARYO CO., LTD.
    Inventors: Hiroji Harada, Yoshinori Kono, Tomonori Sumikawa, Hiroshi Yonetani, Yasuhiro Tanaka, Eiichi Kato