Abstract: In order to obtain a silicon carbide semiconductor device that ensures both stability of withstand voltage and reliability in high-temperature operations in its termination end-portion provided for electric-field relaxation in the perimeter of a cell portion driven as a semiconductor element, the termination end-portion is provided with an inorganic protection film having high heat resistance that is formed on an exposed surface of a well region as a first region formed on a side of the cell portion, and an organic protection film having a high electrical insulation capability with a little influence by electric charges that is formed on a surface of an electric-field relaxation region formed in contact relation to an outer lateral surface of the well region and apart from the cell portion, and on an exposed surface of the silicon carbide layer.

Abstract: On a major surface of an n-type silicon carbide inclined substrate (2) is formed an n-type voltage-blocking layer (3) made of silicon carbide by means of epitaxial growth. On the n-type voltage-blocking layer (3) is formed a p-type silicon carbide region (4) rectangular when viewed from above. On the surface of the p-type silicon carbide region (4) is formed a p-type contact electrode (5). In the p-type silicon carbide region (4), the periphery of the p-type silicon carbide region (4) that is parallel with a (11-20) plane (14a) of the silicon carbide crystal, which is liable to cause avalanche breakdown, is located on the short side. In this manner, the dielectric strength of a silicon carbide semiconductor device can be improved.

Abstract: A semiconductor device includes an anode electrode in Schottky contact with an n-type drift layer formed in an SiC substrate and a JTE region formed outside the anode electrode. The JTE region is made up of a first p-type zone formed in an upper portion of the drift layer under an edge of the anode electrode and a second p-type zone formed outside the first p-type zone having a lower surface impurity concentration than the first p-type zone. The second p-type zone is provided 15 ?m or more outwardly away from the edge of the anode electrode. The surface impurity concentration of the first p-type zone ranges from 1.8×1013 to 4×1013 cm?2, and that of the second p-type zone ranges from 1×1013 to 2.5×1013 cm?2.

Abstract: On a major surface of an n-type silicon carbide inclined substrate (2) is formed an n-type voltage-blocking layer (3) made of silicon carbide by means of epitaxial growth. On the n-type voltage-blocking layer (3) is formed a p-type silicon carbide region (4) rectangular when viewed from above. On the surface of the p-type silicon carbide region (4) is formed a p-type contact electrode (5). In the p-type silicon carbide region (4), the periphery of the p-type silicon carbide region (4) that is parallel with a (11-20) plane (14a) of the silicon carbide crystal, which is liable to cause avalanche breakdown, is located on the short side. In this manner, the dielectric strength of a silicon carbide semiconductor device can be improved.

Abstract: An object of the invention is to provide a method for manufacturing a silicon carbide semiconductor device having constant characteristics with reduced variations in forward characteristics. The method for manufacturing the silicon carbide semiconductor device according to the invention includes the steps of: (a) preparing a silicon carbide substrate; (b) forming an epitaxial layer on a first main surface of the silicon carbide substrate; (c) forming a protective film on the epitaxial layer; (d) forming a first metal layer on a second main surface of the silicon carbide substrate; (e) applying heat treatment to the silicon carbide substrate at a predetermined temperature to form an ohmic junction between the first metal layer and the second main surface of the silicon carbide substrate; (f) removing the protective film; (g) forming a second metal layer on the epitaxial layer; and (h) applying heat treatment to the silicon carbide substrate at a temperature from 400° C. to 600° C.

Abstract: A semiconductor device includes an anode electrode in Schottky contact with an n-type drift layer formed in an SiC substrate and a JTE region formed outside the anode electrode. The JTE region is made up of a first p-type zone formed in an upper portion of the drift layer under an edge of the anode electrode and a second p-type zone formed outside the first p-type zone having a lower surface impurity concentration than the first p-type zone. The second p-type zone is provided 15 ?m or more outwardly away from the edge of the anode electrode. The surface impurity concentration of the first p-type zone ranges from 1.8×1013 to 4×1013 cm?2, and that of the second p-type zone ranges from 1×1013 to 2.5×1013 cm?2.

Abstract: An image forming apparatus includes an image carrier and a first developing unit for forming an image on the image carrier using at least one type of first developer to which a second developing unit for forming an image using at least one type of second developer which differs from the first developer is installable. The apparatus includes a developing unit determination part for determining the type of developing unit of the image forming apparatus, and an announcement part for announcing to the user that, when the second developing unit is not installed and an image formation instruction for instructing the formation of an image obtained by using the second developer is inputted, the image formation instruction cannot be made to effect a response.

Abstract: An image forming apparatus includes an image carrier and a first developing unit for forming an image on the image carrier using at least one type of first developer to which a second developing unit for forming an image using at least one type of second developer which differs from the first developer is installable. The apparatus includes a developing unit determination part for determining the type of developing unit of the image forming apparatus, and an announcement part for announcing to the user that, when the second developing unit is not installed and an image formation instruction for instructing the formation of an image obtained by using the second developer is inputted, the image formation instruction cannot be made to effect a response.

Abstract: An information storage method, digital data processing method and apparatus so that a user can conveniently and at low-cost deal with an image data. A data input/output device 85 reads an original and then transmits its image data to a data storage device 83 (data transmission T1). The data storage device 83 receives the image data and stores it in a memory 22J. The data storage device 83 replies with a storage location to the data input/output device 85 (data transmission T2). The data input/output device 85 prints the storage location. The user can obtain a printout 90 on which the storage location of the image data read at the data input/output device 85 is printed. The image data can then be acquired at a user computer set at a different place (data transmission T3, T4).

Abstract: The method of manufacturing a semiconductor apparatus can solve problems in that a semiconductor film is not separated completely from a substrate and a great quantity of etchant is required. Ammonium fluoride is added to a hydrofluoric acid solution, so as to improve the etching rate and promote separation of the semiconductor film from the substrate. A manufacturing apparatus according to the present invention is provided with a re-liquefying function capable of again liquefying vapor of hydrofluoric acid solution so as to use liquefied vapor as the etchant so that the etchant is saved.

Abstract: A process of forming electrodes is simplified during modularizing of a solar battery. According to the manufacturing method and the manufacturing apparatus, a thin solar battery is manufactured at a reduced cost and with a better yield. Using a robot which includes a suction chip which can handle a semiconductor film 2 without any damage which is separated from a particular substrate 1, the semiconductor films 2 are each accurately placed through a transparent resin 3 onto a glass substrate 7 which serves as a window of a solar battery, and p-type and n-type electrodes are printed at a time on the semiconductor films 2 which are arranged. Further, since a monolithic tab electrode is soldered to connect the electrodes, the manufacturing processes of the solar battery are simplified.

Abstract: A method for producing a thin film solar cell includes preparing a substrate of a low purity material and having opposed front and rear surfaces; forming an insulating film on the front surface of the substrate; forming a second conductivity type active layer of a high purity material on the insulating film with a front surface exposed; forming a second conductivity type semiconductor region within the active layer, reaching the front surface, to produce a p-n junction for light-to-electricity conversion; forming an anti-reflection film on the front surface of the active layer, the anti-reflection film reducing reflection of incident light; forming a surface electrode in contact with the front surface of the active layer; adhering the front surface side of the active layer to a supporting plate and selectively etching the low purity substrate from the rear surface to form a supporting substrate supporting the active layer; and forming a rear electrode on the rear surface of the supporting substrate contacting

Abstract: A solar battery cell, solar battery module, and solar battery module group achieving high product value by enabling the display of surface patterns without reducing the power generating efficiency of the solar battery cells are provided. The direction and/or reflectance of reflected light incident to the surface of the solar battery cell are varied by controlling the distribution of the rough surface structure imparted to the solar battery cell surface. The direction or reflectance of reflected light incident to the surface of the solar battery cell is changed in part depending upon the part of the semiconductor solar battery cell surface to which the light is incident. Semiconductor solar battery cells with high product value can therefore be achieved because patterns with strong visual impact can be displayed and easily recognized without reducing the power generation efficiency of the solar battery cell.

Abstract: A method for producing a thin-film solar cell includes successively depositing a lower anti-reflection film having a relatively large etching rate in a prescribed etchant and an upper anti-reflection film having a relatively small etching rate in the prescribed etchant on a photosensitive surface of a semiconductor substrate; patterning the upper anti-reflection film to form an aperture; and etching the lower anti-reflection film using the patterned upper anti-reflection film as a mask.

Abstract: A thin-film solar cell includes a thin active layer of high purity material having opposed front and rear surfaces for light-to-electricity conversion, a structure for supporting the thin active layer, and a rear electrode in contact with the rear surface of the active layer. The supporting structure includes a supporting substrate of a low purity material having opposed front and rear surfaces, on the front surface of which the rear surface of the active layer is disposed, and an insulating barrier layer interposed between the front surface of the supporting substrate and the rear surface of the active layer. The barrier layer prevents impurities in the supporting substrate from diffusing into the active layer. Since the supporting substrate comprises a low purity material, the quantity of the expensive high purity material can be reduced by reducing the thickness of the active layer, resulting in low production costs.