Patents by Inventor Yoshinori Nemoto

Yoshinori Nemoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Synthetic resin container having a rectangular cylindrical part and a round cylindrical narrow part
    Patent number: 8567625
    Abstract: A synthetic resin container including a mouth part 2, a shoulder part 3, a trunk part 4 and a bottom part 5, wherein the trunk part 4 has rectangular cylindrical parts 41 and 42, and a round cylindrical part 43 which is formed by narrowing into a cylindrical shape a region between the upper rectangular cylindrical part 41 positioned near the shoulder part 3 and the lower rectangular cylindrical part 42 positioned near the bottom part 5 side.
    Type: Grant
    Filed: August 27, 2008
    Date of Patent: October 29, 2013
    Assignee: Toyo Seikan Kaisha, Ltd.
    Inventor: Yoshinori Nemoto
  • SYNTHETIC RESIN CONTAINER
    Publication number: 20100163515
    Abstract: A synthetic resin container including a mouth part 2, a shoulder part 3, a trunk part 4 and a bottom part 5, wherein the trunk part 4 has rectangular cylindrical parts 41 and 42, and a round cylindrical part 43 which is formed by narrowing into a cylindrical shape a region between the upper rectangular cylindrical part 41 positioned near the shoulder part 3 and the lower rectangular cylindrical part 42 positioned near the bottom part 5 side.
    Type: Application
    Filed: August 27, 2008
    Publication date: July 1, 2010
    Applicant: TOYO SEIKAN KAISHA
    Inventor: Yoshinori Nemoto
  • Packaging container with finger receiving portion
    Patent number: 7712620
    Abstract: In a bottle 1 having a waist groove 61 and a grasping recess 63 nearly in the center of the height direction of a body portion 4 for imparting the sloped surface of a waist portion with necessary strength and restoring capability so that the denting and deformation of the sloped surface of the waist portion are prevented and for forming an easily graspable container even if it is a thin-wall container of which the weight has been decreased, a finger receiving recess 62 having the form of a convex curved surface toward an inside of the container is formed in a region including a container bottom portion side connecting face 61c of the waist groove 61.
    Type: Grant
    Filed: February 14, 2006
    Date of Patent: May 11, 2010
    Assignee: Tokyo Seikan Kaisha Ltd.
    Inventors: Yoshinori Nemoto, Masaki Miura, Noriaki Ushio
  • Packaging Container
    Publication number: 20080149588
    Abstract: In a bottle 1 having a waist groove 61 and a grasping recess 63 nearly in the center of the height direction of a body portion 4 for imparting the sloped surface of a waist portion with necessary strength and restoring capability so that the denting and deformation of the sloped surface of the waist portion are prevented and for forming an easily graspable container even if it is a thin-wall container of which the weight has been decreased, a finger receiving recess 62 having the form of a convex curved surface toward an inside of the container is formed in a region including a container bottom portion side connecting face 61c of the waist groove 61.
    Type: Application
    Filed: February 14, 2006
    Publication date: June 26, 2008
    Applicant: TOYO SEIKAN KAISHA, LTD.
    Inventors: Yoshinori Nemoto, Masaki Miura, Noriaki Ushio
  • Lead-free solder alloy and a manufacturing process of electric and electronic apparatuses using such a lead-free solder alloy
    Patent number: 6984254
    Abstract: A lead-free solder powder that can include a plurality of lead-free solder particles each having a general spherical shape with a diameter of 20–60 ?m. Each of the lead-free solder particles can contain Sn, Ag and Bi, with respective concentrations set such that the lead-free solder alloy has a melting temperature lower than a predetermined heat-resistant temperature of a work to be soldered.
    Type: Grant
    Filed: January 7, 2003
    Date of Patent: January 10, 2006
    Assignee: Fujitsu Limited
    Inventors: Masakazu Takesue, Yasuo Moriya, Yoshinori Nemoto, Yumiko Fukushima
  • Lead-free solder alloy and a manufacturing process of electric and electronic apparatuses using such a lead-free solder alloy
    Publication number: 20040052678
    Abstract: A lead-free solder powder that can include a plurality of lead-free solder particles each having a general spherical shape with a diameter of 20-60 &mgr;m. Each of the lead-free solder particles can contain Sn, Ag and Bi, with respective concentrations set such that the lead-free solder alloy has a melting temperature lower than a predetermined heat-resistant temperature of a work to be soldered.
    Type: Application
    Filed: January 7, 2003
    Publication date: March 18, 2004
    Applicant: Fujitsu Limited
    Inventors: Masakazu Takesue, Yasuo Moriya, Yoshinori Nemoto, Yumiko Fukushima
  • Lead-free solder alloy and a manufacturing process of electric and electronic apparatuses using such a lead-free solder alloy
    Publication number: 20030095888
    Abstract: A lead-free solder alloy composition containing Sn, Ag and Bi, with respective concentrations set such that the lead-free solder alloy has a melting temperature lower than a predetermined heat-resistant temperature of a work to be soldered.
    Type: Application
    Filed: November 12, 2002
    Publication date: May 22, 2003
    Applicant: Fujitsu Limited
    Inventors: Masayuki Kitajima, Masakazu Takesue, Yasuo Moriya, Yoshinori Nemoto, Yumiko Fukushima
  • Lead-free solder alloy and a manufacturing process of electric and electronic apparatuses using such a lead-free solder alloy
    Patent number: 6521176
    Abstract: A lead-free solder alloy composition containing Sn, Ag and Bi, with respective concentrations set such that the lead-free solder alloy has a melting temperature lower than a predetermined heat-resistant temperature of a work to be soldered.
    Type: Grant
    Filed: December 4, 2000
    Date of Patent: February 18, 2003
    Assignee: Fujitsu Limited
    Inventors: Masayuki Kitajima, Masakazu Takesue, Yasuo Moriya, Yoshinori Nemoto, Yumiko Fukushima
  • Lead-free solder alloy and a manufacturing process of electric and electronic apparatuses using such a lead-free solder alloy
    Publication number: 20010001990
    Abstract: A lead-free solder alloy composition containing Sn, Ag and Bi, with respective concentrations set such that the lead-free solder alloy has a melting temperature lower than a predetermined heat-resistant temperature of a work to be soldered.
    Type: Application
    Filed: December 4, 2000
    Publication date: May 31, 2001
    Applicant: Fujitsu Limited
    Inventors: Masayuki Kitajima, Masakazu Takesue, Yasuo Moriya, Yoshinori Nemoto, Yumiko Fukushima
  • Lead-free solder composition with Bi, In and Sn
    Patent number: 6184475
    Abstract: A lead-free solder alloy composition contains Sn, Bi and In, with respective contents such that the solder alloy composition provides a liquidus temperature below the heat resistant temperature of a work to be soldered. The alloy contains not more than about 60 wt % Bi; not more than about 50 wt % In; optionally at least one element selected from Ag, Zn, Ge, Ga, Sb, and P; and Sn. Also, lead-free solder powders containing same, and printed circuit boards, electronic components and electronic apparati employing such alloy.
    Type: Grant
    Filed: September 12, 1995
    Date of Patent: February 6, 2001
    Assignee: Fujitsu Limited
    Inventors: Masayuki Kitajima, Masakazu Takesue, Yasuo Moriya, Yoshinori Nemoto, Yumiko Fukushima