Abstract: A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.

Abstract: A vibration damping device comprises: a spindle member through which a shaft portion is inserted, the spindle member being movable along a length direction of the shaft portion; a first coil spring disposed between the spindle member and one end portion of the shaft portion in the length direction, the one end portion of the shaft portion being inserted through the first coil spring, and the first coil spring urging the spindle member toward a side of another end portion of the shaft portion in the length direction; and a second coil spring disposed between the another end portion of the shaft portion and the spindle member, the another end portion of the shaft portion being inserted through the second coil spring, and the second coil spring urging the spindle member toward a side of the one end portion of the shaft portion.

Abstract: A vibration damping device comprises: a spindle member through which a shaft portion is inserted, the spindle member being movable along a length direction of the shaft portion; a first coil spring disposed between the spindle member and one end portion of the shaft portion in the length direction, the one end portion of the shaft portion being inserted through the first coil spring, and the first coil spring urging the spindle member toward a side of another end portion of the shaft portion in the length direction; and a second coil spring disposed between the another end portion of the shaft portion and the spindle member, the another end portion of the shaft portion being inserted through the second coil spring, and the second coil spring urging the spindle member toward a side of the one end portion of the shaft portion.