Abstract: A low-dielectric heat dissipation film composition contains: (A) a maleimide resin composition containing (A1) a maleimide resin containing at least two or more maleimide groups per molecule and (A2) a polymerization initiator; and (B) boron nitride particles. The component (A1) has a maleimide equivalent of not more than 0.1 mol/100 g, and a cured material of the component (A) has a relative dielectric constant of 3.5 or less at a frequency of 10 GHz. Thus, the present invention provides a film composition for forming a film having low dielectric constant and high heat dissipation.

Abstract: A method for preparing a compact of resin compound comprising the following steps (a) to (c): (a) a preparation step of mounting a sheet-shaped or block-shaped compact of resin compound including a resin composition, which contains a filler having magnetic anisotropy and is solidified by curing or by being advanced to a B-stage, on a transportation unit which is movable in the horizontal direction, and covering at least a top surface of the compact of resin compound with a cover material; (b) a step of applying a magnetic field to the compact of resin compound obtained in the step (a) with a bulk superconductor magnet having a central magnetic flux density of 1 T or more; and (c) a step of moving the compact of resin compound in the horizontal direction and scanning it while applying vibrations to the compact of resin compound mounted on a region of a central part of the bulk superconductor magnet under application of a magnetic field.

Abstract: Provided are a thermally conductive resin sheet having light transmission, including a cured product of a fiber cloth-containing thermally conductive resin composition prepared by thermally curing or semi-curing a laminate composed of five or more sheets of a prepreg made by impregnating a fiber cloth made of thermally conductive fibers as warp and white or transparent fibers as weft with a transparent curable resin composition, the cured product having a cut surface vertical to a length direction of the thermally conductive fibers, and a method for producing the thermally conductive resin sheet.

Abstract: An anisotropic heat-conductive composite silicone rubber sheet comprising: at least five heat-conductive silicone rubber layers each of which contains a heat-conductive filler and has an Asker C hardness of 2 to 30; and at least five fiber cloth layers each of which is impregnated with a silicone rubber or a silicone resin and in each of which warps comprise highly heat-conductive fibers each having a heat conductivity of 100 W/mK or more, wherein the heat-conductive silicone rubber layers and the fiber cloth layers are arranged alternately; and a method for producing the anisotropic heat-conductive composite silicone rubber sheet.

Abstract: An anisotropic heat-conductive sheet having self-adhesiveness is defined as comprising a heat-conductive layer of a cured resin composition comprising (A) a fibrous heat-conductive filler and (B) a thermosetting organopolysiloxane composition, the heat-conductive sheet having a penetration of at least 30. The heat-conductive sheet has many advantages including reliability, thermal conductivity, adhesiveness, and elongation.

Abstract: A low-dielectric heat dissipation film composition contains: (A) a maleimide resin composition containing (A1) a maleimide resin containing at least two or more maleimide groups per molecule and (A2) a polymerization initiator; and (B) boron nitride particles. The component (A1) has a maleimide equivalent of not more than 0.1 mol/100 g, and a cured material of the component (A) has a relative dielectric constant of 3.5 or less at a frequency of 10 GHz. Thus, the present invention provides a film composition for forming a film having low dielectric constant and high heat dissipation.

Abstract: A resin sheet has a single composition, and changes in thermal conductivity according to an area. The resin sheet includes a region having a thermal conductivity that is greater than an average value of a thermal conductivity of an entirety of the resin sheet by 1 W/mK or more. A method for manufacturing a resin sheet includes: forming a resin composition into a molded body having a sheet shape, the resin composition containing a filler having magnetic anisotropy; performing magnetic field orientation on the filler by using a bulk superconductor magnet in one or a plurality of predetermined portions of the molded body; and forming a region having a thermal conductivity that is greater than an average value of a thermal conductivity of an entirety of the resin sheet by 1 W/mK or more, in the one or the plurality of predetermined portions.

Abstract: A method for producing a hydrosilyl group-containing organic silicon resin of formula (6) in a solid form, wherein after formulae (1) to (3) are hydrolyzed in the presence of an acid catalyst, hydrolysis is carried out by adding hydrosilyl group-containing organic silicon compounds of formulae (4) and (5), followed by neutralization by a base catalyst with the amount thereof being more than a molar equivalent of the acid catalyst, and then by condensation. By so doing, deactivation amount of the hydrosilyl group can be reduced, so that the method for producing the hydrosilyl group-containing organic silicon resin, which is in a solid form without a solvent and to which a hydrosilyl group can be introduced quantitatively and in a large quantity, is provided, R13SiOSiR13??(1) R13SiX1??(2) SiX24??(3) HnR23-nSiOSiR23-nHn??(4) HnR23-nSiX3??(5) (R13SiO1/2)a(HnR23-nSiO1/2)b(SiO2)c(R4SiO3/2)d??(6).

Abstract: A method for preparing a compact of resin compound comprising the following steps (a) to (c): (a) a preparation step of mounting a sheet-shaped or block-shaped compact of resin compound including a resin composition, which contains a filler having magnetic anisotropy and is solidified by curing or by being advanced to a B-stage, on a transportation unit which is movable in the horizontal direction, and covering at least a top surface of the compact of resin compound with a cover material; (b) a step of applying a magnetic field to the compact of resin compound obtained in the step (a) with a bulk superconductor magnet having a central magnetic flux density of 1 T or more; and (c) a step of moving the compact of resin compound in the horizontal direction and scanning it while applying vibrations to the compact of resin compound mounted on a region of a central part of the bulk superconductor magnet under application of a magnetic field.

Abstract: An anisotropic heat-conductive composite silicone rubber sheet comprising: at least five heat-conductive silicone rubber layers each of which contains a heat-conductive filler and has an Asker C hardness of 2 to 30; and at least five fiber cloth layers each of which is impregnated with a silicone rubber or a silicone resin and in each of which warps comprise highly heat-conductive fibers each having a heat conductivity of 100 W/mK or more, wherein the heat-conductive silicone rubber layers and the fiber cloth layers are arranged alternately; and a method for producing the anisotropic heat-conductive composite silicone rubber sheet.

Abstract: Provided are a thermally conductive resin sheet having light transmission, including a cured product of a fiber cloth-containing thermally conductive resin composition prepared by thermally curing or semi-curing a laminate composed of five or more sheets of a prepreg made by impregnating a fiber cloth made of thermally conductive fibers as warp and white or transparent fibers as weft with a transparent curable resin composition, the cured product having a cut surface vertical to a length direction of the thermally conductive fibers, and a method for producing the thermally conductive resin sheet.

Abstract: A method for producing a hydrosilyl group-containing organic silicon resin of formula (6) in a solid form, wherein after formulae (1) to (3) are hydrolyzed in the presence of an acid catalyst, hydrolysis is carried out by adding hydrosilyl group-containing organic silicon compounds of formulae (4) and (5), followed by neutralization by a base catalyst with the amount thereof being more than a molar equivalent of the acid catalyst, and then by condensation.

Abstract: A (meth)allylsilane compound that a functional group of a (meth)allylsilyl group or a halogenosilyl group bonded to the (meth)allylsilyl group via a spacer group is bonded directly or through a divergent spacer group to a dehydrogenated residue of an amino group of an amino group-containing compound; a carbaminic acid ester group or an amide group derived from a dehydrogenated residue of the amino group; an aromatic compound; a polymerizable unsaturated groups; perfluoro group; a dehydrogenated residue of saccharide or a carbohydrate polyol (excluding when the divergent spacer group is an alkylene group, or an alkylene group and an arylene group); a dehydrogenated residue of an amino acid; a halogenosilyl group; or a substituted silyl group in which a halogen of the halogenosilyl group is substituted.

Abstract: A (meth)allylsilane compound that a functional group of a (meth)allylsilyl group or a halogenosilyl group bonded to the (meth)allylsilyl group via a spacer group is bonded directly or through a divergent spacer group to a dehydrogenated residue of an amino group of an amino group-containing compound; a carbaminic acid ester group or an amide group derived from a dehydrogenated residue of the amino group; an aromatic compound; a polymerizable unsaturated groups; perfluoro group; a dehydrogenated residue of saccharide or a carbohydrate polyol (excluding when the divergent spacer group is an alkylene group, or an alkylene group and an arylene group); a dehydrogenated residue of an amino acid; a halogenosilyl group; or a substituted silyl group in which a halogen of the halogenosilyl group is substituted.