Abstract: The in-vehicle device mounted on the vehicle includes a control unit having a function of acquiring traffic congestion information for each lane on a road having a plurality of lanes and guiding the vehicle to another lane based on the acquired traffic congestion information, and when the vehicle travels in a predetermined section from the exit in a first lane connected to the exit from the road, the control unit cancels the function.

Abstract: An object is to provide a technique capable of easily taking out a submodule from a semiconductor device to reuse the submodule. The semiconductor device includes: a submodule in which a conductive plate and a semiconductor element mounted to an upper surface of the conductive plate via a first bonding material are sealed with a first sealing material; an insulating substrate bonded to a lower surface of the submodule via a second bonding material; a case surrounding a periphery of the insulating substrate and the submodule; and a second sealing material sealing a region surrounded by the case so that at least an upper surface of the submodule is exposed.

Abstract: A battery preferably improved in reliability is provided. In accordance with a preferable one aspect of a battery herein disclosed, the battery comprising: an electrode body including respective electrodes of positive and negative electrodes; a battery case including an opening, and for accommodating the electrode body; a sealing plate including a terminal mounting hole, and for sealing the opening; a collector terminal electrically joined at one end thereof with any electrode of the positive and negative electrodes inside the battery case, and inserted at another end thereof through the terminal mounting hole to be exposed to outside the sealing plate; and an insulating member for establishing an insulation between at least a part of the sealing plate and the collector terminal. A plurality of concave parts are existed at the collector terminal, and the concave part is filled with the insulating member opposed to the concave part.

Abstract: A semiconductor apparatus includes: a first conductor plate; a second conductor plate separated from the first conductor plate; a plurality of semiconductor devices having back surface electrodes connected to the first conductor plate; a relay substrate mounted on the second conductor plate and including a plurality of first relay pads and a second relay pad connected to the plurality of first relay pads; a plurality of metal wires respectively connecting control electrodes of the plurality of semiconductor devices to the plurality of first relay pads; a first conductor block connected to front surface electrodes of the plurality of semiconductor devices; a second conductor block connected to the second relay pad; and a sealing material sealing the first and second conductor plates, the plurality of semiconductor devices, the relay substrate, the metal wire, and the first and second conductor blocks, the sealing material includes a first principal surface and a second principal surface opposed to each other,

Abstract: A semiconductor device includes a base plate, a substrate, a semiconductor element, a case, and a wiring terminal. The case is disposed on the base plate so as to cover the substrate and the semiconductor element. The wiring terminal is electrically connected to the semiconductor element. The case includes a first case unit and a second case unit that is separate from the first case unit. The wiring terminal includes a first wiring unit and a second wiring unit. The first wiring unit is disposed so as to protrude from an inside to an outside of the case, and is electrically connected to the semiconductor element. The second wiring unit is bent with respect to the first wiring unit and disposed outside the case. The first case unit and the second case unit are disposed so as to sandwich the first wiring unit.

Abstract: A power storage device in which an electrode body is housed in a can is provided with a movement restricting member including an electrode-body bonding portion placed in the can and bonded to a fixing surface of a thickness-direction outside surface located outside in a thickness direction of an electrode sheet, out of outer surfaces of the electrode body, and a can fixing portion that extends from the electrode-body bonding portion and is fixed to the can to restrict movement of the electrode body in the can.

Abstract: A secondary battery disclosed herein includes an electrode body, a case body having an opening that houses the electrode body, and a lid mounted at the opening of the case body. The lid includes a liquid injection port through which an electrolyte is injected, an insulation member mounted on an inner surface of the lid, and an insulation holder that is mounted on the insulation member and at least a portion of which is opposed to the liquid injection port at an interval. The insulation holder includes a liquid receiving portion disposed in a position opposed to the liquid injection port, and an electrode body protective portion disposed in a position closer to the electrode body than a position of the liquid receiving portion.

Abstract: A power module is obtained in which the thermal resistance in the range from a semiconductor device to a base plate is reduced and the stress in the joining portion is relieved. The power module includes at least one semiconductor device, an insulating substrate having an insulating layer, a circuit layer provided on an upper surface of the insulating layer and a metal layer provided on a lower surface of the insulating layer, and a sintering joining member with an upper surface larger in outer circumference than a back surface of the at least one semiconductor device, to join together the back surface of the at least one semiconductor device and an upper surface of the circuit layer on an upper-surface side of the insulating layer.

Abstract: A semiconductor apparatus includes: a first conductor plate; a second conductor plate separated from the first conductor plate; a plurality of semiconductor devices having back surface electrodes connected to the first conductor plate; a relay substrate mounted on the second conductor plate and including a plurality of first relay pads and a second relay pad connected to the plurality of first relay pads; a plurality of metal wires respectively connecting control electrodes of the plurality of semiconductor devices to the plurality of first relay pads; a first conductor block connected to front surface electrodes of the plurality of semiconductor devices; a second conductor block connected to the second relay pad; and a sealing material sealing the first and second conductor plates, the plurality of semiconductor devices, the relay substrate, the metal wire, and the first and second conductor blocks, the sealing material includes a first principal surface and a second principal surface opposed to each other,

Abstract: A semiconductor device includes a base plate, a substrate, a semiconductor element, a case, and a wiring terminal. The case is disposed on the base plate so as to cover the substrate and the semiconductor element. The wiring terminal is electrically connected to the semiconductor element. The case includes a first case unit and a second case unit that is separate from the first case unit. The wiring terminal includes a first wiring unit and a second wiring unit. The first wiring unit is disposed so as to protrude from an inside to an outside of the case, and is electrically connected to the semiconductor element. The second wiring unit is bent with respect to the first wiring unit and disposed outside the case. The first case unit and the second case unit are disposed so as to sandwich the first wiring unit.

Abstract: A semiconductor module and a power converter are obtained that can be miniaturized while reliably connecting a control signal electrode of a semiconductor chip to a control signal terminal. The semiconductor module includes a base member, a semiconductor chip, a positioning member, and a control signal terminal. The semiconductor chip is mounted on the base member. The semiconductor chip includes a control signal electrode. The positioning member includes a positioning portion that contacts an outer peripheral end portion of the semiconductor chip. The positioning member is disposed on the base member. The control signal terminal is fixed to the positioning member. The control signal terminal is connected to the control signal electrode.

Abstract: Provided is a semiconductor device free from chipping of a thin semiconductor element during transportation. The semiconductor device includes: a thin semiconductor element including a front-side electrode on the front side of the semiconductor element, and including a back-side electrode on the back side of the semiconductor element; a metallic member formed on at least one of the front-side electrode and the back-side electrode, the metallic member having a thickness equal to or greater than the thickness of the semiconductor element; and a resin member in contact with the lateral side of the metallic member and surrounding the periphery of the metallic member, with a part of the front side of the semiconductor element being exposed.

Abstract: Provided is a semiconductor device free from chipping of a thin semiconductor element during transportation. The semiconductor device includes: a thin semiconductor element including a front-side electrode on the front side of the semiconductor element, and including a back-side electrode on the back side of the semiconductor element; a metallic member formed on at least one of the front-side electrode and the back-side electrode, the metallic member having a thickness equal to or greater than the thickness of the semiconductor element; and a resin member in contact with the lateral side of the metallic member and surrounding the periphery of the metallic member, with a part of the front side of the semiconductor element being exposed.

Abstract: A secondary battery includes an electrode body including a positive electrode plate and a negative electrode plate; a battery case containing the electrode body; a terminal attached to the battery case; a conductive member having an opening adjacent to the electrode body; a deformation plate that seals the opening, and a current collector. The positive electrode plate and a positive electrode terminal are electrically connected to each other via a first positive electrode current collector, the deformation plate, and the conductive member. The first positive electrode current collector has a through-hole. The deformation plate is disposed to face the through-hole. A portion of the first positive electrode current collector distant from the through-hole is welded to the deformation plate to form a weld.

Abstract: A secondary battery includes an electrode body including a positive electrode plate and a negative electrode plate; a battery case containing the electrode body; a positive electrode terminal attached to the battery case; a conductive member having an opening adjacent to the electrode body; a deformation plate that seals the opening, and a current collector. The positive electrode plate and the positive electrode terminal are electrically connected to each other via a first positive electrode current collector, the deformation plate, and the conductive member. The deformation plate has a thick portion, which has a larger thickness than the surrounding area, in a central part. The thick portion of the deformation plate is welded to the first positive electrode current collector to form a weld.

Abstract: A secondary battery includes an electrode body including a positive electrode plate and a negative electrode plate; a battery case containing the electrode body; a terminal attached to the battery case; a conductive member having an opening adjacent to the electrode body; a deformation plate that seals the opening, and a current collector. The positive electrode plate and a positive electrode terminal are electrically connected to each other via a first positive electrode current collector, the deformation plate, and the conductive member. The first positive electrode current collector has a through-hole. The deformation plate is disposed to face the through-hole. A portion of the first positive electrode current collector distant from the through-hole is welded to the deformation plate to form a weld.

Abstract: A secondary battery includes an electrode body including a positive electrode plate and a negative electrode plate; a battery case containing the electrode body; a positive electrode terminal attached to the battery case; a conductive member having an opening adjacent to the electrode body; a deformation plate that seals the opening, and a current collector. The positive electrode plate and the positive electrode terminal are electrically connected to each other via a first positive electrode current collector, the deformation plate, and the conductive member. The deformation plate has a thick portion, which has a larger thickness than the surrounding area, in a central part. The thick portion of the deformation plate is welded to the first positive electrode current collector to form a weld.

Abstract: A power semiconductor device having a high degree of reliability even when an operable temperature of a power semiconductor element is sufficiently increased. The power semiconductor device includes: a power semiconductor element including an electrode formed on a first surface; a first stress mitigation portion connected to the electrode with a first bonding portion being interposed; and a wiring portion electrically connected to the first stress mitigation portion with a second bonding portion being interposed. A bonding strength of the first bonding portion is higher than a bonding strength of the second bonding portion.

Abstract: Provided is a semiconductor device having high heat conductivity and high productivity. A semiconductor device includes an insulating substrate, a semiconductor element, a die-bond material, a joining material, and a cooler. The insulating substrate has an insulating ceramic, a first conductive plates disposed on one surface of the insulating ceramic, and a second conductive plate disposed on another surface of the insulating ceramic. The semiconductor element is disposed on the first conductive plate through the die-bond material. The die-bond material contains sintered metal. The semiconductor element has a bending strength degree of 700 MPa or more, and has a thickness of 0.05 mm or more and 0.1 mm or less. The cooler is joined to the second conductive plate through the joining material.

Abstract: A power module includes an insulated circuit board, a semiconductor element, a first buffer plate, and first and second joining materials. The semiconductor element is disposed on a side of one main surface of the insulated circuit board. The first buffer plate is disposed between the insulated circuit board and the semiconductor element. The first joining material is divided into a plurality of portions in a plan view. The first buffer plate is higher in coefficient of linear expansion than the semiconductor element and lower in coefficient of linear expansion than the insulated circuit board. The first buffer plate is lower in Young's modulus than the semiconductor element.