Abstract: A waste decomposition apparatus has a container-shaped body, a waste inlet for introducing wastes into the body, an outlet for discharging residual ash out of the body after the wastes introduced into the body are decomposed, and magnetic functioning means for inducing magnetic fields in the wastes introduced into the body. The waste decomposition apparatus includes pressing means for pressing the wastes introduced into the body.

Abstract: Disclosed is a pressure-sensitive adhesive sheet for use in processing a product such a semiconductor wafer. To provide a pressure-sensitive adhesive sheet that provides a minimized number of broken semiconductor wafers during the process of polishing them and that produces a less curl of the wafer due to the residual stress of the pressure-sensitive adhesive sheet, the pressure-sensitive adhesive sheet includes a composite film formed from a composition containing a urethane polymer and a vinyl polymer as effective components, a first film comprising a material different from that of the composite film, and a pressure-sensitive adhesive layer. It is preferable that the pressure-sensitive adhesive sheet has a modulus of 9 N/mm2 or more and 250 N/mm2 or less when an oblong piece of the pressure-sensitive adhesive sheet with a width of 20 mm is bent at a radius of curvature of 3.0 mm.

Abstract: The present invention provides a logistic PKI service system that improves reliability and security of its distribution portion. An article displayed on a shop terminal is purchased from a user's mobile terminal via a network. Then, a shop terminal receives distribution label data from a PKI. The user's mobile terminal receives authentication information transmitted by the PKI. The shop terminal generates a distribution label on the basis of the distribution label data from the PKI. Then, the shop terminal attaches the distribution label to the article and then requests a distributor to deliver the article. After the distributor delivers the article to a user, the user's mobile terminal reads information from the distribution label attached to the article. The user's mobile terminal then carries out information on the basis of the information from the distribution label and the authentication information from the PKI.

Abstract: The present invention provides a logistic PKI service system that improves reliability and security of its distribution portion. An article displayed on a shop terminal is purchased from a user's mobile terminal via a network. Then, a shop terminal receives distribution label data from a PKI. The user's mobile terminal receives authentication information transmitted by the PKI. The shop terminal generates a distribution label on the basis of the distribution label data from the PKI. Then, the shop terminal attaches the distribution label to the article and then requests a distributor to deliver the article. After the distributor delivers the article to a user, the user's mobile terminal reads information from the distribution label attached to the article. The user's mobile terminal then carries out information on the basis of the information from the distribution label and the authentication information from the PKI.

Abstract: The present invention provides a logistic PKI service system that improves reliability and security of its distribution portion. An article displayed on a shop terminal is purchased from a user's mobile terminal via a network. Then, a shop terminal receives distribution label data from a PKI. The user's mobile terminal receives authentication information transmitted by the PKI. The shop terminal generates a distribution label on the basis of the distribution label data from the PKI. Then, the shop terminal attaches the distribution label to the article and then requests a distributor to deliver the article. After the distributor delivers the article to a user, the user's mobile terminal reads information from the distribution label attached to the article. The user's mobile terminal then carries out information on the basis of the information from the distribution label and the authentication information from the PKI.

Abstract: The external base electrode has a two-layered structure where a p-type polysilicon film doped with a medium concentration of boron is laminated on a p-type polysilicon film doped with a high concentration of boron. Therefore, since the p-type polysilicon film doped with a high concentration of boron is in contact with an intrinsic base layer at a junction portion between the external base electrode and the intrinsic base layer, the resistance of the junction portion can be reduced. In addition, since the resistance of the external base electrode becomes a parallel resistance of the two layers of the p-type polysilicon films, the resistance of the p-type polysilicon film whose boron concentration is relatively lower is dominant.

Abstract: To provide a pressure-sensitive adhesive that is used in processing an article such as a semiconductor wafer that causes neither contamination nor breakage of the semiconductor wafer during the processing, the pressure-sensitive adhesive sheet has a base, an intermediate layer, and a pressure-sensitive adhesive layer in order. The intermediate layer includes a composite film that contains an acrylic-based polymer and a vinyl-based polymer as active ingredients. The urethane polymer contains a component having a weight-average molecular weight of 10,000 or less in a differential molecular weight curve in a content of less than 10%.

Abstract: To provide a pressure-sensitive adhesive that is used in processing an article such as a semiconductor wafer, the pressure-sensitive adhesive sheet is one that has a base, an intermediate layer and a pressure-sensitive adhesive layer in order, wherein the intermediate layer has an elastic modulus at elongation at 23° C. of 1 MPa or more and 100 MPa or less, the intermediate layer includes an acrylic polymer obtained by polymerization of a (meth) acrylic monomer mixture containing 1% by weight or more and 20% by weight or less of a nitrogen-containing acrylic monomer, the acrylic polymer containing 20% by weight or less of a polymer component having a molecular weight of 100,000 or less, and the base includes at least one film having an elastic modulus at in tension at 23° C. of 0.6 GPa or more.

Abstract: To provide a pressure-sensitive adhesive sheet, which is used in processing an article such as a semiconductor wafer, the pressure-sensitive adhesive sheet has a base, an intermediate layer and a pressure-sensitive adhesive layer in this order, wherein the intermediate layer has an elastic modulus in tension at 23° C. of 10 MPa or more and 100 Mpa or less, the intermediate layer includes an acrylic-based polymer obtained by polymerization of a mixture containing 70 to 99 parts by weight of a (meth)acrylate monomer and 1 to 30 parts by weight of an unsaturated carboxylic acid based on 100 parts by weight of total monomers, and the base includes at least one film having an elastic modulus in tension at 23° C. of 0.6 GPa or more.

Abstract: To provide a pressure-sensitive adhesive sheet for use in processing wafers and the like articles, that produces less cutting sludge of the pressure-sensitive adhesive sheet and that can follow up unevenness of a wafer even when a difference in height of the unevenness is large, the pressure-sensitive adhesive sheet includes a base having on one surface thereof an intermediate layer and a pressure-sensitive adhesive layer in order, wherein the intermediate layer has an initial elastic modulus of 0.5 N/mm2 or less, a loss tangent (tan?) at 20° C. to 70° C. of 0.

Abstract: To provide a pressure-sensitive adhesive sheet used during processing articles such as semiconductor wafers and laminate sheet used for such a pressure-sensitive adhesive sheet, which does not contaminate or break the semiconductor wafers during the processing and can minimize the curl of the articles due to residual stress of the pressure-sensitive adhesive sheet, a multi-layer sheet includes a composite film containing a urethane polymer and a vinyl-based polymer as effective components and a first film made of a material different from that of the composite film, wherein the urethane polymer is formed from a polyolefin diol and a polyisocyanate. A pressure-sensitive adhesive sheet is obtained by providing a pressure-sensitive adhesive layer on at least one side of the multi-layer sheet.

Abstract: A visible light information providing device, a visible light information reader, a visible light information providing system, a visible light information providing method, a program thereof, and a computer-readable information storage medium for storing the program, enabling a user to recognize the area to which information is provided in a contactless manner. A visible light information providing device comprises a memory, an LED (Light Emitting Diode) for emitting visible light, a modulator circuit for modulating visible light emitted from the LED to transmit information stored in the memory, and a CPU (Central Processing Unit) for controlling the modulator circuit according to the type of information stored in the memory so that the LED emits a prescribed visible light pattern.

Abstract: Disclosed is a pressure-sensitive adhesive sheet for use in processing a product such a semiconductor wafer. To provide a pressure-sensitive adhesive sheet that provides a minimized number of broken semiconductor wafers during the process of polishing them and that produces a less curl of the wafer due to the residual stress of the pressure-sensitive adhesive sheet, the pressure-sensitive adhesive sheet includes a composite film formed from a composition containing a urethane polymer and a vinyl polymer as effective components, a first film comprising a material different from that of the composite film, and a pressure-sensitive adhesive layer. It is preferable that the pressure-sensitive adhesive sheet has a modulus of 9 N/mm2 or more and 250 N/mm2 or less when an oblong piece of the pressure-sensitive adhesive sheet with a width of 20 mm is bent at a radius of curvature of 3.0 mm.

Abstract: To provide a cleaning sheet that can remove foreign matter adhering on a probe needle without wearing the probe needle and that does not allow the foreign matter to re-adhere on the probe needle, the cleaning sheet has a cleaning layer on at least one surface thereof, the cleaning layer containing a urethane polymer and a vinyl monomer.

Abstract: Disclosed is a pressure-sensitive adhesive sheet for use in processing a product such a semiconductor wafer. To provide a pressure-sensitive adhesive sheet that provides a minimized number of broken semiconductor wafers during the process of polishing them and that produces a less curl of the wafer due to the residual stress of the pressure-sensitive adhesive sheet, the pressure-sensitive adhesive sheet includes a composite film formed from a composition containing a urethane polymer and a vinyl polymer as effective components, a first film comprising a material different from that of the composite film, and a pressure-sensitive adhesive layer, in which the pressure-sensitive adhesive sheet has a modulus of 9 N/mm2 or more and 250 N/mm2 or less when an oblong piece of the pressure-sensitive adhesive sheet with a width of 20 mm is bent at a radius of curvature of 3.0 mm.

Abstract: The present invention provides a logistic PKI service system that improves reliability and security of its distribution portion. An article displayed on a shop terminal is purchased from a user's mobile terminal via a network. Then, a shop terminal receives distribution label data from a PKI. The user's mobile terminal receives authentication information transmitted by the PKI. The shop terminal generates a distribution label on the basis of the distribution label data from the PKI. Then, the shop terminal attaches the distribution label to the article and then requests a distributor to deliver the article. After the distributor delivers the article to a user, the user's mobile terminal reads information from the distribution label attached to the article. The user's mobile terminal then carries out information on the basis of the information from the distribution label and the authentication information from the PKI.

Abstract: A manufacturing system of semiconductor devices, which comprises a dispersing equipment for dispersing inorganic oxide with water, a filtrating equipment provided behind the dispersing equipment for filtrating the slurry sent from the dispersing equipment, a supplying equipment provided behind the filtrating equipment for supplying the slurry sent from the filtrating equipment to a CMP polishing equipment, and the CMP polishing equipment provided behind the supplying equipment for polishing semiconductor devices by using the slurry supplied from the supplying equipment. According to the present invention, it is possible to supply slurry to the CMP polishing equipment at the right time in the right quantity. Accordingly, it is possible to eliminate the cost incurred by performing the strict quality control of the slurry during the storage.

Abstract: A method of the production of a plastic lens substrate is provided which comprises the steps of retaining a starting plastic block material on a processing material retainer, holding a processing tool on a tool holder, the processing tool having a processing end portion dimensioned to be smaller than the dimension of the block material, manipulating the processing tool and/or the block material to thereby subject both of the same to relative movement, and repeating the steps mentioned upon exchange of the processing tool for one for use in subsequent processing. The method leads, in automated manner with improved production efficiency and increased cost saving, to a plastic lens substrate having a lens surface such as a spherical surface, a toric surface, an aspherical surface, a progressive surface, a combination of aspherical and toric surfaces or a combination of progressive and toric surfaces. Also disclosed is an apparatus for producing the lens substrate.

Abstract: An outdoor unit for use in a separate type air conditioner which includes an outdoor unit and an indoor unit each having at least a compressor, a heat exchanger, and a expansion device, with one unit connected with the other by refrigerant-tubes so that they altogether form an air conditioning system. The outdoor unit comprises: a baseplate, a housing having a first air intake window (side air intake window) in one of its side walls, a second air intake window (rear air intake window) formed in the rear wall extending upright from the baseplate, and an air outlet window (front air outlet window) formed in the front wall; a partition board extending upright from the baseplate and portioning for the internal space of the housing into a fan compartment for accommodating the heat exchanger and a fan for supplying air to the heat exchanger; and a machinery compartment for accommodating the compressor.

Abstract: In a miniature or small-sized video camera, a front block assembly including an image pick-up element and a rear block assembly are respectively secured within opposed open ends of a tubular outer casing, and a base plate assembly is disposed within the casing between the front and rear block assemblies and includes a plurality of elongated base plates arranged in longitudinally overlapped folded relation and having electronic elements or components mounted thereon and included in an electrical circuit through flexible flat cable elements which connect the base plates end-to-end to each other and to the image pick-up element and to a connector in the rear block assembly for outputting a video signal.