Abstract: According to one embodiment, an optical device includes a lead, an optical element, and a sealing layer. The optical element is provided on the lead. The sealing layer is provided so as to cover the optical element. An upper surface of the sealing layer has a central portion including an optical axis of the optical element, a protrusion including an inner side surface surrounding the central portion and an outer side surface facing outward, and a connecting portion provided below the inner side surface and between the inner side surface and the central portion. The connecting portion includes a rounded portion on at least one of the inner side surface side and the central portion side. The outer side surface of the protrusion has average value of gradient angle larger than average value of gradient angle of a surface of the central portion.

Abstract: According to one embodiment, a semiconductor device includes a lead, a frame, an optical semiconductor element, a sealing resin and a lens. The frame includes a main body covering a portion of the lead and being provided with a recess, another portion of the lead being exposed in the recess, and a casing part provided along an opening edge of the recess, the casing part including a cutout portion. The optical semiconductor element is provided in the recess and is in electrical connection with the lead. The sealing resin fills the recess from a bottom to the casing part, thereby covering the optical semiconductor element. The lens is joined to the sealing resin.

Abstract: A light-emitting device includes: a first lead including a bonding region and a first outer edge extending generally parallel to a first direction; a light-emitting element bonded to the bonding region; a second lead including an electrical connection region connected to the light-emitting element; and a molded body including a first side surface generally perpendicular to the first direction, a second side surface provided on a side opposite to the first side surface and being generally perpendicular to the first direction, a lower surface, and a recess provided in a surface opposite to the lower surface, the molded body being formed so that one end portion of the first lead protrudes from the first side surface, the other end portion of the first lead and an end portion of the second lead each protrude from the second side surface, and the bonding region and the electrical connection region are exposed from a bottom surface of the recess.

Abstract: A light-emitting device includes: a first lead including a bonding region and a first outer edge extending generally parallel to a first direction; a light-emitting element bonded to the bonding region; a second lead including an electrical connection region connected to the light-emitting element; and a molded body including a first side surface generally perpendicular to the first direction, a second side surface provided on a side opposite to the first side surface and being generally perpendicular to the first direction, a lower surface, and a recess provided in a surface opposite to the lower surface, the molded body being formed so that one end portion of the first lead protrudes from the first side surface, the other end portion of the first lead and an end portion of the second lead each protrude from the second side surface, and the bonding region and the electrical connection region are exposed from a bottom surface of the recess.

Abstract: A semiconductor light emitting element exhibiting a characteristic of deflected luminous intensity distribution, a semiconductor light emitting device capable of making, even when the element is off the center, a luminous center close to the center, and an element scribing method having a high element separation rate without causing a crack and chipping of pellet edges. The semiconductor light emitting element involves the use of a scribed pellet 10 into which a wafer including a semiconductor layer such as a luminous layer that is stacked on a compound semiconductor substrate inclined at 5.degree. through 20.degree. to a surface (100) in a orientation [011], is subjected to an element separation process by a scribing method.