Abstract: An electronic device includes an electronic component provided with a first electrode pad, a die pad including an obverse surface facing in a first direction with the electronic component mounted on the obverse surface, a first lead, a second lead, and a first connection member electrically connecting the first electrode pad and the first lead to each other. The first lead and the second lead are disposed, as viewed in the first direction, on a same side of the die pad in a second direction perpendicular to the first direction. The first lead includes a first pad portion and a first extended portion. The first connection member is bonded to the first pad portion. The first extended portion extends from the first pad portion up to a position located between the die pad and the second lead as viewed in the first direction.

Abstract: An electronic device includes an electronic component provided with a first electrode pad, a die pad including an obverse surface facing in a first direction with the electronic component mounted on the obverse surface, a first lead, a second lead, and a first connection member electrically connecting the first electrode pad and the first lead to each other. The first lead and the second lead are disposed, as viewed in the first direction, on a same side of the die pad in a second direction perpendicular to the first direction. The first lead includes a first pad portion and a first extended portion. The first connection member is bonded to the first pad portion. The first extended portion extends from the first pad portion up to a position located between the die pad and the second lead as viewed in the first direction.

Abstract: A semiconductor device includes a semiconductor element made up of a semiconductor substrate, an element electrode formed on the substrate, and a wiring layer electrically connected to the element electrode. The semiconductor device further includes a lead frame supporting the semiconductor element, a first conductive member electrically connecting the semiconductor element and the lead frame, a second conductive member overlapping with the semiconductor element as seen in plan view, and a sealing resin covering the semiconductor element, a part of the lead frame, and the first and second conductive member. The wiring layer includes a first pad portion and a second pad portion. The second conductive member has a first connecting portion bonded to the first pad portion and a second connecting portion bonded to the second pad portion.

Abstract: An electronic device includes an electronic component provided with a first electrode pad, a die pad including an obverse surface facing in a first direction with the electronic component mounted on the obverse surface, a first lead, a second lead, and a first connection member electrically connecting the first electrode pad and the first lead to each other. The first lead and the second lead are disposed, as viewed in the first direction, on a same side of the die pad in a second direction perpendicular to the first direction. The first lead includes a first pad portion and a first extended portion. The first connection member is bonded to the first pad portion. The first extended portion extends from the first pad portion up to a position located between the die pad and the second lead as viewed in the first direction.

Abstract: A semiconductor device includes a semiconductor element made up of a semiconductor substrate, an element electrode formed on the substrate, and a wiring layer electrically connected to the element electrode. The semiconductor device further includes a lead frame supporting the semiconductor element, a first conductive member electrically connecting the semiconductor element and the lead frame, a second conductive member overlapping with the semiconductor element as seen in plan view, and a sealing resin covering the semiconductor element, a part of the lead frame, and the first and second conductive member. The wiring layer includes a first pad portion and a second pad portion. The second conductive member has a first connecting portion bonded to the first pad portion and a second connecting portion bonded to the second pad portion.

Abstract: A DC/DC converter has: a soft-start circuit, a variable output current generator, a constant current source, an oscillator, a slope circuit, a PWM comparator, and a control circuit operable to turn ON and OFF first and second transistors alternately based on a pulse width modulation signal. Through the switching operation of the first and second transistors, an input voltage is converted into a output voltage.

Abstract: A DC/DC converter has: a soft-start circuit generating a soft-start input voltage increasing gradually; an error amplifier generating an error signal by comparing an output voltage or a feedback voltage with a reference voltage or the soft-start input voltage, whichever is lower; a variable current generator generating a variable current proportional to the soft-start input voltage or a soft-start output voltage; a constant current source generating a bias current; an oscillator generating a rectangular-wave signal whose frequency varies linearly with a soft-start current which is the sum of the variable current and the bias current; a slope circuit generating a slope signal based on the rectangular-wave signal; a PWM comparator generating a PWM signal based on the error signal and the slope signal; and a control circuit switching transistors alternately based on the PWM signal. Through switching operation of the transistors, an input voltage is converted into the output voltage.

Abstract: Provided is a switching power source device in which fluctuation of the switching frequency can be suppressed without impairing the advantages of a non-linear control system. A switching power source device is provided with: switching control units of non-linear control type that generate an output voltage (out) from an input voltage (IN) by performing ON/OFF control of switching elements in accordance with the results of comparing a feedback voltage (FB) and reference voltage (REF); and an ON time setting unit that monitors switching voltage (SW) appearing at one end of the switch terminals, and sets the ON time (Ton) of the switching element in the switching control units based on the duty of the switching voltage (SW).

Abstract: Provided is a switching power source device in which fluctuation of the switching frequency can be suppressed without impairing the advantages of a non-linear control system. A switching power source device is provided with: switching control units of non-linear control type that generate an output voltage (out) from an input voltage (IN) by performing ON/OFF control of switching elements in accordance with the results of comparing a feedback voltage (FB) and reference voltage (REF); and an ON time setting unit that monitors switching voltage (SW) appearing at one end of the switch terminals, and sets the ON time (Ton) of the switching element in the switching control units based on the duty of the switching voltage (SW).

Abstract: A timing recovering apparatus comprises an equalizer for equalizing a digital data signal subjected to interleaved NRZI such that the digital data signal has partial response (1, 0, -1), two comparators for comparing the equalized data signal with two different reference levels, two phase comparing portions for detecting phase difference between the outputs of the comparators and a reproduced clock signal separately, an adder for summing the outputs of the phase comparators, and a VCO for generating the reproduce clock signal in accordance with the output of the adder. This timing recovering apparatus performs phase comparing with two different phase comparators and PLL control is performed on the sum of the outputs of the two different phase comparators, so that the clock signal is not affected by data pattern of the data signal.

Abstract: A delay circuit is provided with an npn type of transistor of which a base is connected to an input terminal, a first constant current source through which a constant current flows from an emitter of the transistor to ground, a first capacitor arranged between the emitter of the transistor and an electric source terminal, a second capacitor C.sub.22 arranged between a collector of the transistor and an output terminal, a first resistor arranged between the emitter of the transistor and the output terminal, a second resistor arranged between the collector of the transistor and the electric source terminal. The constant current of the constant current source is changeable, and an emitter resistance of the transistor is changed depending on the constant current. Therefore, an analog signal applied to the input terminal is changeably delayed by coaction of the resistors, the capacitors and the emitter resistance adjusted by changing the constant current of the constant current source.