Abstract: There are provided a novel photosensitive resin composition, a cured film of which has ample flexibility, and which yields an insulating protective coating having superior soldering heat resistance, thermal degradation resistance and electroless gold plating resistance. The photosensitive resin composition as claimed in the present invention comprises: a photopolymerizable component containing a urethane acrylate compound (A) and a compound (B) having an ethylenic unsaturated group other than said urethane acrylate compound (A), a thermosetting resin (C), a photopolymerization initiator (D) and a thermal polymerization catalyst (E); wherein, said urethane acrylate compound (A) is the reaction product of an isocyanate compound (a-1) of the following general formula (1): CH2?CH—COO—R—NCO??(1) (wherein, R represents a hydrocarbon group having 1 to 30 carbon atoms) with a polyhydroxy compound (a-2).

Abstract: There is provided a flame retardant composition for a solder resist which is halogen-free and has a high level of flame retardance and flexibility, while exhibiting excellent heat resistance, moisture resistance and high-temperature reliability. The flame retardant composition for a solder resist according to the invention comprises (A) an alkali-soluble resin comprising either or both (A1) a carboxyl group-containing epoxy (meth)acrylate or (A2) a carboxyl group-containing urethane (meth)acrylate obtained by reacting an epoxy resin with two or more epoxy groups in the molecule (a), an unsaturated group-containing monocarboxylic acid (b) and a polybasic acid anhydride (c), (B) a compound having an ethylenic unsaturated group in the molecule, (C) a photopolymerization initiator, (D) a phosphorus-containing epoxy resin having a specific structure and (E) a hydrated metal compound. The composition of the invention can be suitably used as a solder resist or cover lay film for an FPC.

Abstract: Disclosed is a carboxyl group-containing polyurethane (A) produced from a polyol (b) containing at least 10 mol % (relative to the total (100 mol %) of the polyol (b)) of a polyol (b1) which: (i) has a number-average molecular weight of 500 to 50,000; (ii) has 1 to 10 hydroxyl groups per molecule; and (iii) is one or a combination of two or more polyols selected from the group consisting of polybutadiene polyol, polyisoprene polyol, hydrogenated polybutadiene polyol and hydrogenated polyisoprene polyol. The carboxyl group-containing polyurethane (A) is suitable as materials of cured products, for example cured films, that are excellent in adhesion with substrates, low warpage, flexibility, plating resistance, soldering heat resistance and long-term reliability.

Abstract: There are provided a novel photosensitive resin composition, a cured film of which has ample flexibility, and which yields an insulating protective coating having superior soldering heat resistance, thermal degradation resistance and electroless gold plating resistance. The photosensitive resin composition as claimed in the present invention comprises: a photopolymerizeable component containing a urethane acrylate compound (A) and a compound (B) having an ethylenic unsaturated group other than said urethane acrylate compound (A), a thermosetting resin (C), a photopolymerization initiator (D) and a thermal polymerization catalyst (E); wherein, said urethane acrylate compound (A) is the reaction product of an isocyanate compound (a-1) of the following general formula (1): CH2?CH—COO—R—NCO??(1) (wherein, R represents a hydrocarbon group having 1 to 30 carbon atoms) with a polyhydroxy compound (a-2).

Abstract: A phosphorus-containing urethane (meth)acrylate compound obtained by reacting (A) a polyol compound comprising (A1) a phosphorus-containing polyol having a phosphorus atom, with (B) a bifunctional or greater polyisocyanate and (C) a hydroxyl group-containing (meth)acrylate.

Abstract: A phosphorus-containing urethane (meth)acrylate compound obtained by reacting (A) a polyol compound comprising (A1) a phosphorus-containing polyol having a phosphorus atom, with (B) a bifunctional or greater polyisocyanate and (C) a hydroxyl group-containing (meth)acrylate.

Abstract: A photosensitive coloring composition for color filters using coloring compositons containd (A) a binder resin having an amido group and a carboxyl group and (B) a coloring material has excellent photosensitivity and has improved dispersibility upon producing in particular a coloring composition containing a black pigment such as a carbon black. Use of (A) an epoxy(meth)acrylate resin can further improve the photosensitivity and from a black matrix having sufficient film strenght and low reflectivity. Furhter, use of a modified carbon black treated with a compound having a isocyanate group and an ethylenically unsaturaged bond in a molecule as the coloring material can give rise to a photosensitive resin composition excellent in optically opaque property, photosensitivity and dispersion stability.