Abstract: An imaging device includes: an imaging sensor 110; a main circuit substrate 120 includes a first ground conductor; an imaging sensor cable 130 that includes a second ground conductor, has the imaging sensor 110 mounted thereon, and is connected to the main circuit substrate 120; a metal plate 150 that is disposed between the main circuit substrate 120 and an area of the imaging sensor cable 130 where the imaging sensor 110 is mounted thereon, and that is electrically connected to the second ground conductor; and a ground connection conductor 190 that electrically connects between the first ground conductor and the metal plate 150. The ground connection conductor 190 is disposed in an area where the imaging sensor 110 and the imaging sensor cable 130 overlap each other or in an area where the imaging sensor 110 and the main circuit substrate 120 overlap each other.

Abstract: An imaging device includes: an imaging sensor 110 configured to capture an optical image of an object and generate image data; a main circuit substrate 120 configured to perform signal processing of the image data generated by the imaging sensor 110; a mounting component 130 configured to mount the imaging sensor 110; a metal plate 150 disposed between the mounting component 130 and the main circuit substrate 120; and an electrically-conductive section 190 configured to electrically connect between a ground conductor of the main circuit substrate 120 and the metal plate 150. The electrically-conductive section 190 is positioned in an area where the metal plate 150 and the imaging sensor 110 overlap each other in the case of a back surface of the metal plate 150 being viewed in a direction orthogonal thereto.

Abstract: An imaging device 100 includes: an imaging element 110; a main circuit substrate 120; a mounting component 130 mounting the imaging element 110; a metal plate 150 disposed between the mounting component 130 and the main circuit substrate 120; a mount 140 supporting the metal plate 150 by connection sections 160 being fixed at at least three fixing points; elastic components 165 urging the connection sections 160 at each fixing point of the mount 140; and an electrically-conductive component 190 electrically connecting between a ground conductor of the main circuit substrate 120 and the metal plate 150. The electrically-conductive component 190 is disposed such that a connection point with the metal plate 150 is positioned in a area formed by the at least three fixing points being sequentially connected in the case of a back surface of the metal plate 150 being viewed in a direction orthogonal thereto.

Abstract: The present invention provides a ballast for a high pressure discharge lamp including a driving circuit for supplying an alternating power to a high pressure discharge lamp. In the ballast of the present invention, the high pressure discharge lamp includes: a bulb; and a startup light source disposed in a vicinity of the bulb and assisting ignition of the bulb. The startup light source has a pair of electrodes which are capacitively coupled. The driving circuit includes: a bridge unit for inverting a lamp current; a current regulator unit for regulating the lamp current; and an igniter unit for generating an ignition voltage. At the ignition, a voltage containing a frequency component higher than a driving frequency during a steady driving of the bulb is applied to the startup light source.

Abstract: A high pressure discharge lamp ballast includes an AC power supply means for supplying a square wave alternating current to a high pressure discharge lamp having a bulb in which first and second electrodes are disposed so as to face each other. In the high pressure discharge lamp ballast, one modulation period (T0) of the square wave alternating current supplied by the AC power supply means comprises a first asymmetrical current period (T1) for melting a protrusion formed at the tip of the first electrode and growing a protrusion formed at the tip of the second electrode, a symmetrical current period (Ts) for conducting current having a positive-negative symmetrical square wave, and a second asymmetrical current period (T2) for growing the first protrusion and melting the second protrusion.

Abstract: A metallic carrier composed of an end face portion formed in at least one of the axial end portions of a honeycomb body and an outer circumferential reinforcing layer in which foils in a range from the outermost layer to a quarter of the total number of layers are joined together in the axial intermediate portion. Thus, the metallic carrier is flexible in expansion and shrinkage. Further, the honeycomb body and a jacket are joined to each other mainly at the outer circumference of the outer circumferential reinforcing layer of the honeycomb body, to reduce thermal stress developed between the honeycomb body and jacket while maintaining the strength against a high temperature, to thereby prevent the metallic carrier from being ruptured.

Abstract: When soldering a honeycomb body formed by alternately piling flat foils (plates) and corrugated foils (plates), a binder liquid is sucked up from the end face of the honeycomb body to form a binder streak in a space defined by contacting portions of the flat foil (plate) and corrugated foil (plate), a solder is scattered and applied onto the binder streak, and the honeycomb body is then dried and heated to effect a soldering of the honeycomb body. According to this method, soldering can be accomplished only in the vicinity of the contacting portions of the flat foil (plate) and corrugated foil (plate), with a desired soldering structure.

Abstract: A heat-resistant stainless steel foil for a catalyst-carrier of combustion exhaust gas purifiers, consisting essentially in weight percentage of:more than 0.06 up to 0.15 of Ln, the Ln being a mixture of La, Ce, Pr and Nd;from 8x(%Ln+0.015) /45 to 0.1 of P;from 4.5 to 6.5 of Al;from 13 to 25 of Cr;not more than 0.025 of C;not more than 0.02 of N;not more than 0.03 of C+N; andthe balance consisting of Fe and unavoidable impurities.

Abstract: When soldering a honeycomb body formed by alternately piling flat foils (plates) and corrugated foils (plates), a binder liquid is sucked up from the end face of tile honeycomb body to form a binder streak in a space defined by contacting portions of the flat foil (plate) and corrugated foil (plate), a solder is scattered and applied onto the binder streak, and the honeycomb body is then dried and heated to effect a soldering of the honeycomb body. According to this method, soldering can be accomplished only in the vicinity of the contacting portions of the flat foil (plate) and corrugated foil (plate), with a desired soldering structure.