Abstract: The aberration takes place according to the height of the image because the laser light tilts from the optical axis when it enters to the object lens in the optical pickup device which is equipped with a laser diode for BD and the monolithic laser diode capable of irradiating laser lights with two different wavelengths for DVD and CD as one package to read the signal by single object lens and single optical system. This is because the light sources of the three lights with different wavelengths are away from each other in the optical pickup device. The emission point of the laser diode for BD is formed at the location shifted from the center of the chip. The laser diode for BD is disposed adjacent to the monolithic laser diode capable of irradiating laser lights with two wavelengths for DVD and CD to make the emission point closer to the monolithic laser diode. The sizes of these two laser diodes is minimized by employing half dicing during the cleavage processing for separating the chips.

Abstract: The aberration takes place according to the height of the image because the laser light tilts from the optical axis when it enters to the object lens in the optical pickup device which is equipped with a laser diode for BD and the monolithic laser diode capable of irradiating laser lights with two different wavelengths for DVD and CD as one package to read the signal by single object lens and single optical system. This is because the light sources of the three lights with different wavelengths are away from each other in the optical pickup device. The emission point of the laser diode for BD is formed at the location shifted from the center of the chip. The laser diode for BD is disposed adjacent to the monolithic laser diode capable of irradiating laser lights with two wavelengths for DVD and CD to make the emission point closer to the monolithic laser diode. The sizes of these two laser diodes is minimized by employing half dicing during the cleavage processing for separating the chips.

Abstract: Provided are an optical pick-up device which can appropriately correct an optical path of a laser beam emitted from a light-emitting chip arranged with a mounting error, and a method of manufacturing the same. An optical pick-up device includes: a first light-emitting chip and a second light-emitting chip which emit laser beams having predetermined wavelengths; a PDIC which receives the laser beams emitted from the first and the second light-emitting chips; and a first optical correction component and a second optical correction component provided between the PDIC and the light-emitting chips. The first and the second optical correction components incline a first laser beam by diffraction, while transmitting a second laser beam and a third laser beam without inclining these beams. With the diffraction of the first laser beam by these two correction components, the optical path of the first laser beam is corrected to a predetermined position.

Abstract: A semiconductor laser device and a beam receiving device are mounted on a lead. The beam receiving device receives a sub beam irradiated from the semiconductor laser device. At an edge of the lead, concave portions are provided for positioning with an optical part which receives a laser beam irradiated from a main irradiating surface provided at the front of the semiconductor laser device. The beam optical axis of the semiconductor laser device is situated at a position higher than the position of a beam receiving surface of the beam receiving device is situated. A transparent resin covering from the rear surface of the semiconductor laser device to the beam receiving surface of the beam receiving device and containing a dispersing agent, or a molding resin made of an ultraviolet hardened resin and containing the dispersing agent is provided.