Patents by Inventor Yoshio Shimamura

Yoshio Shimamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polyhydric phenol compounds, epoxy resins, epoxy resin compositions and cured products thereof
    Patent number: 6420464
    Abstract: Resin compositions having a low viscosity, a low hygroscopicity, high adhesive properties and a high heat resistance as well as being light in weight and excellent in mechanical properties are provided. The resin compositions include polyhydric phenol compounds represented by the formula (1) and epoxy resins represented by the formula (3).
    Type: Grant
    Filed: April 24, 2000
    Date of Patent: July 16, 2002
    Assignee: Nippon Kayaku Kabushiki Kaisha
    Inventors: Kenichi Kuboki, Yoshitaka Kajiwara, Eiko Watanabe, Yoshio Shimamura, Katsuhiko Oshimi
  • Epoxy resin, epoxy resin composition and hardened product thereof
    Patent number: 6124420
    Abstract: This invention provides a novolak type epoxy resin which has low melt viscosity but shows high heat resistance when hardened. Particularly, it relates to a novolak type epoxy resin in which the relationship between the total % by weight of 3 to 6 nucleus bodies and the melt viscosity measured by a cone plate method at 150.degree. C. satisfies specified conditions, an epoxy resin composition containing the same and hardened products thereof.
    Type: Grant
    Filed: December 5, 1997
    Date of Patent: September 26, 2000
    Assignees: Nippon Kayaku Kabushiki Kaisha, Gun Ei Chemical Industry Co., Ltd.
    Inventors: Kenichi Kuboki, Yoshio Shimamura, Ryoichi Hasegawa, Yoshiaki Kurimoto, Akiyuki Kojima, Yukio Abe
  • Modified epoxy resin, epoxy resin composition and cured product thereof
    Patent number: 6043333
    Abstract: Modified epoxy resin having an elevated softening point obtained from an epoxy resin having a low softening point without modifying the properties of the cured product and to improve the workability in the production of an epoxy resin composition. The modified epoxy resin is obtained by adding 4,4'-dihydroxybiphenyl to a specified phenol compound and epoxidizing the resultant mixture. Also disclosed is an epoxy resin composition containing the modified epoxy resin and the cured product thereof.
    Type: Grant
    Filed: August 15, 1997
    Date of Patent: March 28, 2000
    Assignee: Nippon Kayaku Kabushiki Kaisha
    Inventors: Kenichi Kuboki, Yoshitaka Kajiwara, Yoshio Shimamura, Yasumasa Akatsuka
  • Epoxy resin, epoxy resin composition and hardened product thereof
    Patent number: 5840824
    Abstract: An object is to provide hardened products having excellent water resistance and mechanical strength, and an epoxy resin and an epoxy resin composition for use in the production thereof. An epoxy resin obtained by the glycidylation of a novolak type resin which is prepared by the condensation of biphenyls with phenols and naphthols, and a resin composition containing said epoxy resin and hardened products thereof.
    Type: Grant
    Filed: December 26, 1996
    Date of Patent: November 24, 1998
    Assignee: Nippon Kayaku Kabushiki Kaisha
    Inventors: Yasumasa Akatsuka, Kenichi Kuboki, Yoshio Shimamura, Ryoichi Hasegawa