Patents by Inventor Yoshio Terada

Yoshio Terada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100175716
    Abstract: Provided is a cleaning member, which is capable of removing minute foreign matter, preferably foreign matter of a submicron level simply, exactly, and sufficiently, without contaminating a cleaning site. Further provided is a delivery member with a cleaning function having the cleaning member and a method of cleaning a substrate processing apparatus using the delivery member with a cleaning function. The cleaning member of the present invention includes a cleaning layer having a plurality of protrusions of a columnar structure on the surface, in which an aspect ratio of the protrusions of a columnar structure is 5 or more.
    Type: Application
    Filed: June 28, 2007
    Publication date: July 15, 2010
    Applicant: NITTO DENKO CORPORATION
    Inventors: Yuki Sugo, Yoshio Terada, Daisuke Uenda, Makoto Namikawa, Yoshinori Yoshida, Youhei Maeno
  • Publication number: 20100170533
    Abstract: Provided is a cleaning member capable of removing minute foreign matter, in particular foreign matter of a submicron level simply, exactly, and sufficiently without contaminating a cleaning site. Further provided is a carrying member provided with a cleaning function having the cleaning member and a method of cleaning a substrate processing equipment with the use of the cleaning member or the carrying member provided with a cleaning function. The cleaning member includes a layer member having a plurality of protrusions of a columnar structure on a surface, in which each of the protrusions of a columnar structure has a carbon-based nanostructure.
    Type: Application
    Filed: June 26, 2007
    Publication date: July 8, 2010
    Applicant: NITTO DENKO CORPORATION
    Inventors: Yoshio Terada, Yuki Sugo, Yoshinori Yoshida, Youhei Maeno
  • Patent number: 7718255
    Abstract: The invention provides cleaning sheets for use in cleaning, e.g., various substrate-processing apparatus, systems for conveying exposure masks (reticles) in microfabrication, etc., and a method of cleaning these with the cleaning sheets. A cleaning sheet which comprises a sheet material comprising a thermoset resin layer having porosity and, formed on one side of the sheet material, a pressure-sensitive adhesive layer comprising a thermoplastic resin.
    Type: Grant
    Filed: August 19, 2003
    Date of Patent: May 18, 2010
    Assignee: Nitto Denko Corporation
    Inventors: Makoto Namikawa, Yoshio Terada
  • Patent number: 7713356
    Abstract: A cleaning sheet for cleaning foreign matters away from the interior of the substrate processing equipment is provided. The cleaning sheet includes a cleaning layer having substantially no tackiness and having a tensile modulus of not lower than 0.98 N/mm2 as determined according to JIS K7127. Alternatively, the cleaning sheet includes a cleaning layer having a Vickers hardness of not lower than 10.
    Type: Grant
    Filed: May 8, 2001
    Date of Patent: May 11, 2010
    Assignee: Nitto Denko Corporation
    Inventors: Makoto Namikawa, Yoshio Terada, Jirou Nukaga, Eiji Toyoda
  • Publication number: 20100092714
    Abstract: Provided is a pressure-sensitive adhesive tape which has a sufficient pressure-sensitive adhesive strength for an adherend, is excellent in heat resistance, and can be easily peeled without leaving a pressure-sensitive adhesive residue on the adherend particularly upon peeling. The pressure-sensitive adhesive tape includes, on a substrate, a pressure-sensitive adhesive layer containing a lipophilic layered clay mineral, in which the layered clay mineral is in a state of being peeled and dispersed, and the interlayer distance of the layered clay mineral is 50 ? or more.
    Type: Application
    Filed: February 18, 2008
    Publication date: April 15, 2010
    Applicant: NITTO DENKO CORPORATION
    Inventors: Yuki Sugo, Yoshio Terada, Takashi Oda, Hiroyuki Kondou
  • Publication number: 20100047968
    Abstract: The present invention relates to an adhesive sheet for producing a semiconductor device, which is used when a semiconductor element is caused to adhere onto an adherend and the semiconductor element is wire-bonded, in which a lipophilic lamellar clay mineral is contained.
    Type: Application
    Filed: December 13, 2007
    Publication date: February 25, 2010
    Inventors: Yasuhiro Amano, Yoshio Terada, Naohide Takamoto
  • Patent number: 7648191
    Abstract: An automobile strength member, having a cross-sectional shape giving a high bending repulsion at the beginning of impact and able to reduce the production cost and lighten the weight and achieve a greater improvement in safety and a reduction of cost of an automobile, that is, an automobile strength member comprised of a rectangular steel tube with a square cross-section, simultaneously satisfying the following relations (1) to (3), and having a strength of at least 690 MPa in terms of tensile strength: R1?1.5t??(1) tR?1.1t??(2) R1?R2??(3) where, t: thickness of side (mm) tR: thickness of corner (mm) R1: outside corner R (mm) R2: inside corner R (mm) where both a maximum value and minimum value of hardness at a cross-section of the rectangular steel tube are in the range of within ±30% of the average value of the entire cross-section.
    Type: Grant
    Filed: September 30, 2004
    Date of Patent: January 19, 2010
    Assignee: Nippon Steel Corporation
    Inventors: Shinya Sakamoto, Yoshio Terada, Motofumi Koyuba, Fumihiko Niiyama, Eizaburo Nakanishi, Masamoto Ono
  • Patent number: 7615288
    Abstract: A cleaning sheet which comprises a cleaning layer having a tensile stress at 10% strain of from 0.3 to 3,000 N/mm2 or a carrying member with a cleaning function wherein at least one side of the carrying member has a cleaning layer having a tensile stress at 10% strain of from 0.3 to 3,000 N/mm2, particularly, a cleaning sheet or a carrying member with a cleaning function of the aforementioned constructions, wherein the aforementioned cleaning layer comprises a resin layer having been hardened by an active energy source or a polymer resin having heat resistance.
    Type: Grant
    Filed: June 24, 2004
    Date of Patent: November 10, 2009
    Assignee: Nitto Denko Corporation
    Inventors: Yoshio Terada, Eiji Toyoda, Makoto Namikawa
  • Publication number: 20090263153
    Abstract: There are provided a transfer member provided with a cleaning function, which have excellent foreign matter removing performance and transfer performance, and which can remove foreign matters having a predetermined particle diameter with especially high efficiency. The transfer member provided with a cleaning function includes a transfer member and the cleaning layer provided on at least one surface of the transfer member. The cleaning layer has a microasperity shape having an arithmetic average roughness Ra of 0.05 ?m or less and a maximum height Rz of 1.0 ?m or less. Preferably, a substantial surface area of the cleaning layer per a flat surface of 1 mm2 is 150% or more of a substantial surface area of a silicon wafer mirror surface per a flat area of 1 mm2.
    Type: Application
    Filed: October 12, 2006
    Publication date: October 22, 2009
    Applicant: NITTO DENKO CORPORATION
    Inventors: Daisuke Uenda, Yukio Arimitsu, Yoshio Terada, Yasuhiro Amano, Akihisa Murata
  • Publication number: 20090253891
    Abstract: The present invention provides a cleaning substrate of a substrate processing equipment, which comprises a cleaning layer comprising a heat resistant resin with a storage modulus (1 Hz) at 20° C. up to 150° C. being 5×107 Pa to 1×109 Pa on at least one face of the substrate; and a polyimide resin suitable as the heat resistant resin for the cleaning layer and usable under circumstances possibly involving the generation of serious disadvantages due to silicone contamination, such as for HDD application and some semiconductor applications.
    Type: Application
    Filed: June 15, 2009
    Publication date: October 8, 2009
    Applicant: NITTO DENKO CORPORATION
    Inventors: Yoshio TERADA, Hirofumi FUJII, Makoto NAMIKAWA, Daisuke UENDA, Yasuhiro AMANO
  • Patent number: 7575812
    Abstract: The present invention provides a cleaning substrate of a substrate processing equipment, which comprises a cleaning layer comprising a heat resistant resin with a storage modulus (1 Hz) at 20° C. up to 150° C. being 5×107 Pa to 1×109 Pa on at least one face of the substrate; and a polyimide resin suitable as the heat resistant resin for the cleaning layer and usable under circumstances possibly involving the generation of serious disadvantages due to silicone contamination, such as for HDD application and some semiconductor applications.
    Type: Grant
    Filed: October 19, 2005
    Date of Patent: August 18, 2009
    Assignee: Nitto Denko Corporation
    Inventors: Yoshio Terada, Hirofumi Fujii, Makoto Namikawa, Daisuke Uenda, Yasuhiro Amano
  • Patent number: 7575790
    Abstract: A cleaning sheet comprising: a cleaning layer; and a protective film treated with a releasing agent comprising a silicone, the protective film being provided as a separator on at least one side of the cleaning layer, wherein an amount of silicone attached to the cleaning layer when the separator is peeled off from the cleaning layer is 0.005 g/m2 or less as calculated in terms of polydimethylsiloxane.
    Type: Grant
    Filed: October 31, 2002
    Date of Patent: August 18, 2009
    Assignee: Nitto Denko Corporation
    Inventors: Yoshio Terada, Makoto Namikawa
  • Publication number: 20090130432
    Abstract: The present invention provides a low-modulus low-stress resin which has such heat resistance that cohesive force and reliability can be retained even at high temperatures and which is applicable as various functional materials. The resin is a thermoplastic resin having a modulus of elasticity at room temperature, 25° C., of 1 GPa or lower and a modulus of elasticity at 250° C. of 1 MPa or higher, or a precursor resin thereof.
    Type: Application
    Filed: January 8, 2009
    Publication date: May 21, 2009
    Inventors: Hirofumi FUJII, Yoshio Terada, Kazumasa Igarashi
  • Publication number: 20090092514
    Abstract: The present invention provides steel plate for high strength line pipe suppressing the rise in yield strength in the longitudinal direction of expanded steel pipe due to the heating at the time of coating to prevent corrosion and superior in strain aging resistance and steel pipe for the material for the same, that is, high strength steel pipe for line pipe superior in strain aging resistance characterized in that a base material having a composition of chemical elements containing, by mass %, Mo: over 0% to less than 0.15% and Mn: 1.7 to 2.5%, satisfying Mo/Mn: over 0 to 0.08, containing C, Si, P, S, Al, Ti, N, and B, furthermore containing one or more of Ni, Cu, and Cr, having a balance of iron and unavoidable impurities, having a P value of 2.5 to 4.0 in range, and having a metallurgical structure comprised of bainite and martensite: P value=2.7C+0.4Si+Mn+0.8Cr+0.45(Ni+Cu)+2Mo. Furthermore, it may contain one or more of Nb, V, Ca, REM, and Mg.
    Type: Application
    Filed: May 14, 2007
    Publication date: April 9, 2009
    Inventors: Hitoshi Asahi, Takuya Hara, Naoki Doi, Yoshio Terada
  • Publication number: 20090025835
    Abstract: The present invention provides high strength steel plate and high strength welded pipe excellent in ductile fracture characteristic and methods of production of the same, that is, high strength steel plate excellent in ductile fracture characteristic, and high strength welded pipe using that steel plate as a base material, having a tensile strength corresponding to the X100 class of the API standard, containing, by mass %, C: 0.01 to 0.5%, Si: 0.01 to 3%, Mn: 0.1 to 5%, P: 0.03% or less, and S: 0.03% or less and a balance of Fe and unavoidable impurities, having a microstructure comprised of, by area ratio, 1 to 60% of ferrite and the balance of bainite and martensite, having a maximum value of the {100} accumulation degree of the cross-section rotated 20 to 50° from the plate thickness cross-section about the rolling direction as an axis of 3 or less, and having plate thickness parallel cracks measured by ultrasonic flaw detection of less than 1 mm.
    Type: Application
    Filed: April 19, 2005
    Publication date: January 29, 2009
    Inventors: Takuya Hara, Yasuhiro Shinohara, Hitoshi Asahi, Yoshio Terada
  • Publication number: 20080257008
    Abstract: The present invention provides a high strength welded steel pipe superior in weld zone embrittlement crack characteristics and a method of production of the same, that is, a method of production of a welded steel pipe superior in hydrogen embrittlement cracking resistance of weld metal characterized by seam welding from the inner and outer surfaces by a tensile strength of 850 MPa or more, then expanding or reducing the size of the pipe for correction, which method of production of welded steel pipe characterized in that the hydrogen concentration of the preceding weld metal is 0.2 cc or less per 100 g at ordinary temperature.
    Type: Application
    Filed: February 22, 2006
    Publication date: October 23, 2008
    Inventors: Eiji Tsuru, Takuya Hara, Hitoshi Asahi, Hiroshi Morimoto, Yoshio Terada, Tatsuya Yoshida, Kouichi Shinada
  • Publication number: 20080173329
    Abstract: A cleaning sheet which comprises a porous layer as a cleaning layer; or a cleaning sheet which comprises a sheet material having a porous layer and, formed on one side of the sheet material, an adhesive layer.
    Type: Application
    Filed: March 10, 2008
    Publication date: July 24, 2008
    Inventors: Makoto NAMIKAWA, Yoshio Terada, Jirou Nukaga
  • Publication number: 20070293597
    Abstract: The present invention provides a low-modulus low-stress resin which has such heat resistance that cohesive force and reliability can be retained even at high temperatures and which is applicable as various functional materials. The resin is a thermoplastic resin having a modulus of elasticity at room temperature, 25° C., of 1 GPa or lower and a modulus of elasticity at 250° C. of 1 MPa or higher, or a precursor resin thereof.
    Type: Application
    Filed: October 19, 2005
    Publication date: December 20, 2007
    Applicant: NITTO DENKO CORPORATION
    Inventors: Hirofumi Fujii, Yoshio Terada, Kazumasa Igarashi
  • Publication number: 20070193666
    Abstract: A dual phase, high strength steel having a composite microstructure of soft and hard phases providing a low yield ratio, high strain capacity, superior weldability, and high toughness is provided. The dual phase steel includes from about 10% by volume to about 60% by volume of a first phase or constituent consisting essentially of fine-grained ferrite. The first phase has a ferrite mean grain size of about 5 microns or less. The dual phase steel further includes from about 40% by volume to about 90% by volume of a second phase or constituent comprising fine-grained martensite, fine-grained lower bainite, fine-grained granular bainite, fine-grained degenerate upper bainite, or any mixture thereof. Methods for making the same are also provided.
    Type: Application
    Filed: March 12, 2007
    Publication date: August 23, 2007
    Inventors: Hitoshi Asahi, Takuya Hara, Yoshio Terada, Masaaki Sugiyama, Narasimha-Rao Bangaru, Ja-Young Koo, Hyun-Woo Jin, Adnan Ozekcin, Douglas Fairchild
  • Publication number: 20070104939
    Abstract: A cleaning sheet which comprises a porous layer as a cleaning layer; or a cleaning sheet which comprises a sheet material having a porous layer and, formed on one side of the sheet material, an adhesive layer.
    Type: Application
    Filed: December 22, 2006
    Publication date: May 10, 2007
    Inventors: Makoto Namikawa, Yoshio Terada, Jirou Nukaga