Patents by Inventor Yoshiro Nakagawa

Yoshiro Nakagawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6554976
    Abstract: A method of electroplating an object to be plated attached to a lower portion of a plating bath constituted by draining used plating solution and supplying new plating solution at every plating procedure. The method has a step of supplying additional current so that the object to be plated always has cathode potential, while the object to be plated is being dipped in the plating bath and electroplating is not carried out.
    Type: Grant
    Filed: June 6, 2000
    Date of Patent: April 29, 2003
    Assignee: TDK Corporation
    Inventors: Satoshi Inoue, Toyoaki Tanaka, Yoshiro Nakagawa
  • Patent number: 6416636
    Abstract: The present invention is directed to an MR element and a thin film magnetic head that do not cause an increase in the electrical resistance value due to the presence of dead zones. When forming passive areas that include magnetic domain control films and conductive films at the two sides of a central active area through a vacuum film formation method, the magnetic domain control films are formed under film forming conditions that are different from the film forming conditions under which the conductive films are formed to ensure that the degree to which the conductive films overlap the central active area is set larger than the degree to which the magnetic domain control films overlap the central active area.
    Type: Grant
    Filed: January 13, 2000
    Date of Patent: July 9, 2002
    Assignee: TDK Corporation
    Inventors: Kiyosumi Kanazawa, Yoshiro Nakagawa
  • Patent number: 6399148
    Abstract: A lapping control sensor for a MR head includes a multi-layered structure of a metallic layer, an insulation layer, a resister layer and a lead conductor layer, and being provided in parallel with the MR head which has a multi-layered structure of at least a lower shield layer, a shield gap insulation layer, a MR layer and a lead conductor layer is provided. The insulation layer of the lapping control sensor has a thickness larger than that of the shield gap insulation layer of the MR head. The thickness of the insulation layer of the sensor is 0.1 &mgr;m or more.
    Type: Grant
    Filed: February 4, 2000
    Date of Patent: June 4, 2002
    Assignee: TDK Corporation
    Inventors: Osamu Fukuroi, Yoshiro Nakagawa
  • Publication number: 20020001671
    Abstract: A lapping control sensor for a MR head includes a multi-layered structure of a metallic layer, an insulation layer, a resister layer and a lead conductor layer, and being provided in parallel with the MR head which has a multi-layered structure of at least a lower shield layer, a shield gap insulation layer, a MR layer and a lead conductor layer is provided. The insulation layer of the lapping control sensor has a thickness larger than that of the shield gap insulation layer of the MR head. The thickness of the insulation layer of the sensor is 0.1 &mgr;m or more.
    Type: Application
    Filed: February 4, 2000
    Publication date: January 3, 2002
    Inventors: Osamu Fukuroi, Yoshiro Nakagawa
  • Publication number: 20010053043
    Abstract: The present invention is directed to an MR element and a thin film magnetic head that do not cause an increase in the electrical resistance value due to the presence of dead zones. When forming passive areas that include magnetic domain control films and conductive films at the two sides of a central active area through a vacuum film formation method, the magnetic domain control films are formed under film forming conditions that are different from the film forming conditions under which the conductive films are formed to ensure that the degree to which the conductive films overlap the central active area is set larger than the degree to which the magnetic domain control films overlap the central active area.
    Type: Application
    Filed: January 13, 2000
    Publication date: December 20, 2001
    Inventors: Kiyosumi Kanazawa, Yoshiro Nakagawa
  • Patent number: 6090260
    Abstract: A method of electroplating an object to be plated attached to a lower portion of a plating bath constituted by draining used plating solution and supplying new plating solution at every plating procedure. The method has a step of supplying additional current so that the object to be plated always has cathode potential, while the object to be plated is being dipped in the plating bath and electroplating is not carried out.
    Type: Grant
    Filed: March 26, 1998
    Date of Patent: July 18, 2000
    Assignee: TDK Corporation
    Inventors: Satoshi Inoue, Toyoaki Tanaka, Yoshiro Nakagawa
  • Patent number: 6083081
    Abstract: A lapping control sensor for a MR head includes a multi-layered structure of a metallic layer, an insulation layer, a resister layer and a lead conductor layer, and being provided in parallel with the MR head which has a multi-layered structure of at least a lower shield layer, a shield gap insulation layer, a MR layer and a lead conductor layer is provided. The insulation layer of the lapping control sensor has a thickness larger than that of the shield gap insulation layer of the MR head. The thickness of the insulation layer of the sensor is 0.1 .mu.m or more.
    Type: Grant
    Filed: August 6, 1998
    Date of Patent: July 4, 2000
    Assignee: TDK Corporation
    Inventors: Osamu Fukuroi, Yoshiro Nakagawa
  • Patent number: 6040962
    Abstract: The present invention is directed to an MR element and a thin film magnetic head that do not cause an increase in the electrical resistance value due to the presence of dead zones. When forming passive areas that include magnetic domain control films and conductive films at the two sides of a central active area through a vacuum film formation method, the magnetic domain control films are formed under film forming conditions that are different from the film forming conditions under which the conductive films are formed to ensure that the degree to which the conductive films overlap the central active area is set larger than the degree to which the magnetic domain control films overlap the central active area.
    Type: Grant
    Filed: May 14, 1998
    Date of Patent: March 21, 2000
    Assignee: TDK Corporation
    Inventors: Kiyosumi Kanazawa, Yoshiro Nakagawa
  • Patent number: 3987529
    Abstract: A valve comprising a valve body and a valve member, said valve body and valve member having cladded seats of hard metal metallurgically connected thereto, and a method for manufacturing said valve comprising a step of metallurgically connecting said seats to the valve body and the valve member through an explosive cladding process.
    Type: Grant
    Filed: November 29, 1973
    Date of Patent: October 26, 1976
    Assignee: Asahi Kasei Kogyo Kabushiki Kaisha
    Inventors: Yoshiro Nakagawa, Kohei Nonaka, Chiyoshi Fukumoto