Patents by Inventor Yoshiro Oishi

Yoshiro Oishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11873859
    Abstract: A clamper mechanism for a motion guide device includes a clamper block having tapered faces, clamper rolling elements arranged between the tapered faces and both left and right side faces of a track member, and a clamper rolling element holder attached to the clamper block with an interposition of an elastic member. When an elastic force exerted by the elastic member acts in a direction in which the clamper block and the clamper rolling element holder are separated from each other, the clamper rolling elements bite the tapered faces to bring the clamper block into a state restrained to the track member. When an external force against the elastic force exerted by the elastic member acts, the clamper rolling elements are brought into a free state within the tapered faces to bring the clamper block into a state not restrained to the track member to exert a stable clamping force.
    Type: Grant
    Filed: April 28, 2020
    Date of Patent: January 16, 2024
    Assignee: THK CO., LTD.
    Inventors: Yoshinori Murakami, Reiji Abe, Tadashi Matsuhira, Yoshiro Oishi, Hiroaki Mochizuki, Hajime Fukushima, Hiroomi Kuribayashi, Akito Kaneko
  • Publication number: 20220299065
    Abstract: A clamper mechanism for a motion guide device includes a clamper block having tapered faces, clamper rolling elements arranged between the tapered faces and both left and right side faces of a track member, and a clamper rolling element holder attached to the clamper block with an interposition of an elastic member. When an elastic force exerted by the elastic member acts in a direction in which the clamper block and the clamper rolling element holder are separated from each other, the clamper rolling elements bite the tapered faces to bring the clamper block into a state restrained to the track member. When an external force against the elastic force exerted by the elastic member acts, the clamper rolling elements are brought into a free state within the tapered faces to bring the clamper block into a state not restrained to the track member to exert a stable clamping force.
    Type: Application
    Filed: April 28, 2020
    Publication date: September 22, 2022
    Applicant: THK CO., LTD.
    Inventors: Yoshinori Murakami, Reiji Abe, Tadashi Matsuhira, Yoshiro Oishi, Hiroaki Mochizuki, Hajime Fukushima, Hiroomi Kuribayashi, Akito Kaneko
  • Patent number: 5559046
    Abstract: A semiconductor device operating at a high frequency, includes: a semiconductor layer; a first electrode for being applied with a voltage to control a current flowing in the semiconductor layer; a second electrode and a third electrode electrically connected to the semiconductor layer, at least one of the second and third electrodes being elongated above the first electrode to form a hollow around the first electrode by surrounding the first electrode with the second and third electrodes and the semiconductor layer; a passivation film formed over the second and third electrodes; and wherein the first electrode is directly in contact with an atmosphere in the hollow.
    Type: Grant
    Filed: June 26, 1995
    Date of Patent: September 24, 1996
    Assignee: Matsushita Electronics Corporation
    Inventors: Yoshiro Oishi, Daisuke Ueda
  • Patent number: 5536971
    Abstract: A semiconductor device operating at a high frequency, includes: a semiconductor layer; a first electrode for being applied with a voltage to control a current flowing in the semiconductor layer; a second electrode and a third electrode electrically connected to the semiconductor layer, at least one of the second and third electrodes being elongated above the first electrode to form a hollow around the first electrode by surrounding the first electrode with the second and third electrodes and the semiconductor layer; a passivation film formed over the second and third electrodes; and wherein the first electrode is directly in contact with an atmosphere in the hollow.
    Type: Grant
    Filed: October 27, 1993
    Date of Patent: July 16, 1996
    Assignee: Matsushita Electronics Corporation
    Inventors: Yoshiro Oishi, Daisuke Ueda