Patents by Inventor Yoshitaka Akeda

Yoshitaka Akeda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Adhesive sheets
    Patent number: 5187007
    Abstract: An adhesive sheet according to the present invention comprises a substrate having coated on the surface thereof an adhesive layer consisting of an adhesive and a radiation polymerizable compound, which compound is a urethane acrylate oligomer having a molecular weight of 3,000-10,000, preferably 4,000-8,000. The adhesive sheet is preferably used in subjecting semiconductor wafers to dicing operation and no adhesive sticks to and remains on the back side surface of the wafer chips as picked up.
    Type: Grant
    Filed: June 29, 1990
    Date of Patent: February 16, 1993
    Assignee: Lintec Corporation
    Inventors: Kazuyoshi Ebe, Hiroaki Narita, Katsuhisa Taguchi, Yoshitaka Akeda, Takanori Saito
  • Adhesive sheets
    Patent number: 4965127
    Abstract: An adhesive sheet according to the present invention comprises a substrate having coated on the surface thereof an adhesive layer consisting of an adhesive and a radiation polymerizable compound, which compound is a urethane acrylate oligomer having a molecular weight of 3,000-10,000, preferably 4,000-8,000. The adhesive sheet is preferably used in subjecting semiconductor wafers to dicing operation and no adhesive sticks to and remains on the back side surface of the wafer chips as picked up.
    Type: Grant
    Filed: October 22, 1987
    Date of Patent: October 23, 1990
    Assignee: FSK Kabushiki Kaisha
    Inventors: Kazuyoshi Ebe, Hiroaki Narita, Katsuhisa Taguchi, Yoshitaka Akeda, Takanori Saito
  • Adhesive sheets
    Patent number: 4756968
    Abstract: An adhesive sheet according to the present invention comprises a substrate having coated on the surface thereof an adhesive layer consisting of an adhesive and a radiation polymerizable compound, said compound being a urethane acrylate oligomer having a molecular weight of 3,000-10,000, preferably 4,000-8,000. The adhesive sheet is preferably used in subjecting semiconductor wafers to dicing operation and no adhesive sticks to and remains on the back side surface of the wafer chip as picked up.
    Type: Grant
    Filed: November 18, 1986
    Date of Patent: July 12, 1988
    Assignee: FSK Kabushiki Kaisha
    Inventors: Kazuyoshi Ebe, Hiroaki Narita, Katsuhisa Taguchi, Yoshitaka Akeda, Takanori Saito