Abstract: An inrush current prevention circuit, according to one possible configuration, includes: a power supply input terminal; a high-resistance element to restrict an inrush current flowing in when a power supply voltage is applied to the power supply input terminal; a low-resistance bypass element connected in parallel with the high-resistance element and configured to operate so as to cause current to bypass the high-resistance element when an output voltage being output from the inrush current prevention circuit to a load exceeds a bypass threshold; and bypass threshold setting circuit that divides the power supply voltage in accordance with the output voltage, and sets the bypass threshold in accordance with a voltage value of a voltage dividing point of the bypass threshold setting circuit.

Abstract: A capacitor charging-discharging system, including a plurality of serially connected capacitors, a voltage source for setting an equalization potential, and a plurality of parallel monitoring circuit. Each parallel monitoring circuit is connected to the two ends electrodes of one capacitor, and includes: a voltage dividing circuit configured to resistively divide and attenuate two voltages respectively on the two end electrodes of the one capacitor, a differential amplifier configured to amplify a difference between the two divided voltages to thereby detecting a charge potential of the one capacitor, a comparator configured to compare the charge potential with the equalization potential, and a charge current bypass circuit configured to control charge current of the one capacitor, based on an output of the comparator, so that the charge potential of the one capacitor matches the equalization potential.

Abstract: A conductive circuit is formed by printing a pattern of an ink composition and curing the pattern. The ink composition is a substantially solvent-free, liquid, addition curable, ink composition comprising (A) an organopolysiloxane having at least two alkenyl groups, (B) an organohydrogenpolysiloxane having at least two SiH groups, (C) conductive particles having an average particle size ?5 ?m, (D) conductive micro-particles having an average particle size <5 ?m, (E) a thixotropic agent, and (F) a hydrosilylation catalyst.

Abstract: A computer system of the present invention includes a controller; a plurality of switches configured to carry out relay processing of a reception, packet based on a flow entry set by said controller; and a plurality of storage systems. The controller changes the flow entry of each of the plurality of switches based on resource data acquired from the plurality of storage systems, to change the storage system of the plurality of storage systems as an access destination of a client terminal. Thus, The whole network system can be managed and used without being conscious of each of the plurality of storage systems and the situation of the whole network.

Abstract: A conductive circuit is formed using a substantially solvent-free, liquid, addition curable, conductive circuit-forming ink composition comprising (A) an organopolysiloxane having at least two silicon-bonded alkenyl groups, (B) an organohydrogenpolysiloxane having at least two SiH groups, (C) conductive particles, (D) a thixotropic agent, and (E) a hydrosilylation catalyst. The ink composition is printed on a metal electrode to form a green circuit pattern layer, which is fired and cured for thereby forming a conductive circuit and bonding the conductive circuit to the metal electrode.

Abstract: A conductive circuit is formed by printing a pattern of an ink composition and curing the pattern. The ink composition is a substantially solvent-free, liquid, addition curable, ink composition comprising (A) an organopolysiloxane having at least two alkenyl groups, (B) an organohydrogenpolysiloxane having at least two SiH groups, (C) conductive particles having an average particle size ?5 ?m, (D) conductive micro-particles having an average particle size <5 ?m, (E) a thixotropic agent, and (F) a hydrosilylation catalyst.

Abstract: A conductive circuit is formed by printing a conductive ink composition to form a pattern and heat curing the pattern, the ink composition comprising an addition type silicone rubber precursor, a curing catalyst, conductive particles having a density of up to 2.75 g/cm3, and a thixotropic agent, typically carbon black and being solvent-free. The ink composition has such thixotropy that the circuit may be formed by screen printing at a high speed and in high throughputs and yields.

Abstract: A silicone resin composition is provided comprising a silicon base polymer obtained from dehydration reaction of a silicon base monomer comprising at least 70 mol % of a hydrolyzable silane compound (A). The hydrolyzable silane compound (A) has at least a pair of silicon atoms linked by a linking group which is an aliphatic hydrocarbon group or an aromatic ring-containing hydrocarbon group, and having attached thereto at least three substituent groups selected from hydrogen, hydroxyl and hydrolyzable groups. A proportion of aromatic structure-containing substituent groups is up to 30 mol % of the entire silicon-bonded substituent groups. The composition is suited to form an optical material.

Abstract: An organic silane compound for forming a Si-containing film by plasma CVD is provided. The silane compound contains 2 or more silicon atoms bonded by an intervening straight chain or branched oxygen-containing hydrocarbon chain having 4 to 8 carbon atoms containing a bond represented by Cp—O—Cq wherein p and q independently represent number of carbon atoms with the proviso that 2?p?6 and 2?q?6 and the carbon chains do not contain an unsaturated bond which conjugates with the oxygen atom, wherein all of the 2 or more silicon atoms has 1 or more hydrogen atom or an alkoxy group having 1 to 4 carbon atoms.

Abstract: Provided is service for transmitting and receiving a file between a calling device and a call receiving device without depending on a capacity of a proxy server. An SIP telephone set (calling device 11) which makes a call through a proxy server 13 to establish a session for a voice path with a call receiving device 12 conformed to SIP, comprising a request issuing unit 111 which requests the call receiving device 12 to establish a session for a data path by the pressing of a specific extension at the time of establishment of a session for a voice path, a session establishing unit 112 which obtains an access authentication result by the pressing of the specific extension to establish a session for a data path with the call receiving device 12, and a file obtaining unit 113 which obtains a file managed by the call receiving device 12 from the call receiving device 12 independently of the proxy server 13 after a session for a data path is established.

Abstract: Provided is a preparation process of trisilylamine capable of preparing high-purity trisilylamine more easily at a lower cost. More specifically, provided is a preparation process of trisilylamine, comprising a step of thermally decomposing perhydropolysilazane under an oxygen-free or low oxygen atmosphere.

Abstract: A packaging bag for microwave oven heating, is manufactured by using a complex film at least one side of which comprises a sealant layer, folding the complex film or placing the complex films one upon another so as to encounter the sealant layers to each other, sealing the peripheral of the overlapped complex films by a main seal part to form a sealed bag, and providing in the bag a region which is isolated from a space for storing contents by a steam port seal part. The steam port seal part surrounds a steam easy permeable element. The lamination strength between the layers of the complex film in hot condition is not less than 1.5 N/15 mm in width, and the seal strength at least at the steam port seal part in hot condition is not more than 28 N/15 mm in width.

Abstract: A conductive circuit is formed by printing a pattern using a conductive ink composition and heat curing the pattern. A thixotropic agent, typically carbon black is added to the solvent-free ink composition comprising an addition type silicone resin precursor, a curing catalyst, and conductive particles. The ink composition has such thixotropy that the printed pattern may retain its shape after curing.

Abstract: A high-temperature bonding composition comprising a silicon base polymer as a thermosetting binder is provided. The silicon base polymer is obtained from dehydrolytic condensation of a condensate precursor comprising a silane compound having at least one pair of silicon atoms tied by a crosslink composed of an aliphatic hydrocarbon, heterocyclic or aromatic hydrocarbon group, and having at least three hydroxyl and/or hydrolyzable groups. Those silicon atoms having a direct bond to the crosslink composed of the aliphatic hydrocarbon, heterocyclic or aromatic hydrocarbon group are present in a proportion of at least 90 mol % relative to all silicon atoms in the polymer.

Abstract: A pair of substrates each having a bonding surface are joined together by interposing a bond layer precursor coating between the bonding surfaces of the substrates and heating the precursor coating to form a bond layer. Prior to the joining step, the substrate on the bonding surface is provided with a gas-permeable layer. Even when a material which will evolve a noticeable volume of gas upon heat curing is used as the precursor coating, substrates can be joined via a robust bond without the peeling problem by gas evolution.

Abstract: A conductive pattern-forming composition is obtained by loading a silicone rubber composition comprising a curable organopolysiloxane and a curing agent with conductive submicron particles.

Abstract: A silicone resin composition is provided comprising a silicon base polymer obtained from dehydration reaction of a silicon base monomer comprising at least 70 mol % of a hydrolyzable silane compound (A). The hydrolyzable silane compound (A) has at least a pair of silicon atoms linked by a linking group which is an aliphatic hydrocarbon group or an aromatic ring-containing hydrocarbon group, and having attached thereto at least three substituent groups selected from hydrogen, hydroxyl and hydrolyzable groups. A proportion of aromatic structure-containing substituent groups is up to 30 mol % of the entire silicon-bonded substituent groups. The composition is suited to form an optical material.

Abstract: An object is to provide a highly pure aminosilane having a reduced amount of halogen impurity, which is suitable for applications of electronic materials and others. More specifically, provided is a method for preparing a purified aminosilane comprising at least the steps of treating, with an alkyl metal reagent, an aminosilane having a Si—N bond but not a Si-halogen bond and having halogen impurity content of 1 ppm (w/w) or more; and distilling the treated aminosilane.

Abstract: In a mixture of silsesquioxane compounds comprising silsesquioxane units having a side chain including a direct bond between a silicon atom and a norbornane skeleton and having a degree of condensation of substantially 100%, a dimethylene chain of the norbornane skeleton remote from the silicon bonded side is substituted with at least one substituent group other than hydrogen, and an isomer having a bulkier substituent group on the dimethylene chain at an exo position is present in a higher proportion.

Abstract: Provided is a preparation process of trisilylamine capable of preparing high-purity trisilylamine more easily at a lower cost. More specifically, provided is a preparation process of trisilylamine, comprising a step of thermally decomposing perhydropolysilazane under an oxygen-free or low oxygen atmosphere.