Patents by Inventor Yoshitaka Ishibashi
Yoshitaka Ishibashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240149530Abstract: An additive manufacturing apparatus and a method of manufacturing three-dimensional object are provided. According to the disclosure, the additive manufacturing apparatus includes a chamber, an inert gas supply apparatus, a fume collector, a pressure detection apparatus, and a control apparatus. The chamber covers a building region where a desired three-dimensional object is formed. The inert gas supply apparatus supplies an inert gas to the chamber. The fume collector includes a blower and removes fumes from the inert gas that is exhausted together with the fumes from the chamber. The blower circulates the inert gas between the chamber and the fume collector by operating at a predetermined rotation speed. The pressure detection apparatus detects a pressure in the chamber. The control apparatus controls the fume collector to switch a rotation speed of the blower based on the pressure.Type: ApplicationFiled: October 22, 2023Publication date: May 9, 2024Applicant: Sodick Co., Ltd.Inventors: Katsutaka MURANAKA, Yoshitaka KATO, Kenji ISHIBASHI
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Publication number: 20240109359Abstract: The purpose of the present disclosure is to improve the sensitivity of 4,4?-dihydroxydiphenylsulfone, which is a developer, in a heat-sensitive recording material. The present disclosure provides a heat-sensitive recording material that uses at least one selected from 1,2-bis(phenoxy)ethane, 1,2-bis(3-methylphenoxy)ethane, benzyloxynaphthalene, and oxalic acid di-p-methylbenzyl ester as a sensitizer for 4,4?-dihydroxydiphenylsulfone, and further includes benzoin as a sensitization aid.Type: ApplicationFiled: June 11, 2020Publication date: April 4, 2024Inventors: Yoshimi ISHIBASHI, Takamichi OISHI, Yoshitaka FUJINO, Ryoichi KINISHI
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Patent number: 11244700Abstract: A magnetic recording medium includes a substrate, an underlayer provided on the substrate, and a magnetic layer provided on the underlayer and having a L10 structure and a (001) orientation. The magnetic layer has a granular structure in which an organic compound having a methylene skeleton or a methine skeleton is arranged at grain boundaries of magnetic grains.Type: GrantFiled: October 24, 2018Date of Patent: February 8, 2022Assignee: SHOWA DENKO K.K.Inventors: Katsumi Murofushi, Yoshitaka Ishibashi, Takayuki Fukushima, Kazuya Niwa, Lei Zhang, Yuji Murakami, Hisato Shibata, Takehiro Yamaguchi, Chen Xu, Tetsuya Kanbe, Tomoo Shige
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Publication number: 20210284783Abstract: Provided are a curable resin mixture and a curable resin composition which contain a polyalkenylphenol resin and an aromatic polymaleimide compound having high crystallinity and a high melting point, and which exhibit excellent fluidity and reactivity. Also provided is a method for producing a curable resin mixture that contains: (A) a polyalkenylphenol resin which contains a polyalkenylphenol compound having at least 2 phenol skeletons in the molecule, a prescribed 2-alkenyl group being bonded to some or all of aromatic rings that form the phenol skeletons in the molecule; and (B) an aromatic polymaleimide compound. The method comprises: heating the aromatic polymaleimide compound (B) to the melting point or above and thereby melting the compound; and mixing the molten aromatic polymaleimide compound (B) and the polyalkenylphenol resin (A) within a temperature range at which the aromatic polymaleimide compound (B) does not recrystallize.Type: ApplicationFiled: May 25, 2017Publication date: September 16, 2021Applicant: SHOWA DENKO K.K.Inventors: Aoi HASEGAWA, Chika YAMASHITA, Yoshitaka ISHIBASHI, Tomonori TAJIMA, Hiromi OTAKE
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Patent number: 10975227Abstract: A curing accelerator can exhibit good curing acceleration performance and is excellent in storage stability, while maintaining sufficient pot life in a curing reaction of radical-polymerizable resins, and a radical-polymerizable resin composition uses the curing accelerator. The curing accelerator for radical-polymerizable resins includes a metal-containing compound (A), a thiol compound (B) and an aprotic solvent (C) having a dielectric constant of 10 or less, wherein the metal-containing compound (A) is one or more compounds selected from a metal soap (A1) and a ?-diketone skeleton-having metal complex (A2), the thiol compound (B) is one or more compounds selected from a mono-functional primary thiol compound (B1), a secondary thiol compound (B2) and a tertiary thiol compound (B3), and the content of the aprotic solvent (C) is 10 to 1,000 parts by mass relative to 100 parts by mass of the total of the metal-containing compound (A) and the thiol compound (B).Type: GrantFiled: September 4, 2017Date of Patent: April 13, 2021Assignee: SHOWA DENKO K.K.Inventors: Yoichiro Sakaguchi, Takuya Minami, Yoshishige Okuno, Atsushi Umino, Yoshitaka Ishibashi
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Patent number: 10851199Abstract: An epoxy (meth)acrylate compound represented by general formula (1): where at least one of R1 to R5 has a structure represented by formula (2): * denotes the bonding position to a carbon atom that constitutes the benzene ring to which R1 to R5 are bonded in formula (1), R7 denotes a hydrogen atom or a methyl group, the remainder of R1 to R5 are each independently selected from the group consisting of hydrogen atoms, alkyl groups and alkoxy groups having 1-6 carbon atoms, and R6 denotes a hydrogen atom or a methyl group. In the epoxy (meth)acrylate compound, the content of halogen atoms is 100 ppm by mass or less. A curable composition for forming a protective film for an electrically conductive pattern obtained by mixing the epoxy (meth)acrylate compound with a photopolymerization initiator and at least one type of monomer or oligomer that contains a (meth)acryloyl group.Type: GrantFiled: July 24, 2017Date of Patent: December 1, 2020Assignee: SHOWA DENKO K. K.Inventors: Masahiko Toba, Jun Dou, Chika Yamashita, Yoshitaka Ishibashi, Hiroshi Uchida
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Patent number: 10689493Abstract: A thermosetting resin composition includes a polyalkenyl phenol resin (A) and an aromatic polymaleimide compound (B). Polyalkenyl phenol resin (A) has at least one aromatic ring unit (a1) which may have a 2-alkenyl group bonded thereto and in which a phenolic hydroxyl group is alkyl-etherified, and at least one aromatic ring unit (a2) which has a phenolic hydroxyl group and which may have a 2-alkenyl group bonded thereto. At least one of aromatic ring units (a1, a2) has a 2-alkenyl group. Each aromatic ring unit is bonded by a linking group. When m represents the number of aromatic ring units (a1), and n represents the number of aromatic ring units (a2), n to (m+n) is 10-60%. The polyalkenyl phenol resin (A) is included in an amount at which the amount of 2-alkenyl groups becomes 0.4-1.5 mol per mol of maleimide groups in the aromatic polymaleimide compound (B).Type: GrantFiled: December 11, 2015Date of Patent: June 23, 2020Assignee: SHOWA DENKO K.K.Inventors: Hiromi Otake, Aoi Nakano, Chika Yamashita, Yoshitaka Ishibashi, Hiroshi Uchida
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Publication number: 20200181365Abstract: A curing accelerator can exhibit good curing acceleration performance and is excellent in storage stability, while maintaining sufficient pot life in a curing reaction of radical-polymerizable resins, and a radical-polymerizable resin composition uses the curing accelerator. The curing accelerator for radical-polymerizable resins includes a metal-containing compound (A), a thiol compound (B) and an aprotic solvent (C) having a dielectric constant of 10 or less, wherein the metal-containing compound (A) is one or more compounds selected from a metal soap (A1) and a ?-diketone skeleton-having metal complex (A2), the thiol compound (B) is one or more compounds selected from a mono-functional primary thiol compound (B1), a secondary thiol compound (B2) and a tertiary thiol compound (B3), and the content of the aprotic solvent (C) is 10 to 1,000 parts by mass relative to 100 parts by mass of the total of the metal-containing compound (A) and the thiol compound (B).Type: ApplicationFiled: September 4, 2017Publication date: June 11, 2020Applicant: SHOWA DENKO K.K.Inventors: Yoichiro SAKAGUCHI, Takuya MINAMI, Yoshishige OKUNO, Atsushi UMINO, Yoshitaka ISHIBASHI
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Publication number: 20200031966Abstract: A curable resin composition provides a cured resin product having excellent heat resistance and flame retardancy by curing. The curable resin composition includes a polyalkenyl phenol compound (A) and a polymaleimide compound (B), wherein the polyalkenyl phenol compound (A) is a compound containing at least two structural units represented by the following formula (1a): where R1 to R7 each independently represent a hydrogen atom, a C1-10 alkyl group, a C1-2 alkoxy group, a C2-6 alkenyl group, or a hydroxy group, Y1 is an alkenyl group.Type: ApplicationFiled: April 4, 2018Publication date: January 30, 2020Applicant: SHOWA DENKO K.K.Inventors: Aoi HASEGAWA, Yoshitaka ISHIBASHI
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Publication number: 20190225566Abstract: Provided is a method with which it is possible to produce a polyalkenylphenol compound having a narrow molecular weight distribution and low viscosity at high purity and high yield. A poly 2-alkenyl aromatic ether compound having two or more phenol skeletons is subjected to Claisen rearrangement in the presence of a phenol or naphthol compound.Type: ApplicationFiled: August 9, 2017Publication date: July 25, 2019Applicant: SHOWA DENKO K.K.Inventors: Aoi HASEGAWA, Yoshitaka ISHIBASHI
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Publication number: 20190180782Abstract: A magnetic recording medium includes a substrate, an underlayer provided on the substrate, and a magnetic layer provided on the underlayer and having a L10 structure and a (001) orientation. The magnetic layer has a granular structure in which an organic compound having a methylene skeleton or a methine skeleton is arranged at grain boundaries of magnetic grains.Type: ApplicationFiled: October 24, 2018Publication date: June 13, 2019Inventors: Katsumi MUROFUSHI, Yoshitaka ISHIBASHI, Takayuki FUKUSHIMA, Kazuya NIWA, Lei ZHANG, Yuji MURAKAMI, Hisato SHIBATA, Takehiro YAMAGUCHI, Chen XU, Tetsuya KANBE, Tomoo SHIGE
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Publication number: 20190153149Abstract: [Problem] To provide an epoxy (meth)acrylate compound that serves as a material for a protective film that is unlikely to cause migration to an electrically conductive pattern, and a curable composition containing the epoxy (meth)acrylate compound. [Solution] Provided is an epoxy (meth)acrylate compound which is characterized by being represented by general formula (1) and in which the content of halogen atoms, which are impurities, is 100 ppm by mass or less. In addition, provided is a curable composition for forming a protective film for an electrically conductive pattern, the curable composition being obtained by mixing this epoxy (meth)acrylate compound with a photopolymerization initiator and at least one type of monomer or oligomer that contains a (meth)acryloyl group.Type: ApplicationFiled: July 24, 2017Publication date: May 23, 2019Applicant: SHOWA DENKO K. K.Inventors: Masahiko TOBA, Jun DOU, Chika YAMASHITA, Yoshitaka ISHIBASHI, Hiroshi UCHIDA
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Patent number: 10160856Abstract: Provided is a thermosetting resin composition which exhibits excellent workability, and which is capable of obtaining, as a result of being cured, a highly reliable cured product (molded article) exhibiting excellent heat resistance and mechanical strength. This thermosetting resin composition includes: a polyalkenyl phenol resin (A); an aromatic polymaleimide compound (B); and a polymerization initiator (C). The polyalkenyl phenol resin (A) has, in a molecule thereof, at least one aromatic ring unit (a1) which has a phenolic hydroxyl group having a 2-alkenyl group bonded thereto, and at least one aromatic ring unit (a2) having a phenolic hydroxyl group which does not have a 2-alkenyl group bonded thereto. Each of the aromatic ring units is bonded by a linking group having a main chain which is not formed by an aromatic ring. When m represents the number of the aromatic ring units (a1), and n represents the number of the aromatic ring units (a2), the ratio of m to (m+n) is 40-90%.Type: GrantFiled: December 11, 2015Date of Patent: December 25, 2018Assignee: SHOWA DENKO K.K.Inventors: Hiromi Otake, Aoi Nakano, Chika Yamashita, Yoshitaka Ishibashi, Hiroshi Uchida
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Patent number: 10160737Abstract: A polyvalent glycidyl compound is produced from a compound having one or more 2-alkenyl ether groups and two or more 2-alkenyl groups using a hydrogen peroxide aqueous solution as an oxidizing agent to oxidize the 2-alkenyl ether groups and the 2-alkenyl groups. A 2-alkenyl ether compound having two or more (un)substituted 2-alkenyl groups and one or more (un)substituted 2-alkenyl ether groups is oxidized using a hydrogen peroxide aqueous solution as an oxidizing agent in the presence of a tungsten compound and a quaternary ammonium salt as catalysts and of phosphoric acid as a co-catalyst, while controlling the pH of the reaction solution to 1.0-4.0 using an acid other than phosphoric acid. During the oxidation, the step of adding the hydrogen peroxide aqueous solution to the reaction solution and the step of adding the acid other than phosphoric acid thereto are alternately repeated at intervals two or more times.Type: GrantFiled: October 28, 2015Date of Patent: December 25, 2018Assignee: SHOWA DENKO K.K.Inventors: Chika Yamashita, Yoshitaka Ishibashi
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Publication number: 20180282494Abstract: Provided is a thermosetting resin composition which is capable of obtaining, as a result of being cured, a highly reliable cured product exhibiting excellent moisture resistance, heat resistance, and mechanical strength. The present invention includes a polyalkenyl phenol resin (A) and an aromatic polymaleimide compound (B). The polyalkenyl phenol resin (A) has, in a molecule thereof, at least one aromatic ring unit (a1) which has or does not have a 2-alkenyl group bonded thereto, and in which a phenolic hydroxyl group is alkyl-etherified, and at least one aromatic ring unit (a2) which has a phenolic hydroxyl group, and which has or does not have a 2-alkenyl group bonded thereto. At least one of the aromatic ring units (a1, a2) has a 2-alkenyl group. Each of the aromatic ring units is bonded by a linking group. When m represents the number of the aromatic ring units (a1), and n represents the number of the aromatic ring units (a2), the ratio of n to (m+n) is 10-60%.Type: ApplicationFiled: December 11, 2015Publication date: October 4, 2018Applicant: SHOWA DENKO K.K.Inventors: Hiromi OTAKE, Aoi NAKANO, Chika YAMASHITA, Yoshitaka ISHIBASHI, Hiroshi UCHIDA
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Publication number: 20170349743Abstract: Provided is a thermosetting resin composition which exhibits excellent workability, and which is capable of obtaining, as a result of being cured, a highly reliable cured product (molded article) exhibiting excellent heat resistance and mechanical strength. This thermosetting resin composition includes: a polyalkenyl phenol resin (A); an aromatic polymaleimide compound (B); and a polymerization initiator (C). The polyalkenyl phenol resin (A) has, in a molecule thereof, at least one aromatic ring unit (al) which has a phenolic hydroxyl group having a 2-alkenyl group bonded thereto, and at least one aromatic ring unit (a2) having a phenolic hydroxyl group which does not have a 2-alkenyl group bonded thereto. Each of the aromatic ring units is bonded by a linking group having a main chain which is not formed by an aromatic ring. When m represents the number of the aromatic ring units (a1), and n represents the number of the aromatic ring units (a2), the ratio of m to (m+n) is 40-90%.Type: ApplicationFiled: December 11, 2015Publication date: December 7, 2017Applicant: SHOWA DENKO K.K.Inventors: Hiromi OTAKE, Aoi NAKANO, Chika YAMASHITA, Yoshitaka ISHIBASHI, Hiroshi UCHIDA
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Publication number: 20170342042Abstract: A polyvalent glycidyl compound is produced from a compound having one or more 2-alkenyl ether groups and two or more 2-alkenyl groups using a hydrogen peroxide aqueous solution as an oxidizing agent to oxidize the 2-alkenyl ether groups and the 2-alkenyl groups. A 2-alkenyl ether compound having two or more (un)substituted 2-alkenyl groups and one or more (un)substituted 2-alkenyl ether groups is oxidized using a hydrogen peroxide aqueous solution as an oxidizing agent in the presence of a tungsten compound and a quaternary ammonium salt as catalysts and of phosphoric acid as a co-catalyst, while controlling the pH of the reaction solution to 1.0-4.0 using an acid other than phosphoric acid. During the oxidation, the step of adding the hydrogen peroxide aqueous solution to the reaction solution and the step of adding the acid other than phosphoric acid thereto are alternately repeated at intervals two or more times.Type: ApplicationFiled: October 28, 2015Publication date: November 30, 2017Applicant: SHOWA DENKO K.K.Inventors: Chika YAMASHITA, Yoshitaka ISHIBASHI
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Patent number: 9701874Abstract: [Problem] To provide: a conductive adhesive which contains an epoxy (meth)acrylate resin and which can form a bonded zone that is not susceptible to being deteriorated by halogen; an anisotropic conductive film; and electronic devices using both. [Solution] A conductive adhesive and an anisotropic conductive film which each contain a conductive filler and a binder resin, wherein: the binder resin comprises an epoxy (meth)acrylate resin that is a product of addition reaction of (meth)acrylic acid and an epoxy compound having a sum of total chlorine atom concentration and total bromine atom concentration of 300 mass ppm or less, preferably 50 mass ppm or less; and the conductive filler is dispersed in the binder resin which comprises such an epoxy (meth)acrylate resin.Type: GrantFiled: March 27, 2014Date of Patent: July 11, 2017Assignee: SHOWA DENKO K.K.Inventors: Hiroshi Uchida, Yoshitaka Ishibashi
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Patent number: 9440907Abstract: Provided is a method for producing a 2-alkenylamine compound efficiently and at low cost, using a primary or secondary amine compound and a 2-alkenyl compound as the starting materials therefor. The 2-alkenylamine compound is produced by adding Bronsted acid when 2-alkenylating by reacting the primary or secondary amine compound with the 2-alkenyl compound, and 2-alkenylating in the presence of a catalyst comprising a complexing agent and a transition metal precursor stabilized by a monovalent anionic five-membered conjugated diene.Type: GrantFiled: August 29, 2012Date of Patent: September 13, 2016Assignees: SHOWA DENKO K.K., NATIONAL UINVERSITY CORPORATION NAGOYA UNIVERSITYInventors: Yoshitaka Ishibashi, Naoya Fukumoto, Masato Kitamura
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Patent number: 9346740Abstract: Provided is a method for producing a 2-alkenylamine compound efficiently and at low cost, using a primary or secondary amine compound and a 2-alkenyl compound as the starting materials therefor. The 2-alkenyleamine compound is produced by 2-alkenylating a primary or secondary amine compound, using a specified 2-alkenylating agent and in the presence of a catalyst comprising a complexing agent and a transition metal precursor stabilized by a monovalent anionic five-membered conjugated diene.Type: GrantFiled: August 29, 2012Date of Patent: May 24, 2016Assignees: SHOWA DENKO K.K., NATIONAL UNIVERSITY CORPORATION NAGOYA UNIVERSITYInventors: Yoshitaka Ishibashi, Naoya Fukumoto, Masato Kitamura