Patents by Inventor Yoshitaka Kimura

Yoshitaka Kimura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11037858
    Abstract: A semiconductor module includes: a base plate; a semiconductor chip on the base plate; a case surrounding the semiconductor chip on the base plate, and sealing resin sealing the semiconductor chip inside the case, wherein a linear expansion coefficient of the sealing resin increases continuously from the semiconductor chip toward an upper surface of the sealing resin.
    Type: Grant
    Filed: June 27, 2019
    Date of Patent: June 15, 2021
    Assignee: Mitsubishi Electric Corporation
    Inventor: Yoshitaka Kimura
  • Publication number: 20210138711
    Abstract: A twin screw extruder (10) for producing a fiber-reinforced resin composition, which is obtained by charging the extruder with a thermoplastic resin and reinforcing fibers in roving form and the reinforcing fibers being fibrillated/cut and being dispersed/kneaded into the thermoplastic resin, comprises: a plate-shaped blade (15), which protrudes from the inner surface of a cylinder (11) and faces a screw (20) and the longitudinal direction of which faces the axial direction of the cylinder; and a height adjustment means (16) for adjusting the gap between the blade (15) and the screw (20).
    Type: Application
    Filed: August 4, 2017
    Publication date: May 13, 2021
    Applicant: THE JAPAN STEEL WORKS, LTD.
    Inventors: Yoshitaka KIMURA, Makoto TOJO, Daigo SAGA
  • Publication number: 20210134686
    Abstract: A power semiconductor device includes: a power semiconductor element; a control circuit that controls the power semiconductor element; a control substrate having the control circuit mounted thereon; a lid arranged to overlap with at least a portion of the control substrate in a first direction; and at least one external connection terminal having a first portion connected with the control substrate, a second portion to be connected with an external apparatus, and a third portion located between the first portion and the second portion and fixed to the lid, the first portion being constituted as a press-fit portion.
    Type: Application
    Filed: August 14, 2020
    Publication date: May 6, 2021
    Applicant: Mitsubishi Electric Corporation
    Inventors: Hidetoshi Ishibashi, Yoshitaka Kimura, Minoru Egusa, Nobuhiro Asaji, Kazunari Teshigawara
  • Patent number: 10996730
    Abstract: An electronic device includes a power supply, a connector, a detector, and a switch. The connector is configured to be alternatively connectable in a first direction and in a second direction. The detector is configured to detect which of the first direction and the second direction the connector has been connected in. The switch is configured to switch a state of the electronic device between a first state to supply power to another device and to a second state to receive power from said another device. The switch is configured to switch the state of the electronic device to the first state or the second state according to a connection direction of the connector detected by the detector.
    Type: Grant
    Filed: March 14, 2019
    Date of Patent: May 4, 2021
    Assignee: Ricoh Company, Ltd.
    Inventor: Yoshitaka Kimura
  • Publication number: 20200398474
    Abstract: A twin-screw extruder is provided in which screws have different rotational speeds depending on the process of treating the raw material and in which degradation of the raw material is less likely to occur. Twin-screw extruder 1 has two screws 3, 5 that extend in parallel to each other. Each screw 3, 5 has cylindrical upstream screw 31 and downstream screw 35, wherein upstream screw 31 has shaft hole 315 that extends in longitudinal direction X and screw flight 316 on an outer circumferential surface thereof, and downstream screw 35 includes large diameter portion 353 having screw flight 357 on an outer circumferential surface thereof and small diameter shaft portion 351 that has a smaller diameter than large diameter portion 353, wherein small diameter shaft portion 351 of downstream screw 35 is inserted into shaft hole 315 of upstream screw 31. Upstream screw 31 and downstream screw 35 can be independently rotated.
    Type: Application
    Filed: February 13, 2019
    Publication date: December 24, 2020
    Applicants: The Japan Steel Works, Ltd., Tokyo Printing Ink Mfg. Co., Ltd.
    Inventors: Kazutoshi IZUMIYA, Katsumi SUMIDA, Yoshitaka KIMURA, Masashi TANIMOTO, Hiroyuki OKUMA, Katsuyuki KANEKO, Shizuo UESHIGE, Nobuaki TANAKA, Takahiro NAKAMARU
  • Patent number: 10773687
    Abstract: Disclosed is an electronic key system which comprises a vehicle-mounted device and a plurality of electronic keys, and is configured to have: a normal mode in which a given processing is permitted to be executed by the vehicle-mounted device when a given wireless communication processing between the vehicle-mounted device and any one of the plurality of electronic keys is successfully completed; and a deactivated mode in which the given processing is inhibited from being executed by the vehicle-mounted device. The vehicle-mounted device is configured not to execute, in the deactivated mode, the given processing even when receiving an RF signal after transmitting an LF signal, during the given wireless communication processing, and the one electronic key is configured not to transmit, in the deactivated mode, the RF signal even when receiving the LF signal, during the given wireless communication processing.
    Type: Grant
    Filed: October 11, 2017
    Date of Patent: September 15, 2020
    Assignee: Mazda Motor Corporation
    Inventors: Yasuhiro Ohi, Yoshitaka Kimura, Shotaro Hirosue
  • Publication number: 20200266154
    Abstract: A semiconductor device includes a lead frame having a die pad; a semiconductor chip having a front surface in which an integrated circuit is formed, and a back surface that is die-bonded onto the die pad through intermediation of an interposing film and an adhesive layer; and an encapsulating resin for encapsulating the lead frame, the adhesive layer, the interposing film, and the semiconductor chip. The interposing film has a first opening which forms a space between a part of the back surface of the semiconductor chip and the adhesive layer.
    Type: Application
    Filed: February 14, 2020
    Publication date: August 20, 2020
    Inventors: Satoshi SUZUKI, Yoshitaka KIMURA
  • Patent number: 10714447
    Abstract: An electrode terminal includes a body and a first bonding part. The body includes a first metal material. Then, the first bonding part is bonded to one end of the body, and includes a second metal material which is a clad material other than the first metal material. The first bonding part is ultrasonically bondable to a first bonded member. An elastic part which is elastically deformable is provided between the one end of the body and the other end of the body.
    Type: Grant
    Filed: October 6, 2016
    Date of Patent: July 14, 2020
    Assignee: Mitsubishi Electric Corporation
    Inventors: Rei Yoneyama, Yoshitaka Kimura, Akihiko Yamashita
  • Publication number: 20200211921
    Abstract: A semiconductor module includes: a base plate; a semiconductor chip on the base plate; a case surrounding the semiconductor chip on the base plate, and sealing resin sealing the semiconductor chip inside the case, wherein a linear expansion coefficient of the sealing resin increases continuously from the semiconductor chip toward an upper surface of the sealing resin.
    Type: Application
    Filed: June 27, 2019
    Publication date: July 2, 2020
    Applicant: Mitsubishi Electric Corporation
    Inventor: Yoshitaka KIMURA
  • Patent number: 10672706
    Abstract: A semiconductor device includes a multilayer wiring structure on a substrate. The multilayer wiring structure includes: a top wiring; a fuse element, which is located on a lower layer-side of the top wiring, and is made of metal having a melting point that is higher than that of the top wiring; and a lower-layer wiring, which is connected to each of ends of the fuse element. Provided is a semiconductor device in which fuse elements made of the high-melting point metal are arranged at high density.
    Type: Grant
    Filed: February 27, 2018
    Date of Patent: June 2, 2020
    Assignee: ABLIC INC.
    Inventor: Yoshitaka Kimura
  • Patent number: 10643922
    Abstract: A base plate includes a heat dissipation metal plate and a resin insulating layer. The resin insulating layer is formed on the heat dissipation metal plate. The resin insulating layer is provided with a notch where part of the heat dissipation metal plate is exposed. A case is bonded to an exposure part being part of the heat dissipation metal plate by means of a bonding agent.
    Type: Grant
    Filed: August 28, 2018
    Date of Patent: May 5, 2020
    Assignee: Mitsubishi Electric Corporation
    Inventors: Yoshitaka Otsubo, Yoshitaka Kimura
  • Patent number: 10631773
    Abstract: A living body state estimation apparatus acquires information indicating a state of a living body. The living body state estimation apparatus is configured to include an electrocardiogram signal acquisition unit which acquires an electrocardiogram signal of the living body and an information acquisition unit which acquires a parameter as the information, the parameter specifying a predetermined function indicating a probability distribution for a reference wave interval which is a time interval between peaks of consecutive predetermined reference waves in the acquired electrocardiogram signal.
    Type: Grant
    Filed: September 23, 2016
    Date of Patent: April 28, 2020
    Assignee: TOHOKU UNIVERSITY
    Inventors: Yoshitaka Kimura, Nobuo Yaegashi, Kunihiro Okamura, Takuya Ito, Kunihiro Koide, Miyuki Endo
  • Publication number: 20200047713
    Abstract: Disclosed is an electronic key system which comprises a vehicle-mounted device and a plurality of electronic keys, and is configured to have: a normal mode in which a given processing is permitted to be executed by the vehicle-mounted device when a given wireless communication processing between the vehicle-mounted device and any one of the plurality of electronic keys is successfully completed; and a deactivated mode in which the given processing is inhibited from being executed by the vehicle-mounted device. The vehicle-mounted device is configured not to execute, in the deactivated mode, the given processing even when receiving an RF signal after transmitting an LF signal, during the given wireless communication processing, and the one electronic key is configured not to transmit, in the deactivated mode, the RF signal even when receiving the LF signal, during the given wireless communication processing.
    Type: Application
    Filed: October 11, 2017
    Publication date: February 13, 2020
    Inventors: Yasuhiro Ohi, Yoshitaka Kimura, Shotaro Hirosue
  • Patent number: 10518748
    Abstract: An electronic key system comprises a vehicle-mounted device and a plurality of electronic keys and is configured to have: a normal mode in which given processing is permitted to be executed by the vehicle-mounted device when given wireless communication processing between the vehicle-mounted device and the electronic key is successfully completed; and a deactivated mode in which the given processing is inhibited from being executed by the vehicle-mounted device, wherein when the electronic key in the deactivated mode transmits, at a given time, a given signal containing deactivated mode information indicating that the electronic key is operating in the deactivated mode, and the electronic key in the normal mode is shifted to the deactivated mode in response to receiving of the signal containing the deactivated mode information.
    Type: Grant
    Filed: October 11, 2017
    Date of Patent: December 31, 2019
    Assignee: Mazda Motor Corporation
    Inventors: Yasuhiro Ohi, Yoshitaka Kimura, Shotaro Hirosue
  • Patent number: 10483785
    Abstract: There is provided a power information management device communicable with at least one another device and being able to perform one of mutual power supply and unidirectional power supply, comprising: a requesting unit configured to send a request for information concerning electric power to the at least one another device; a receiving unit configured to receive the power information from the at least one another device which has received the request; and a generating unit configured to generate power information concerning electric power of a plurality of devices including the power information management device and the at least one another device based on the information received from the at least one another device.
    Type: Grant
    Filed: November 21, 2016
    Date of Patent: November 19, 2019
    Assignee: RICOH IMAGING COMPANY, LTD.
    Inventor: Yoshitaka Kimura
  • Patent number: 10468372
    Abstract: According to the present invention, a semiconductor apparatus includes a semiconductor device, a case surrounding the semiconductor device, a spring terminal including a first connection portion extending to a top surface of the case, and a second connection portion provided on the top surface of the case and a control substrate provided on the second connection portion, wherein the first connection portion is connected to the semiconductor device, the second connection portion includes a first end connected to an end of the first connection portion, and a second end opposite to the first end, the second connection portion being a flat plate and having an elastic force using the first end as a supporting point, the second end contacts the control substrate with an elastic force, and the second connection portion has a constriction structure having a notch formed in a side surface along a longitudinal direction.
    Type: Grant
    Filed: December 29, 2017
    Date of Patent: November 5, 2019
    Assignee: Mitsubishi Electric Corporation
    Inventors: Keisuke Eguchi, Yoshitaka Kimura, Akihiko Yamashita
  • Publication number: 20190286204
    Abstract: An electronic device includes a power supply, a connector, a detector, and a switch. The connector is configured to be alternatively connectable in a first direction and in a second direction. The detector is configured to detect which of the first direction and the second direction the connector has been connected in. The switch is configured to switch a state of the electronic device between a first state to supply power to another device and to a second state to receive power from said another device. The switch is configured to switch the state of the electronic device to the first state or the second state according to a connection direction of the connector detected by the detector.
    Type: Application
    Filed: March 14, 2019
    Publication date: September 19, 2019
    Inventor: Yoshitaka KIMURA
  • Publication number: 20190288519
    Abstract: A power supply device includes a battery and processing circuitry. The processing circuitry is configured to estimate a tendency of consumption of the battery and put the power supply device into one of a first state in which the power supply device can supply electric power to another device and a second state in which the power supply device can receive electric power from said another device, in accordance with the tendency of consumption of the battery estimated.
    Type: Application
    Filed: March 13, 2019
    Publication date: September 19, 2019
    Inventors: Teruyuki TAKEI, Yoshitaka Kimura, Takahiro Suzuki, Naoto Asakura
  • Publication number: 20190289211
    Abstract: An electronic device includes a power supply and a power supply circuit. The power supply circuit is configured to alternately switch a state of the electronic device between a first state to supply power to another device and a second state to receive power from said another device, and stop a switching operation of the state of the electronic device when the electronic device is off, to fix the state of the electronic device to one of the first state and the second state.
    Type: Application
    Filed: March 14, 2019
    Publication date: September 19, 2019
    Inventors: Naoto ASAKURA, Yoshitaka KIMURA, Teruyuki TAKEI, Takahiro SUZUKI
  • Patent number: 10397502
    Abstract: An apparatus for imaging an object is equipped with an image sensor comprising a plurality of pixels; a charge-reading processor that reads out accumulated charges in a given pixel via a pixel circuit of the charge accumulated pixel; and a noise-reading processor that reads out noise signals from a pixel circuit for a given pixel. The noise-reading processor reads noise signals from a pixel circuit for a pixel that is an object of noise acquisition, in parallel with the reading of accumulated charges by the charge-reading processor.
    Type: Grant
    Filed: February 16, 2017
    Date of Patent: August 27, 2019
    Assignee: RICOH IMAGING COMPANY, LTD.
    Inventor: Yoshitaka Kimura