Patents by Inventor Yoshitaka Matsumura
Yoshitaka Matsumura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240133037Abstract: A method for more easily improving adhesion of an yttrium-based thin film to an aluminum substrate in a coated aluminum member having the yttrium-based thin film formed on the aluminum substrate is provided. A method for improving adhesion of an yttrium-based thin film to an aluminum substrate in a coated aluminum member having the yttrium-based thin film formed on the aluminum substrate comprises a BHF treatment step of bringing a surface of the yttrium-based thin film into contact with a buffered hydrofluoric acid solution.Type: ApplicationFiled: December 1, 2023Publication date: April 25, 2024Inventors: Yuriko YANAI, Yoshitaka OZAKI, Tomohiro MATSUMURA
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Publication number: 20230339219Abstract: The present invention relates to a laminate including a protection layer, a barrier layer, and a heat sealing layer, in which a product of a tensile elastic modulus A in a reference direction, a tensile elastic modulus B in a direction forming an angle of 45° with respect to the reference direction, and a tensile elastic modulus C in a direction forming an angle of 90° with respect to the reference direction is 0.22 (GPa)3 or less, and a value of the tensile elastic modulus B to the tensile elastic modulus A, a value of the tensile elastic modulus C to the tensile elastic modulus A, and a value of the tensile elastic modulus C to the tensile elastic modulus B are each 0.1 to 10.Type: ApplicationFiled: June 28, 2023Publication date: October 26, 2023Applicant: MITSUBISHI CHEMICAL CORPORATIONInventors: Shinji NAKANISHI, Kohei OURA, Yoshitaka MATSUMURA
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Patent number: 11738543Abstract: A multilayer structure includes a protective layer, an ethylene-vinyl alcohol copolymer layer, a heat seal resin layer, and an intermediate layer provided between the ethylene-vinyl alcohol copolymer layer and the heat seal resin layer and containing a polypropylene resin, wherein the intermediate layer further contains a hydrocarbon resin having a number average molecular weight of 100 to 3,000, and a softening point of not less than 60° C. and less than 170° C. The multilayer structure satisfies requirements for a lower water vapor permeability and a sufficient heat seal strength, and provides a standup pouch having a smaller gas barrier property change rate after retort treatment.Type: GrantFiled: September 8, 2021Date of Patent: August 29, 2023Assignee: MITSUBISHI CHEMICAL CORPORATIONInventors: Kohei Oura, Shinji Nakanishi, Mei Takatsuka, Yoshitaka Matsumura
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Patent number: 11731406Abstract: Disclosed is a laminate including a protection layer, a barrier layer, and a heat sealing layer, in which a product of a tensile elastic modulus A in a reference direction, a tensile elastic modulus B in a direction forming an angle of 45° with respect to the reference direction, and a tensile elastic modulus C in a direction forming an angle of 90° with respect to the reference direction is 0.22 (GPa)3 or less, and a value of the tensile elastic modulus B to the tensile elastic modulus A, a value of the tensile elastic modulus C to the tensile elastic modulus A, and a value of the tensile elastic modulus C to the tensile elastic modulus B are each 0.1 to 10.Type: GrantFiled: May 10, 2021Date of Patent: August 22, 2023Assignee: MITSUBISHI CHEMICAL CORPORATIONInventors: Shinji Nakanishi, Kohei Oura, Yoshitaka Matsumura
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Publication number: 20210402747Abstract: A multilayer structure includes a protective layer, an ethylene-vinyl alcohol copolymer layer, a heat seal resin layer, and an intermediate layer provided between the ethylene-vinyl alcohol copolymer layer and the heat seal resin layer and containing a polypropylene resin, wherein the intermediate layer further contains a hydrocarbon resin having a number average molecular weight of 100 to 3,000, and a softening point of not less than 60° C. and less than 170° C. The multilayer structure satisfies requirements for a lower water vapor permeability and a sufficient heat seal strength, and provides a standup pouch having a smaller gas barrier property change rate after retort treatment.Type: ApplicationFiled: September 8, 2021Publication date: December 30, 2021Applicant: Mitsubishi Chemical CorporationInventors: Kohei OURA, Shinji NAKANISHI, Mei TAKATSUKA, Yoshitaka MATSUMURA
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Publication number: 20210260856Abstract: The present invention relates to a laminate including a protection layer, a barrier layer, and a heat sealing layer, in which a product of a tensile elastic modulus A in a reference direction, a tensile elastic modulus B in a direction forming an angle of 45° with respect to the reference direction, and a tensile elastic modulus C in a direction forming an angle of 90° with respect to the reference direction is 0.22 (GPa)3 or less, and a value of the tensile elastic modulus B to the tensile elastic modulus A, a value of the tensile elastic modulus C to the tensile elastic modulus A, and a value of the tensile elastic modulus C to the tensile elastic modulus B are each 0.1 to 10.Type: ApplicationFiled: May 10, 2021Publication date: August 26, 2021Applicant: Mitsubishi Chemical CorporationInventors: Shinji NAKANISHI, Kohei OURA, Yoshitaka MATSUMURA
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Publication number: 20190291397Abstract: The present invention provides a multilayer structure including a semi-aromatic polyamide layer and an ethylene-vinyl alcohol copolymer layer, having a high gas barrier property after heat sterilization treatment and few curls, and easy to laminate, to be subjected to bag making processing and to be filled with contents. The multilayer structure according to the present invention includes the semi-aromatic polyamide layer, the ethylene-vinyl alcohol copolymer layer, and a thermoplastic resin layer between the semi-aromatic polyamide layer and the ethylene-vinyl alcohol copolymer layer.Type: ApplicationFiled: June 13, 2019Publication date: September 26, 2019Applicant: MITSUBISHI CHEMICAL CORPORATIONInventors: Ayano NAKASHIMA, Yoshitaka MATSUMURA, Michael L. OPACICH
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Patent number: 10196505Abstract: A resin composition is provided, which comprises: an ethylene-vinyl acetate copolymer (A); and a saponified ethylene-vinyl acetate copolymer (B) having an ethylene content of not less than 70 mol %, wherein the component (B) is present in a proportion of 1 to 30 parts by weight based on 100 parts by weight of the component (A). Where the resin composition is used in combination with a scrap laminate including a polyolefin resin layer and an EVOH layer for recycling the scrap laminate, die build-up is suppressed, and a product formed from the resulting recycled material is excellent in appearance and substantially free from coloration.Type: GrantFiled: September 24, 2008Date of Patent: February 5, 2019Assignee: THE NIPPON SYNTHETIC CHEMICAL INDUSTRY CO., LTD.Inventors: Kenji Ninomiya, Kaname Kida, Yoshitaka Matsumura
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Publication number: 20110240340Abstract: An electrically conductive floc is provided that does not need shearing in producing brushes with a smooth surface. The electrically conductive floc includes electrically conductive chemical fibers wherein said fibers have a diameter of 10 to 100 ?m, a fiber length of 0.1 to 5 mm, and a fiber length variation of 5% or less.Type: ApplicationFiled: December 1, 2009Publication date: October 6, 2011Applicant: Toray Industries ,Inc.Inventors: Hidetoshi Takanaga, Yoshitaka Matsumura, Hanji Ishikawa
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Publication number: 20100255330Abstract: A resin composition is provided, which comprises: an ethylene-vinyl acetate copolymer (A); and a saponified ethylene-vinyl acetate copolymer (B) having an ethylene content of not less than 70 mol %, wherein the component (B) is present in a proportion of 1 to 30 parts by weight based on 100 parts by weight of the component (A). Where the resin composition is used in combination with a scrap laminate including a polyolefin resin layer and an EVOH layer for recycling the scrap laminate, die build-up is suppressed, and a product formed from the resulting recycled material is excellent in appearance and substantially free from coloration.Type: ApplicationFiled: September 24, 2008Publication date: October 7, 2010Inventors: Kenji Ninomiya, Kaname Kida, Yoshitaka Matsumura
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Publication number: 20070165094Abstract: A thermal printing apparatus (1) includes an erasing unit (51) and a printing unit (52) that are positioned along a paper guide (53). Between the erasing unit (51) and the printing unit (52), cooling fans (46) are located. The erasing unit (51) has an erasing roller (37) for applying heat to thermal recording paper fed by a paper feeding tray (2) while transporting the paper. The paper is heated by the roller 37, and then cooled slowly in the course of being transported, so that an image is erased from the paper. The fans (46) create and direct a current of air to cool the paper transported by the roller (37). Then, the printing unit (52) prints a new image on the paper.Type: ApplicationFiled: March 29, 2005Publication date: July 19, 2007Applicant: SANAWA NEWTEC CO., LTD.Inventors: Yoshitaka Matsumura, Takahisa Tominaga
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Patent number: 6838173Abstract: A polyester fiber comprises a hygroscopic polyester composition which contains 1 to 20 percent by weight of hygroscopic silica-based inorganic particles in which the average diameter, the specific surface area, the micropore volume, and the hygroscopic parameter ?MR are within specified ranges. This hygroscopic fiber is suitable for clothes which require comfortableness.Type: GrantFiled: May 21, 2001Date of Patent: January 4, 2005Assignee: Toray Industries, Inc.Inventors: Yoshihiro Naruse, Toshihiro Sasaki, Yoshitaka Matsumura
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Publication number: 20040169713Abstract: It is provided a rewritable printing method and its printer in which a heat sensitive medium with a leuco type coating applied is used to rewrite the information repeatedly, printing can be performed in the same way as the conventional technique, and the medium easily as the transmission means of the information, thereby extremely contributing to the improvement of environmental issues relating to the use of paper.Type: ApplicationFiled: November 10, 2003Publication date: September 2, 2004Inventors: Koji Niino, Yoshitaka Matsumura, Ritsuo Ando
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Publication number: 20030088012Abstract: A polyester fiber comprises a hygroscopic polyester composition which contains 1 to 20 percent by weight of hygroscopic silica-based inorganic particles in which the average diameter, the specific surface area, the micropore volume, and the hygroscopic parameter &Dgr;MR are within specified ranges. This hygroscopic fiber is suitable for clothes which require comfortableness.Type: ApplicationFiled: January 14, 2002Publication date: May 8, 2003Inventors: Yoshihiro Naruse, Toshihiro Sasaki, Yoshitaka Matsumura
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Patent number: 5698331Abstract: The present specification discloses a hygroscopic polyester copolymer with a hydrophilic compound copolymerized, containing a cross-linking agent and controlled in moisture absorbing and releasing property, and a fiber using the polyester copolymer. The fiber can be used as a comfortable material for underwear, sports wear, interlinings, etc. as highly hygroscopic woven and knitted fabrics, etc. of high quality.Type: GrantFiled: January 25, 1996Date of Patent: December 16, 1997Assignee: Toray Industries, Inc.Inventors: Yoshitaka Matsumura, Yuko Harashina, Tetsunori Higuchi, Tai Sasamoto