Abstract: In an RFID system comprising a detection unit for detecting an RFID tag and a control unit for exercising the control concerning the RFID tag, a determination unit determines whether to access a second area of an RFID tag comprising storage area, comprising of a first area for storing ID information and the second area for storing command information. An extraction unit extracts command information from the second area when it is determined to access the second area. An execution unit performs a process corresponding to the command information extracted by the extraction unit.

Abstract: In a mechanism for attaching to a cart an RFID tag used for transmitting and receiving data to and from an RFID reader/writer, a holding pocket retains the RFID tag. The orientation of the pocket is kept constant in such a manner that a surface of the RFID tag from which data can be read highly accurately faces an antenna for the RFID reader/writer while keeping the distance between the RFID tag and the antenna within a certain range regardless of the transfer direction of the cart.

Abstract: In a mechanism for attaching to a cart an RFID tag used for transmitting and receiving data to and from an RFID reader/writer, a holding pocket retains the RFID tag. The orientation of the pocket is kept constant in such a manner that a surface of the RFID tag from which data can be read highly accurately faces an antenna for the RFID reader/writer while keeping the distance between the RFID tag and the antenna within a certain range regardless of the transfer direction of the cart.

Abstract: In an RFID system comprising a detection unit for detecting an RFID tag and a control unit for exercising the control concerning the RFID tag, a determination unit determines whether to access a second area of an RFID tag comprising storage area, comprising of a first area for storing ID information and the second area for storing command information. An extraction unit extracts command information from the second area when it is determined to access the second area. An execution unit performs a process corresponding to the command information extracted by the extraction unit.

Abstract: When a detector sensor such as an infrared sensor or the like detects a palette or cart mounting a product, the output of the radio wave from the antenna of the reader/writer is set to a minimum value. Then, the radio wave output value is gradually increased from the minimum value until an RFID tag can be read/written. After the RFID tag can be read/written, a target process such as the reading/writing of the RFID tag or the like is performed and the process is terminated. After the process is terminated, the radio wave output is returned to the minimum value.

Abstract: A tag is attached to each piece of a set of goods mounted on a palette, and a tag storing the quantity of goods that should be mounted on the palette is also attached. A reader/writer counts the number of tags attached to all of the goods, reads quantity information of the tags attached to the palette, and determines whether the two are equal or not.

Abstract: This system controls communication between a management system for managing the work process of a product using ID of an RF-ID tag and plural radio communication units each for radio communicating with an RF-ID tag provided associated with one stage of the work process. The system comprises a network state monitor unit monitoring the state of a network, a determination unit determining, based on the monitored state, which of the non-network mode or the network mode should be adopted, a control unit controlling the radio communication unit having read the ID to write, into the RF-ID tag, additional information corresponding to a stage corresponding to the radio communication unit when the non-network mode is adopted and transmitting the additional information to the management system when the network mode is adopted and an information collecting unit reading ID and the additional information from the RF-ID tag.

Abstract: A device to support studies of the positions in which parts necessary for assembly are placed and the positions in which assembly tasks are performed. A manufacturing study support device has a computation portion, a display portion which displays animations, and a storage portion which stores part animation data comprising three-dimensional shapes of parts, part storage positions which are three-dimensional coordinate data of positions at which the parts are stored, and assembly starting positions which are three-dimensional coordinate data of positions from which assembly tasks using the parts are started. The computation portion calculates part supply animation paths, taking the part storage positions as starting points and the assembly starting positions as ending points, and based on the part animation data and part supply animation paths, causes the display portion to display movement of the parts.

Abstract: A flexible printed circuit board that electrically connects a main body and a rotary body to each other is twisted in advance through an angle that is a half of an angle of rotation through which the rotary body is rotated. One end of the flexible printed circuit board is fixed to the main body, and the other end thereof is fixed to the rotary body. The rotary body is rotated in a direction causing the twist of the flexible printed circuit board to diminish.

Abstract: A flexible printed circuit board that electrically connects a main body and a rotary body to each other is twisted in advance through an angle that is a half of an angle of rotation through which the rotary body is rotated. One end of the flexible printed circuit board is fixed to the main body, and the other end thereof is fixed to the rotary body. The rotary body is rotated in a direction causing the twist of the flexible printed circuit board to diminish.

Abstract: A semiconductor device includes a semiconductor element having electrodes and metal bumps are attached to the electrodes. The metal bumps include copper cores and gold surface layers covering the cores. In addition, the metal bumps may include gold bump elements and solder bump elements connected together.

Abstract: A semiconductor device comprises a semiconductor element having electrodes and metal bumps are attached to the electrodes. The metal bumps include copper cores and gold surface layers covering the cores. In addition, the metal bumps may include gold bump elements and solder bump elements connected together.

Abstract: At one end of a printed wiring board, there is formed a narrow-pitched electrode pattern and engagement patterns made of the same material as that of the electrode pattern. At one end of an FPC which is to be connected with the printed circuit board, there is formed a narrow-pitched electrode pattern and engagement patterns made of the same material as that of the electrode pattern. The engagement patterns in the printed wiring board being engageable with the engagement patterns in the FPC. When the two engagement patterns are engaged with each other, the electrode pattern of the printed wiring board is electrically connected with the electrode pattern of the FPC.

Abstract: A method of manufacturing a template having through-holes for attracting and supporting electrically conductive balls by vacuum suction is disclosed. The through-holes are formed by etching and the side walls of the through-holes are smoothed by irradiation, with laser beams, of the side walls of the through-holes. A template and metallic bumps can be formed using this method. Alternatively, the template can be formed in a two-layered structure.

Abstract: A semiconductor device comprises a semiconductor element having electrodes and metal bumps are attached to the electrodes. The metal bumps include copper cores and gold surface layers covering the cores. In addition, the metal bumps may include gold bump elements and solder bump elements connected together.

Abstract: A semiconductor device comprises a semiconductor element having electrodes and metal bumps are attached to the electrodes. The metal bumps include copper cores and gold surface layers covering the cores. In addition, the metal bumps may include gold bump elements and solder bump elements connected together.

Abstract: A semiconductor device comprises a semiconductor element having electrodes and metal bumps are attached to the electrodes. The metal bumps include copper cores and gold surface layers covering the cores. In addition, the metal bumps may include gold bump elements and solder bump elements connected together.

Abstract: A method of forming bumps onto a chip having electrodes. The method includes the use of a template having through-holes arranged in correspondence to the electrodes of the chip. The template holds conductive balls to be formed into bumps to the template at the through-holes by vacuum suction. The through-holes of the template are formed by a laser, by supporting a glass plate on a support table having cavities and irradiating the plate with laser beams at the position of the cavities.

Abstract: A method of manufacturing a template having through-holes for attracting and supporting electrically conductive balls by vacuum suction is disclosed. The through-holes are formed by etching and the side walls of the through-holes are smoothed by irradiation, with laser beams, of the side walls of the through-holes. A template and metallic bumps can be formed using this method. Alternatively, the template can be formed in a two-layered structure.