Patents by Inventor Yoshitaka Takemoto

Yoshitaka Takemoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10594331
    Abstract: An analog-to-digital conversion device according to one or more embodiments independently executes each of events instructed by a host device. Each of two or more analog-to-digital converters include an execution control unit, an event management unit that notifies of a synchronization instruction when a synchronous conversion event set up with a synchronous conversion operation is instructed as the event, and an operation control unit.
    Type: Grant
    Filed: April 26, 2019
    Date of Patent: March 17, 2020
    Assignee: SANKEN ELECTRIC CO., LTD.
    Inventors: Hideki Hayashi, Yoshitaka Takemoto
  • Publication number: 20190253064
    Abstract: An analog-to-digital conversion device is disclosed that independently executes each of events instructed by a host device. Each of analog-to-digital converters include an execution control unit, an event management unit that notifies of a synchronization instruction when a synchronous conversion event set up with a synchronous conversion operation is instructed as the event, and an operation control unit.
    Type: Application
    Filed: April 26, 2019
    Publication date: August 15, 2019
    Applicant: SANKEN ELECTRIC CO., LTD.
    Inventors: Hideki HAYASHI, Yoshitaka TAKEMOTO
  • Patent number: 10263631
    Abstract: An analog to digital conversion device according to one or more embodiments may include sequential comparison type analog to digital converters, wherein each of the analog to digital converters converts an analog signal to a digital signal by repeating comparative voltage generation processing to generate a comparative voltage and comparison processing to compare the analog signal with the comparative voltage. Each of the analog to digital converters may include a noise notification part that generates a noise notification signal to give notification of noise production and inputs the noise notification signal to a different one of the analog to digital converters. At start of operation, based on the notification noise signal inputted from the different analog to digital converter, each of the analog to digital converters may be synchronized with the different analog to digital converter performing the comparative voltage generation processing and the comparison processing.
    Type: Grant
    Filed: February 23, 2018
    Date of Patent: April 16, 2019
    Assignee: SANKEN ELECTRIC CO., LTD.
    Inventors: Yoshitaka Takemoto, Hideki Hayashi
  • Publication number: 20180248560
    Abstract: An analog to digital conversion device according to one or more embodiments may include sequential comparison type analog to digital converters, wherein each of the analog to digital converters converts an analog signal to a digital signal by repeating comparative voltage generation processing to generate a comparative voltage and comparison processing to compare the analog signal with the comparative voltage. Each of the analog to digital converters may include a noise notification part that generates a noise notification signal to give notification of noise production and inputs the noise notification signal to a different one of the analog to digital converters. At start of operation, based on the notification noise signal inputted from the different analog to digital converter, each of the analog to digital converters may be synchronized with the different analog to digital converter performing the comparative voltage generation processing and the comparison processing.
    Type: Application
    Filed: February 23, 2018
    Publication date: August 30, 2018
    Applicant: SANKEN ELECTRIC CO., LTD.
    Inventors: Yoshitaka TAKEMOTO, Hideki HAYASHI
  • Patent number: 4942454
    Abstract: A resin-sealed semiconductor device comprises a die pad which has through holes. Thin metal films are provided on the surfaces of the die pad except for the wall surfaces of the holes. A resin, which is used for integral molding of the die pad and a semiconductor element, flows into the holes during molding. The semiconductor device so mounted does not induce cracks in the resin and, thus, has good moisture resistance.
    Type: Grant
    Filed: August 2, 1988
    Date of Patent: July 17, 1990
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Ryuichiro Mori, Katsuyuki Fukudome, Tatsuhiko Akiyama, Yoshitaka Takemoto