Abstract: A suspension board with circuit including a first mounting region for mounting a slider and a second mounting region for mounting a piezoelectric element. The wiring circuit board includes a metal support layer, a base insulating layer, and a conductive layer. The conductive layer includes a first wiring pattern, a second wiring pattern, and a shield wiring pattern. The first wiring pattern includes a read wiring. The second wiring pattern includes a power supply wiring disposed at spaced intervals to the read wiring. The shield wiring pattern includes a shield wiring disposed between the read wiring and the power supply wiring.

Abstract: A suspension board with circuit extending in a predetermined direction includes a base insulating layer, and a conductive layer disposed on one side in a thickness direction of the base insulating layer. The base insulating layer includes a first body base and a second body base disposed spaced apart from each other in a width direction, and a connection portion connecting a portion of the first body base in the longitudinal direction to a portion of the second body base in the longitudinal direction. The suspension board with circuit further includes a reinforcing portion disposed on the surface of the connection portion and reinforcing the connection portion. The reinforcing portion includes two or more resin layers laminated in the thickness direction, or a metal member.

Abstract: A method for producing a wired circuit board including an insulating layer and a conductive pattern, including (1), providing the insulating layer having an inclination face; (2), providing a metal thin film at least on the surface of the insulating layer; (3), providing a photoresist on the surface of the metal thin film; (4), disposing a photomask so that a first portion, where the conductive pattern is provided in the photoresist, is shielded from light, and the photoresist is exposed to light through the photomask; (5), removing the first portion to expose the metal thin film corresponding to the first portion; and (6), providing the conductive pattern on the surface of the metal thin film exposed from the photoresist. The inclination face has a second portion that allows the light reflected at the metal thin film to reach the first portion.

Abstract: A method for producing a wired circuit board including an insulating layer and a conductive pattern, including (1), providing the insulating layer having an inclination face; (2), providing a metal thin film at least on the surface of the insulating layer; (3), providing a photoresist on the surface of the metal thin film; (4), disposing a photomask so that a first portion, where the conductive pattern is provided in the photoresist, is shielded from light, and the photoresist is exposed to light through the photomask; (5), removing the first portion to expose the metal thin film corresponding to the first portion; and (6), providing the conductive pattern on the surface of the metal thin film exposed from the photoresist. The inclination face has a second portion that allows the light reflected at the metal thin film to reach the first portion.

Abstract: A method for producing a wired circuit board including an insulating layer and a conductive pattern, including (1), providing the insulating layer having an inclination face; (2), providing a metal thin film at least on the surface of the insulating layer; (3), providing a photoresist on the surface of the metal thin film; (4), disposing a photomask so that a first portion, where the conductive pattern is provided in the photoresist, is shielded from light, and the photoresist is exposed to light through the photomask; (5), removing the first portion to expose the metal thin film corresponding to the first portion; and (6), providing the conductive pattern on the surface of the metal thin film exposed from the photoresist. The inclination face has a second portion that allows the light reflected at the metal thin film to reach the first portion.

Abstract: In a method for producing a wired circuit board includes a step (1), in which the insulating layer having an inclination face is provided; a step (2), in which a metal thin film is provided on the surface of the insulating layer including the inclination face; a step (3), in which a photoresist is provided on the surface of the metal thin film; a step (4), in which a photomask is disposed so that a first light exposure portion and a second light exposure portion in the photoresist are exposed to light, and the photoresist is exposed to light; a step (5), in which the first light exposure portion and the second light exposure portion are removed; and a step (6), in which the first wire and the second wire are provided on the surface of the metal thin film.

Abstract: A method includes the following steps: S1, providing the insulating layer having an inclined face; S4, disposing a photomask so that in the photoresist, first and second exposure portions are exposed to light, and exposing the photoresist is to light through the photomask; S5, removing the first and the second exposure portions of the photoresist. On the assumption that in S4, light reflected at the metal thin film is focused between the first and the second exposure portions of the photoresist, the inclined face has a bending portion bending in one direction, the portion removed in S5 in the photoresist due to light focus being continuous with the first and the second exposure portions. The second exposure portion includes continuously an avoidance portion that avoids the bending portion and an overlapping portion that overlaps with at least a portion other than the bending portion in the inclined face.

Abstract: In a method for producing a wired circuit board includes a step (1), in which the insulating layer having an inclination face is provided; a step (2), in which a metal thin film is provided on the surface of the insulating layer including the inclination face; a step (3), in which a photoresist is provided on the surface of the metal thin film; a step (4), in which a photomask is disposed so that a first light exposure portion and a second light exposure portion in the photoresist are exposed to light, and the photoresist is exposed to light; a step (5), in which the first light exposure portion and the second light exposure portion are removed; and a step (6), in which the first wire and the second wire are provided on the surface of the metal thin film.

Abstract: A method of producing a wired circuit board including an insulating layer and a conductive pattern, including: (1), an insulating layer having an inclination face, (2), a metal thin film provided at least on the inclination face, (3), a photoresist provided on the surface of the metal thin film, (4), a light shield portion of a photomask disposed so that a first portion, where the conductive pattern is to be provided in the photoresist, is shielded from light, and the photoresist is exposed to light through the photomask, (5), the first portion of the photoresist is removed to expose the metal thin film corresponding to the first portion, and (6), the conductive pattern is provided on the surface of the metal thin film exposed from the photoresist.

Abstract: A method of producing a wired circuit board including an insulating layer and a conductive pattern, including: (1), an insulating layer having an inclination face, (2), a metal thin film provided at least on the inclination face, (3), a photoresist provided on the surface of the metal thin film, (4), a light shield portion of a photomask disposed so that a first portion, where the conductive pattern is to be provided in the photoresist, is shielded from light, and the photoresist is exposed to light through the photomask, (5), the first portion of the photoresist is removed to expose the metal thin film corresponding to the first portion, and (6), the conductive pattern is provided on the surface of the metal thin film exposed from the photoresist.

Abstract: A method for producing a wired circuit board includes a first step of preparing a metal supporting layer; a second step of forming an insulating layer having a first opening and terminal forming portions on the metal supporting layer; a third step of forming a conductor layer having terminal portions and an electrically conductive portion on the insulating layer; a fourth step of, by partially removing the metal supporting layer, forming a metal supporting frame portion, a metal supporting connecting portion, and a reinforcement metal supporting portion; and a fifth step of forming a metal plating layer at surfaces of the terminal portions by electrolytic plating via the metal supporting connecting portion.

Abstract: The suspension board with circuits can mount a slider and an electronic component, and includes a first insulating layer; a second insulating layer disposed on the first insulating layer; a third insulating layer disposed on the second insulating layer; a first conductive layer including an electronic component-connection terminal for electrically connecting with the electronic component, and a first wire disposed on the first insulating layer; a second conductive layer including a magnetic head-connection terminal for electrically connecting with a magnetic head provided in the slider, and a second wire, wherein at least a portion of the second wire is disposed on the second insulating layer. The suspension board with circuits has a pedestal supporting the slider. The pedestal includes the first insulating layer, second insulating layer, third insulating layer, and one of the first wire and second wire.

Abstract: On the suspension board with circuits, a slider can be mounted, and a pedestal that supports the slider is included. The pedestal includes a first insulating layer, a first metal layer disposed on the first insulating layer, a second insulating layer disposed on the first metal layer, and a second metal layer disposed on the second insulating layer, and a third insulating layer disposed on the second metal layer. At least one of the first metal layer and second metal layer includes a plurality of wires arranged in parallel in spaced apart relation from each other.

Abstract: A suspension board with circuit assembly sheet includes an assembly provided region provided with a plurality of suspension boards with circuits at spaced intervals to each other along one direction and a margin region provided at least at one side in a crossing direction with respect to the one direction of the assembly provided region. In the assembly provided region, a first opening portion is provided between the suspension boards with circuits that are adjacent to each other and in the margin region, a fragile portion is provided.

Abstract: A suspension board with circuit includes a metal supporting board, a conductor layer, a first insulating layer disposed between the metal supporting board and the conductor layer and having a first thickness, a second insulating layer having a second thickness in a portion disposed on the first insulating layer, and a pedestal disposed on the metal supporting board. The pedestal includes a first layer prepared from the same material as that of the first insulating layer and a second layer prepared from the same material as that of the second insulating layer. The thickness of the pedestal is different from any one of the first thickness, the second thickness, and the total sum of the first thickness and the second thickness.

Abstract: A suspension board with circuit includes a metal supporting board, a conductor layer having a terminal capable of being electrically connected to the piezoelectric element and disposed above the metal supporting board at spaced intervals thereto, a first insulating layer disposed between the metal supporting board and the conductor layer so as to support the conductor layer, and a second insulating layer disposed on the first insulating layer and the conductor layer so as to expose the terminal. The first insulating layer includes a first portion including the terminal viewed from a thickness direction of the metal supporting board and a second portion disposed in a position different from that of the first portion viewed from the thickness direction. The thickness of the first portion is thinner than that of the second portion.

Abstract: A read wiring trace and a write wiring trace are formed on an insulating layer. Connection terminals made of conductor are connected to the read wiring trace and the write wiring trace, respectively. Each connection terminal has at least one corner with a radius of curvature of not larger than 35 ?m.

Abstract: A method of producing a wired circuit board including an insulating layer and a conductive pattern, including: (1), an insulating layer having an inclination face, (2), a metal thin film provided at least on the inclination face, (3), a photoresist provided on the surface of the metal thin film, (4), a light shield portion of a photomask disposed so that a first portion, where the conductive pattern is to be provided in the photoresist, is shielded from light, and the photoresist is exposed to light through the photomask, (5), the first portion of the photoresist is removed to expose the metal thin film corresponding to the first portion, and (6), the conductive pattern is provided on the surface of the metal thin film exposed from the photoresist.

Abstract: A suspension board with circuit includes a first layer made of a metal supporting board, a second layer having insulating properties and provided at one side in a thickness direction of the first layer, and a third layer provided at one side in the thickness direction of the second layer and made of copper or a copper alloy. The first layer includes a first opening portion passing through in the thickness direction. The first opening portion is provided with a conductor layer that is, when projected in a direction orthogonal to the thickness direction, overlapped with the first layer. The conductor layer includes a first conductor circuit having a first electronic component-connecting terminal for being electrically connected to a first electronic component and made of copper or a copper alloy. The third layer includes a second conductor circuit having a second electronic component-connecting terminal for being electrically connected to a second electronic component.

Abstract: A suspension board with circuit includes one pair of pedestals. A pedestal conductive layer of one pedestal has a fan portion and a continuous portion. The pedestal conductive layer of the other pedestal has at least the fan portion. When the pedestal conductive layer of the other pedestal has only the fan portion, the pedestal supporting layer is disposed so as to be overlapped with the fan portion in the thickness direction in each of the pedestals and so as not to be overlapped with the continuous portion in the one pedestal and when the pedestal conductive layer of the other pedestal has the continuous portion, the pedestal supporting layer is disposed so as to be overlapped with the continuous portion or is disposed so as to be overlapped with the fan portion and so as not to be overlapped with the continuous portion in each of the pedestals.