Patents by Inventor Yoshito Inoue

Yoshito Inoue has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240170513
    Abstract: In a panel, a plurality of pixels and a circuit are connected to each other. In the panel, a cutting process with which connection between a defective pixel out of the plurality of pixels and the circuit is disconnected is performed, a protection film is formed in a cut groove of the cutting process, the protection film is formed by exposing the panel having undergone the cutting process to a gas of a protection material, and the protection film has a thickness of greater than or equal to 0.3 nm and smaller than or equal to 100 nm.
    Type: Application
    Filed: November 14, 2023
    Publication date: May 23, 2024
    Inventors: MASATO INOUE, YOSHITO SASAKI, DAIKI NAKAGAWA
  • Patent number: 4158417
    Abstract: Apparatus comprising a pair of endless conveyors arranged on an aligned line with a space therebetween, one of which runs intermittently and the other continuously; a lifter arranged between the conveyors to freely move up- and downwards; a gripper arranged above the lifter to freely close and open its claws; and a cutter arranged immediately below the gripper and attached freely swingable and integral to a cutter plate being freely movable in a direction perpendicular to the direction at which a cylindrical package is conveyed; wherein the front end of the package is brought and stopped above the lifter by means of the intermittently running conveyor; the front end of the package is a little lifted and pressed by the lifter against the claws of the gripper; the gripper closes its claws to grip the packaging material of the package at the upper side thereof and then to hang the package when the lifter returns to its original position; the tip of the cutter is horizontally thrust into the packaging material be
    Type: Grant
    Filed: October 18, 1976
    Date of Patent: June 19, 1979
    Assignee: Toyo Seikan Kaisha, Ltd.
    Inventor: Yoshito Inoue